Patents by Inventor Stephen R. Engle
Stephen R. Engle has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6655020Abstract: A chip carrier package that includes a cover plate attached to the stiffener by a reflowable bonding material is disclosed. Additionally, a thermally and electrically conductive bonding material between the cover plate and the chip itself may be included. Also a chip package including an alignment device to aid in properly aligning the cover plate on the stiffener is disclosed. Furthermore, a method of packaging a chip including providing a reflowable material between the cover plate and stiffener body for attaching the cover plate to the stiffener, and simultaneously attaching the cover plate to the stiffener with an attaching of the carrier to an electronic circuit board is disclosed.Type: GrantFiled: January 26, 2001Date of Patent: December 2, 2003Assignee: International Business Machines CorporationInventors: Timothy F. Carden, Glenn O. Dearing, Kishor V. Desai, Stephen R. Engle, Randall Stutzman, George H. Thiel
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Patent number: 6552266Abstract: A chip carrier package that includes a cover plate attached to the stiffener by a reflowable bonding material is disclosed. Additionally, a thermally and electrically conductive bonding material between the cover plate and the chip itself may be included. Also a chip package including an alignment device to aid in properly aligning the cover plate on the stiffener. Furthermore, a method of packaging a chip including providing a reflowable material between the cover plate and stiffener body for attaching the cover plate to the stiffener, and simultaneously attaching the cover plate to the stiffener with an attaching of the carrier to an electronic circuit board.Type: GrantFiled: January 26, 2001Date of Patent: April 22, 2003Assignee: International Business Machines CorporationInventors: Timothy F. Carden, Glenn O. Dearing, Kishor V. Desai, Stephen R. Engle, Randall Stutzman, George H. Thiel
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Patent number: 6552264Abstract: A chip carrier package that includes a cover plate attached to the stiffener by a reflowable bonding material is disclosed. Additionally, a thermally and electrically conductive bonding material between the cover plate and the chip itself may be included. Also a chip package including an alignment device to aid in properly aligning the cover plate on the stiffener. Furthermore, a method of packaging a chip including providing a reflowable material between the cover plate and stiffener body for attaching the cover plate to the stiffener, and simultaneously attaching the cover plate to the stiffener with an attaching of the carrier to an electronic circuit board.Type: GrantFiled: March 11, 1998Date of Patent: April 22, 2003Assignee: International Business Machines CorporationInventors: Timothy F. Carden, Glenn O. Dearing, Kishor V. Desai, Stephen R. Engle, Randall Stutzman, George H. Thiel
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Publication number: 20020053449Abstract: A chip carrier package that includes a cover plate attached to the stiffener by a reflowable bonding material is disclosed. Additionally, a thermally and electrically conductive bonding material between the cover plate and the chip itself may be included. Also a chip package including an alignment device to aid in properly aligning the cover plate on the stiffener is disclosed. Furthermore, a method of packaging a chip including providing a reflowable material between the cover plate and stiffener body for attaching the cover plate to the stiffener, and simultaneously attaching the cover plate to the stiffener with an attaching of the carrier to an electronic circuit board is disclosed.Type: ApplicationFiled: March 11, 1998Publication date: May 9, 2002Inventors: TIMOTHY F. CARDEN, GLENN O. DEARING, KISHOR V. DESAI, STEPHEN R. ENGLE, RANDALL STUTZMAN, GEORGE H. THIEL
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Publication number: 20010009196Abstract: A chip carrier package that includes a cover plate attached to the stiffener by a reflowable bonding material is disclosed. Additionally, a thermally and electrically conductive bonding material between the cover plate and the chip itself may be included. Also a chip package including an alignment device to aid in properly aligning the cover plate on the stiffener is disclosed. Furthermore, a method of packaging a chip including providing a reflowable material between the cover plate and stiffener body for attaching the cover plate to the stiffener, and simultaneously attaching the cover plate to the stiffener with an attaching of the carrier to an electronic circuit board is disclosed.Type: ApplicationFiled: January 26, 2001Publication date: July 26, 2001Inventors: Timothy F. Carden, Glenn O. Dearing, Kishor V. Desai, Stephen R. Engle, Randall Stutzman, George H. Thiel
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Publication number: 20010009197Abstract: A chip carrier package that includes a cover plate attached to the stiffener by a reflowable bonding material is disclosed. Additionally, a thermally and electrically conductive bonding material between the cover plate and the chip itself may be included. Also a chip package including an alignment device to aid in properly aligning the cover plate on the stiffener is disclosed. Furthermore, a method of packaging a chip including providing a reflowable material between the cover plate and stiffener body for attaching the cover plate to the stiffener, and simultaneously attaching the cover plate to the stiffener with an attaching of the carrier to an electronic circuit board is disclosed.Type: ApplicationFiled: January 26, 2001Publication date: July 26, 2001Inventors: Timothy F. Carden, Glenn O. Dearing, Kishor V. Desai, Stephen R. Engle, Randall Stutzman, George H. Thiel
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Patent number: 5572405Abstract: A thermally enhanced ball grid array package for electronic components, with an electronic and a plurality of ceramic component carriers bonded to a metal heat sink, enhances thermal performance, reduces solder ball fatigue and reduces stresses between the ceramic component carriers and the heat sink. Bonding the ceramic component carriers to the heat sink reduces expansion induced stresses of the solder balls on the carriers. Plural ceramic component carriers, smaller than a single carrier would have to be for the same package, reduce stresses at the interfaces between the ceramic component carriers and the heat sink.Type: GrantFiled: June 7, 1995Date of Patent: November 5, 1996Assignee: International Business Machines Corporation (IBM)Inventors: James W. Wilson, Stephen R. Engle, Scott P. Moore
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Patent number: 5243133Abstract: A ceramic chip carrier is disclosed which includes a ceramic substrate having a circuitized surface, at least one semiconductor chip mounted on the circuitized surface, and a lead frame or edge clip which is mechanically and electrically connected to contact pads on the circuitized surface. Each mechanical/electrical connection between the lead frame or edge clip and the contact pads includes a conventional solder connection. In addition, each such solder connection is at least partially encapsulated in a material, including an epoxy resin, which is chosen in relation to the solder connection to enable the solder connection to withstand a standard thermal fatigue test.Type: GrantFiled: February 18, 1992Date of Patent: September 7, 1993Assignee: International Business Machines, Inc.Inventors: Stephen R. Engle, Scott P. Moore, Mukund K. Saraiya
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Patent number: 4803100Abstract: A suspension of a coating material having hydrogen bonds and pre-determined physical and chemical characteristics in a predominantly solid state in a polar solvent that is capable of breaking the hydrogen bonds and providing the material in a liquid form and use of the suspension to provide substantially uniform conformal layer of material onto a workpiece by applying the suspension to a workpiece and then evaporating the polar organic solvent so that the coating material is provided in its predominantly solid state having substantially the predetermined physicall and chemical characteristics.Type: GrantFiled: October 21, 1987Date of Patent: February 7, 1989Assignee: International Business Machines CorporationInventors: Joseph G. Ameen, Timothy F. Carden, Lawrence R. Cutting, Stephen R. Engle, Ronald J. Moore