Patents by Inventor Stephen Ruatta

Stephen Ruatta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180340102
    Abstract: In accordance with the present invention, there are provided novel conductive adhesives and methods for the preparation thereof. In another aspect, the present invention provides novel conductive inks and methods for the preparation thereof. In yet another aspect, the present invention provides novel die attach films and methods for the preparation thereof. In still another aspect, the present invention provides novel die attach pastes and methods for the preparation thereof.
    Type: Application
    Filed: April 16, 2018
    Publication date: November 29, 2018
    Inventors: Stephen A. Ruatta, George Carson, Li Yao
  • Patent number: 9230888
    Abstract: A semiconductor assembly comprises a semiconductor wafer, an adhesive coating disposed on the back side of the wafer, and a bare dicing tape, preferably UV radiation transparent. The assembly is prepared by the method comprising (a) providing a semiconductor wafer, (b) disposing a wafer back side coating on the semiconductor wafer, (c) partially curing the wafer back side coating to the extent that it adheres to the back side of the wafer and remains tacky, and (d) contacting the bare dicing tape to the partially cured and tacky wafer back side coating, optionally with heat and pressure.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: January 5, 2016
    Assignee: Henkel IP & Holding GmbH
    Inventors: Gyanendra Dutt, Qizhuo Zhuo, Elizabeth Hoang, Stephen Ruatta
  • Publication number: 20140225283
    Abstract: A semiconductor assembly comprises a semiconductor wafer, an adhesive coating disposed on the back side of the wafer, and a bare dicing tape, preferably UV radiation transparent. The assembly is prepared by the method comprising (a) providing a semiconductor wafer, (b) disposing a wafer back side coating on the semiconductor wafer, (c) partially curing the wafer back side coating to the extent that it adheres to the back side of the wafer and remains tacky, and (d) contacting the bare dicing tape to the partially cured and tacky wafer back side coating, optionally with heat and pressure.
    Type: Application
    Filed: March 15, 2013
    Publication date: August 14, 2014
    Applicant: HENKEL CORPORATION
    Inventors: Gyanendra Dutt, Qizhuo Zhuo, Elizabeth Hoang, Stephen Ruatta
  • Patent number: 7569174
    Abstract: The invention relates to a method producing parts using laser sintering wherein a fusible powder is exposed to a plurality of laser scans at controlled energy levels and for time periods to melt and densify the powder and in the substantial absence of particle bonding outside the fusion boundary. Strength is improved up to 100% compared to previous methods. An example includes a relatively high energy initial scan to melt the powder followed by lower energy scans controlled to densify the melt and separated in time to dissipate heat to the surrounding part cake. The rate and extent to which the powder particles are fused together can be controlled so that each successive scan can be used to fuse the particles together in discreet incremental steps. As a result, the final dimensions of the part and its density and mechanical properties can be improved compared to conventional methods and part growth avoided.
    Type: Grant
    Filed: December 7, 2004
    Date of Patent: August 4, 2009
    Assignee: 3D Systems, Inc.
    Inventors: Stephen A. Ruatta, Khalil M. Moussa
  • Patent number: 7399796
    Abstract: A jettable non-curable support material composition useful for three-dimensional ink jet printing comprising at least one fatty alcohol and at least one abietic rosin ester alcohol, wherein the support material has a melting point between about 50° C. to about 65° C. and a freezing point between about 45° C. to about 55° C.
    Type: Grant
    Filed: June 17, 2004
    Date of Patent: July 15, 2008
    Assignee: 3D Systems, Inc.
    Inventors: Pingyong Xu, Stephen A. Ruatta, Kris Alan Schmidt, Vu A. Doan
  • Patent number: 7285237
    Abstract: A method for removing supports from a three-dimensional objected formed by selective deposition modeling. The three-dimensional object is formed from a curable phase change material and the supports are formed from a non-curable phase change material. The curable phase change material contains between about 5% to about 25% of a non-reactive wax in order to achieve the desired phase change characteristics of the material. When removing the supports with heat, discoloration undesirably occurs in the three-dimensional object as the non-reactive wax migrates within the object. The method prevents wax migration by cooling the object slowly past the freezing point of the build material such that a temperature differential no greater than about 5° C. is present within the object. With the preferred build material having a freezing point of about 49.5° C., this is achieved by lowering the temperature between about 62° C. to about 52° C.
    Type: Grant
    Filed: April 1, 2004
    Date of Patent: October 23, 2007
    Assignee: 3D Systems, Inc.
    Inventors: Kenneth J. Newell, Stephen A. Ruatta, John S. Stockwell
  • Patent number: 7176253
    Abstract: A jettable non-curable support material composition useful for three-dimensional ink jet printing comprising at least one fatty alcohol and at least one abietic rosin ester alcohol, wherein the support material has a melting point between about 50° C. to about 65° C. and a freezing point between about 45° C. to about 55° C.
    Type: Grant
    Filed: June 28, 2002
    Date of Patent: February 13, 2007
    Assignee: 3D Systems, Inc.
    Inventors: Pingyong Xu, Stephen A. Ruatta, Kris Alan Schmidt, Vu A. Doan
  • Patent number: 7118206
    Abstract: A method and apparatus for effectively removing gas bubbles in systems fed to ink-jetting devices. The system removes both small and large-scale gas bubbles from systems that feed materials to ink jet print heads.
    Type: Grant
    Filed: March 19, 2004
    Date of Patent: October 10, 2006
    Assignee: 3D Systems, Inc.
    Inventors: John S. Stockwell, Raymond Mathew Soliz, Stephen A. Ruatta, Jon Jody Fong
  • Publication number: 20060119012
    Abstract: The invention relates to a method producing parts using laser sintering wherein a fusible powder is exposed to a plurality of laser scans at controlled energy levels and for time periods to melt and densify the powder and in the substantial absence of particle bonding outside the fusion boundary. Strength is improved up to 100% compared to previous methods. An example includes a relatively high energy initial scan to melt the powder followed by lower energy scans controlled to densify the melt and separated in time to dissipate heat to the surrounding part cake. The rate and extent to which the powder particles are fused together can be controlled so that each successive scan can be used to fuse the particles together in discreet incremental steps. As a result, the final dimensions of the part and its density and mechanical properties can be improved compared to conventional methods and part growth avoided.
    Type: Application
    Filed: December 7, 2004
    Publication date: June 8, 2006
    Applicant: 3D Systems, Inc.
    Inventors: Stephen Ruatta, Khalil Moussa
  • Publication number: 20040242728
    Abstract: A jettable non-curable support material composition useful for three-dimensional ink jet printing comprising at least one fatty alcohol and at least one abietic rosin ester alcohol, wherein the support material has a melting point between about 50° C. to about 65° C. and a freezing point between about 45° C. to about 55° C.
    Type: Application
    Filed: June 17, 2004
    Publication date: December 2, 2004
    Applicant: 3D Systems, Inc.
    Inventors: Pingyong Xu, Stephen A. Ruatta, Kris Alan Schmidt, Vu A. Doan
  • Publication number: 20040183226
    Abstract: A method for removing supports from a three-dimensional objected formed by selective deposition modeling. The three-dimensional object is formed from a curable phase change material and the supports are formed from a non-curable phase change material. The curable phase change material contains between about 5% to about 25% of a non-reactive wax in order to achieve the desired phase change characteristics of the material. When removing the supports with heat, discoloration undesirably occurs in the three-dimensional object as the non-reactive wax migrates within the object. The method prevents wax migration by cooling the object slowly past the freezing point of the build material such that a temperature differential no greater than about 5° C. is present within the object. With the preferred build material having a freezing point of about 49.5° C., this is achieved by lowering the temperature between about 62° C. to about 52° C.
    Type: Application
    Filed: April 1, 2004
    Publication date: September 23, 2004
    Applicant: 3D Systems, Inc.
    Inventors: Kenneth J. Newell, Stephen A. Ruatta, John S. Stockwell
  • Patent number: 6752948
    Abstract: A method for removing supports from a three-dimensional objected formed by selective deposition modeling. The three-dimensional object is formed from a curable phase change material and the supports are formed from a non-curable phase change material. The curable phase change material contains between about 5% to about 25% of a non-reactive wax in order to achieve the desired phase change characteristics of the material. When removing the supports with heat, discoloration undesirably occurs in the three-dimensional object as the non-reactive wax migrates within the object. The method prevents wax migration by cooling the object slowly past the freezing point of the build material such that a temperature differential no greater than about 5° C. is present within the object. With the preferred build material having a freezing point of about 49.5° C., this is achieved by lowering the temperature between about 62° C. to about 52° C.
    Type: Grant
    Filed: October 3, 2001
    Date of Patent: June 22, 2004
    Assignee: 3D Systems, Inc.
    Inventors: Kenneth J. Newell, Stephen A. Ruatta, John S. Stockwell
  • Publication number: 20030100658
    Abstract: A jettable non-curable support material composition useful for three-dimensional ink jet printing comprising at least one fatty alcohol and at least one abietic rosin ester alcohol, wherein the support material has a melting point between about 50° C. to about 65° C. and a freezing point between about 45° C. to about 55° C.
    Type: Application
    Filed: June 28, 2002
    Publication date: May 29, 2003
    Applicant: 3D Systems, Inc.
    Inventors: Pingyong Xu, Stephen A. Ruatta, Kris Alan Schmidt, Vu A. Doan
  • Publication number: 20030085488
    Abstract: A method for removing supports from a three-dimensional objected formed by selective deposition modeling. The three-dimensional object is formed from a curable phase change material and the supports are formed from a non-curable phase change material. The curable phase change material contains between about 5% to about 25% of a non-reactive wax in order to achieve the desired phase change characteristics of the material. When removing the supports with heat, discoloration undesirably occurs in the three-dimensional object as the non-reactive wax migrates within the object. The method prevents wax migration by cooling the object slowly past the freezing point of the build material such that a temperature differential no greater than about 5° C. is present within the object. With the preferred build material having a freezing point of about 49.5° C., this is achieved by lowering the temperature between about 62° C. to about 52° C.
    Type: Application
    Filed: October 3, 2001
    Publication date: May 8, 2003
    Inventors: Kenneth J. Newell, Stephen A. Ruatta, John S. Stockwell