Patents by Inventor Stephen Robert Bannick

Stephen Robert Bannick has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11978987
    Abstract: 1. An inverter device is disclosed, including; an enclosure comprising a plurality of sides; an antenna port in a first side of the plurality of sides; and an antenna pass through module comprising: an exterior connector assembly comprising a plurality of pins and a base, wherein the plurality of pins are operable to be connected to respective ones of a plurality of antennas, wherein the plurality of pins passes through the antenna port to an exterior of the enclosure, wherein the base of the exterior connector assembly is sealed against the first side on an interior of the enclosure to provide ingress protection; and an interior antenna circuit configured to: terminate connections from a plurality of transceivers within the interior of the enclosure; and select antenna signals from at least the plurality of pins on the exterior connector assembly to route the plurality of transceivers.
    Type: Grant
    Filed: October 10, 2023
    Date of Patent: May 7, 2024
    Assignee: Lunar Energy, Inc.
    Inventors: Steven Nicholas Grolle, Peter H. J. How, Charles Ingalz, Stephen Robert Bannick, Andrew Diao, Mark Daniel Goldman
  • Patent number: 11968793
    Abstract: An insulating enclosure is disclosed, including: an opening in a side of the insulating enclosure, wherein the opening provides a conductor within a conduit passage into an interior of the insulating enclosure, wherein the conductor is to carry current from the inverter module, wherein a conductive sheath of the conduit is mechanically connected to the insulating enclosure via the opening; and a conductive liner, wherein the conductive liner provides a ground plane for components within the insulating enclosure, wherein the conductive liner covers at least a portion of the side of the insulating enclosure, and wherein the conductive liner is electrically connected to the conductive sheath of the conduit.
    Type: Grant
    Filed: October 10, 2023
    Date of Patent: April 23, 2024
    Assignee: Lunar Energy, Inc.
    Inventors: Stephen Robert Bannick, Peter H. J. How, Charles Ingalz, Christopher Breckenridge Todd, Mark Daniel Goldman
  • Publication number: 20240130064
    Abstract: A cover is disclosed, including: a first gasket that is placed along a portion of the cover that is to join with a heat sink; a second gasket that is placed around a cutout region of the cover, wherein the cover is configured to couple to a circuit board associated with the power module and expose a component on the circuit board through the cutout region; and a fastener that is configured to engage with the heat sink.
    Type: Application
    Filed: October 12, 2022
    Publication date: April 18, 2024
    Inventors: Kevin Richard Fine, Peter H.J. How, Charles Ingalz, Steven Nicholas Grolle, Stephen Robert Bannick
  • Publication number: 20240121908
    Abstract: An insulating enclosure is disclosed, including: an opening in a side of the insulating enclosure, wherein the opening provides a conductor within a conduit passage into an interior of the insulating enclosure, wherein the conductor is to carry current from the inverter module, wherein a conductive sheath of the conduit is mechanically connected to the insulating enclosure via the opening; and a conductive liner, wherein the conductive liner provides a ground plane for components within the insulating enclosure, wherein the conductive liner covers at least a portion of the side of the insulating enclosure, and wherein the conductive liner is electrically connected to the conductive sheath of the conduit.
    Type: Application
    Filed: October 10, 2023
    Publication date: April 11, 2024
    Inventors: Stephen Robert Bannick, Peter H.J. How, Charles Ingalz, Christopher Breckenridge Todd, Mark Daniel Goldman
  • Publication number: 20240121923
    Abstract: A system is including: an overmolded layer that is placed above a top surface and below a bottom surface of a circuit board, wherein the overmolded layer exposes at least communication interfaces on the circuit board and surrounds a heat generating component on the circuit board; a conductive layer that is placed over the overmolded layer on the top surface of the circuit board, wherein the conductive layer exposes the communication interfaces of the circuit board and covers the heat generating component on the circuit board; and wherein heat from the heat generating component is transferred into the conductive layer.
    Type: Application
    Filed: October 10, 2023
    Publication date: April 11, 2024
    Inventors: Steven Nicholas Grolle, Gargi Kailkhura, Peter H.J. How, Charles Ingalz, Andrew Diao, Stephen Robert Bannick
  • Publication number: 20240120694
    Abstract: 1. An inverter device is disclosed, including; an enclosure comprising a plurality of sides; an antenna port in a first side of the plurality of sides; and an antenna pass through module comprising: an exterior connector assembly comprising a plurality of pins and a base, wherein the plurality of pins are operable to be connected to respective ones of a plurality of antennas, wherein the plurality of pins passes through the antenna port to an exterior of the enclosure, wherein the base of the exterior connector assembly is sealed against the first side on an interior of the enclosure to provide ingress protection; and an interior antenna circuit configured to: terminate connections from a plurality of transceivers within the interior of the enclosure; and select antenna signals from at least the plurality of pins on the exterior connector assembly to route the plurality of transceivers.
    Type: Application
    Filed: October 10, 2023
    Publication date: April 11, 2024
    Inventors: Steven Nicholas Grolle, Peter H.J. How, Charles Ingalz, Stephen Robert Bannick, Andrew Diao, Mark Daniel Goldman