Patents by Inventor Stephen R. Howland

Stephen R. Howland has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Optical land grid array interposer
    Patent number: 6819813
    Abstract: An apparatus for integrating optical devices between a module and a circuit board comprising a carrier having optical waveguides, a module having optical ports on a surface of the module, the surface of the module connected to the carrier such that the optical waveguides are in communication with the optical ports; and a circuit board having optical ports on a surface of the circuit board, the surface of the circuit board connected to the carrier such that the optical waveguides are in communication with the optical ports. The apparatus may also integrate electrical ports on the surface of the module, the surface of the circuit board, and electrical connections on the carrier. The apparatus may also integrate circuit chips having optical ports for communication with the optical waveguides.
    Type: Grant
    Filed: September 11, 2002
    Date of Patent: November 16, 2004
    Assignee: International Business Machines Corporation
    Inventors: Stephen R. Howland, John U. Knickerbocker, Steven P. Ostrander, Martin L. Schmatz
  • Method for replacing an electrical net on a printed circuit board
    Patent number: 6705006
    Abstract: Electrical nets are prepared by bonding an electrically conductive element in a deleted plated via. The electrically conductive element has a headed portion that contacts the bottom of the laminate and the other end of the electrically conductive element electrically connects to a BGA pad or surface trace line.
    Type: Grant
    Filed: January 3, 2003
    Date of Patent: March 16, 2004
    Assignee: International Business Machines Corporation
    Inventors: Jeffrey C. Baechtle, Stephen R. Howland
  • Optical land grid array interposer
    Publication number: 20040047538
    Abstract: An apparatus for integrating optical devices between a module and a circuit board comprising a carrier having optical waveguides, a module having optical ports on a surface of the module, the surface of the module connected to the carrier such that the optical waveguides are in communication with the optical ports; and a circuit board having optical ports on a surface of the circuit board, the surface of the circuit board connected to the carrier such that the optical waveguides are in communication with the optical ports. The apparatus may also integrate electrical ports on the surface of the module, the surface of the circuit board, and electrical connections on the carrier. The apparatus may also integrate circuit chips having optical ports for communication with the optical waveguides.
    Type: Application
    Filed: September 11, 2002
    Publication date: March 11, 2004
    Applicant: International Business Machines Corporation
    Inventors: Stephen R. Howland, John U. Knickerbocker, Steven P. Ostrander, Martin L. Schmatz
  • Structure and method for replacing an electrical net
    Publication number: 20030102161
    Abstract: Electrical nets are prepared by bonding an electrically conductive element in a deleted plated via. The electrically conductive element has a headed portion that contacts the bottom of the laminate and the other end of the electrically conductive element electrically connects to a BGA pad or surface trace line.
    Type: Application
    Filed: January 3, 2003
    Publication date: June 5, 2003
    Applicant: International Business Machines Corporation
    Inventors: Jeffrey C. Baechtle, Stephen R. Howland
  • Circuit board having a through hole having an insulating material inside and a conductive element
    Patent number: 6518517
    Abstract: Electrical nets are prepared by bonding an electrically conductive element in a deleted plated via. The electrically conductive element has a headed portion that contacts the bottom of the laminate and the other end of the electrically conductive element electrically connects to a BGA pad or surface trace line.
    Type: Grant
    Filed: February 20, 2001
    Date of Patent: February 11, 2003
    Assignee: International Business Machines Corporation
    Inventors: Jeffrey C. Baechtle, Stephen R. Howland
  • Structure and method for replacing an electrical net
    Publication number: 20020112883
    Abstract: Electrical nets are prepared by bonding an electrically conductive element in a deleted plated via. The electrically conductive element has a headed portion that contacts the bottom of the laminate and the other end of the electrically conductive element electrically connects to a BGA pad or surface trace line.
    Type: Application
    Filed: February 20, 2001
    Publication date: August 22, 2002
    Applicant: International Business Machines Corporation
    Inventors: Jeffrey C. Baechtle, Stephen R. Howland