Patents by Inventor Stephen Ruatta
Stephen Ruatta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20180340102Abstract: In accordance with the present invention, there are provided novel conductive adhesives and methods for the preparation thereof. In another aspect, the present invention provides novel conductive inks and methods for the preparation thereof. In yet another aspect, the present invention provides novel die attach films and methods for the preparation thereof. In still another aspect, the present invention provides novel die attach pastes and methods for the preparation thereof.Type: ApplicationFiled: April 16, 2018Publication date: November 29, 2018Inventors: Stephen A. Ruatta, George Carson, Li Yao
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Patent number: 9230888Abstract: A semiconductor assembly comprises a semiconductor wafer, an adhesive coating disposed on the back side of the wafer, and a bare dicing tape, preferably UV radiation transparent. The assembly is prepared by the method comprising (a) providing a semiconductor wafer, (b) disposing a wafer back side coating on the semiconductor wafer, (c) partially curing the wafer back side coating to the extent that it adheres to the back side of the wafer and remains tacky, and (d) contacting the bare dicing tape to the partially cured and tacky wafer back side coating, optionally with heat and pressure.Type: GrantFiled: March 15, 2013Date of Patent: January 5, 2016Assignee: Henkel IP & Holding GmbHInventors: Gyanendra Dutt, Qizhuo Zhuo, Elizabeth Hoang, Stephen Ruatta
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Publication number: 20140225283Abstract: A semiconductor assembly comprises a semiconductor wafer, an adhesive coating disposed on the back side of the wafer, and a bare dicing tape, preferably UV radiation transparent. The assembly is prepared by the method comprising (a) providing a semiconductor wafer, (b) disposing a wafer back side coating on the semiconductor wafer, (c) partially curing the wafer back side coating to the extent that it adheres to the back side of the wafer and remains tacky, and (d) contacting the bare dicing tape to the partially cured and tacky wafer back side coating, optionally with heat and pressure.Type: ApplicationFiled: March 15, 2013Publication date: August 14, 2014Applicant: HENKEL CORPORATIONInventors: Gyanendra Dutt, Qizhuo Zhuo, Elizabeth Hoang, Stephen Ruatta
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Patent number: 7569174Abstract: The invention relates to a method producing parts using laser sintering wherein a fusible powder is exposed to a plurality of laser scans at controlled energy levels and for time periods to melt and densify the powder and in the substantial absence of particle bonding outside the fusion boundary. Strength is improved up to 100% compared to previous methods. An example includes a relatively high energy initial scan to melt the powder followed by lower energy scans controlled to densify the melt and separated in time to dissipate heat to the surrounding part cake. The rate and extent to which the powder particles are fused together can be controlled so that each successive scan can be used to fuse the particles together in discreet incremental steps. As a result, the final dimensions of the part and its density and mechanical properties can be improved compared to conventional methods and part growth avoided.Type: GrantFiled: December 7, 2004Date of Patent: August 4, 2009Assignee: 3D Systems, Inc.Inventors: Stephen A. Ruatta, Khalil M. Moussa
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Patent number: 7399796Abstract: A jettable non-curable support material composition useful for three-dimensional ink jet printing comprising at least one fatty alcohol and at least one abietic rosin ester alcohol, wherein the support material has a melting point between about 50° C. to about 65° C. and a freezing point between about 45° C. to about 55° C.Type: GrantFiled: June 17, 2004Date of Patent: July 15, 2008Assignee: 3D Systems, Inc.Inventors: Pingyong Xu, Stephen A. Ruatta, Kris Alan Schmidt, Vu A. Doan
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Patent number: 7285237Abstract: A method for removing supports from a three-dimensional objected formed by selective deposition modeling. The three-dimensional object is formed from a curable phase change material and the supports are formed from a non-curable phase change material. The curable phase change material contains between about 5% to about 25% of a non-reactive wax in order to achieve the desired phase change characteristics of the material. When removing the supports with heat, discoloration undesirably occurs in the three-dimensional object as the non-reactive wax migrates within the object. The method prevents wax migration by cooling the object slowly past the freezing point of the build material such that a temperature differential no greater than about 5° C. is present within the object. With the preferred build material having a freezing point of about 49.5° C., this is achieved by lowering the temperature between about 62° C. to about 52° C.Type: GrantFiled: April 1, 2004Date of Patent: October 23, 2007Assignee: 3D Systems, Inc.Inventors: Kenneth J. Newell, Stephen A. Ruatta, John S. Stockwell
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Patent number: 7176253Abstract: A jettable non-curable support material composition useful for three-dimensional ink jet printing comprising at least one fatty alcohol and at least one abietic rosin ester alcohol, wherein the support material has a melting point between about 50° C. to about 65° C. and a freezing point between about 45° C. to about 55° C.Type: GrantFiled: June 28, 2002Date of Patent: February 13, 2007Assignee: 3D Systems, Inc.Inventors: Pingyong Xu, Stephen A. Ruatta, Kris Alan Schmidt, Vu A. Doan
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Patent number: 7118206Abstract: A method and apparatus for effectively removing gas bubbles in systems fed to ink-jetting devices. The system removes both small and large-scale gas bubbles from systems that feed materials to ink jet print heads.Type: GrantFiled: March 19, 2004Date of Patent: October 10, 2006Assignee: 3D Systems, Inc.Inventors: John S. Stockwell, Raymond Mathew Soliz, Stephen A. Ruatta, Jon Jody Fong
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Publication number: 20060119012Abstract: The invention relates to a method producing parts using laser sintering wherein a fusible powder is exposed to a plurality of laser scans at controlled energy levels and for time periods to melt and densify the powder and in the substantial absence of particle bonding outside the fusion boundary. Strength is improved up to 100% compared to previous methods. An example includes a relatively high energy initial scan to melt the powder followed by lower energy scans controlled to densify the melt and separated in time to dissipate heat to the surrounding part cake. The rate and extent to which the powder particles are fused together can be controlled so that each successive scan can be used to fuse the particles together in discreet incremental steps. As a result, the final dimensions of the part and its density and mechanical properties can be improved compared to conventional methods and part growth avoided.Type: ApplicationFiled: December 7, 2004Publication date: June 8, 2006Applicant: 3D Systems, Inc.Inventors: Stephen Ruatta, Khalil Moussa
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Publication number: 20040242728Abstract: A jettable non-curable support material composition useful for three-dimensional ink jet printing comprising at least one fatty alcohol and at least one abietic rosin ester alcohol, wherein the support material has a melting point between about 50° C. to about 65° C. and a freezing point between about 45° C. to about 55° C.Type: ApplicationFiled: June 17, 2004Publication date: December 2, 2004Applicant: 3D Systems, Inc.Inventors: Pingyong Xu, Stephen A. Ruatta, Kris Alan Schmidt, Vu A. Doan
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Publication number: 20040183226Abstract: A method for removing supports from a three-dimensional objected formed by selective deposition modeling. The three-dimensional object is formed from a curable phase change material and the supports are formed from a non-curable phase change material. The curable phase change material contains between about 5% to about 25% of a non-reactive wax in order to achieve the desired phase change characteristics of the material. When removing the supports with heat, discoloration undesirably occurs in the three-dimensional object as the non-reactive wax migrates within the object. The method prevents wax migration by cooling the object slowly past the freezing point of the build material such that a temperature differential no greater than about 5° C. is present within the object. With the preferred build material having a freezing point of about 49.5° C., this is achieved by lowering the temperature between about 62° C. to about 52° C.Type: ApplicationFiled: April 1, 2004Publication date: September 23, 2004Applicant: 3D Systems, Inc.Inventors: Kenneth J. Newell, Stephen A. Ruatta, John S. Stockwell
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Patent number: 6752948Abstract: A method for removing supports from a three-dimensional objected formed by selective deposition modeling. The three-dimensional object is formed from a curable phase change material and the supports are formed from a non-curable phase change material. The curable phase change material contains between about 5% to about 25% of a non-reactive wax in order to achieve the desired phase change characteristics of the material. When removing the supports with heat, discoloration undesirably occurs in the three-dimensional object as the non-reactive wax migrates within the object. The method prevents wax migration by cooling the object slowly past the freezing point of the build material such that a temperature differential no greater than about 5° C. is present within the object. With the preferred build material having a freezing point of about 49.5° C., this is achieved by lowering the temperature between about 62° C. to about 52° C.Type: GrantFiled: October 3, 2001Date of Patent: June 22, 2004Assignee: 3D Systems, Inc.Inventors: Kenneth J. Newell, Stephen A. Ruatta, John S. Stockwell
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Publication number: 20030100658Abstract: A jettable non-curable support material composition useful for three-dimensional ink jet printing comprising at least one fatty alcohol and at least one abietic rosin ester alcohol, wherein the support material has a melting point between about 50° C. to about 65° C. and a freezing point between about 45° C. to about 55° C.Type: ApplicationFiled: June 28, 2002Publication date: May 29, 2003Applicant: 3D Systems, Inc.Inventors: Pingyong Xu, Stephen A. Ruatta, Kris Alan Schmidt, Vu A. Doan
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Publication number: 20030085488Abstract: A method for removing supports from a three-dimensional objected formed by selective deposition modeling. The three-dimensional object is formed from a curable phase change material and the supports are formed from a non-curable phase change material. The curable phase change material contains between about 5% to about 25% of a non-reactive wax in order to achieve the desired phase change characteristics of the material. When removing the supports with heat, discoloration undesirably occurs in the three-dimensional object as the non-reactive wax migrates within the object. The method prevents wax migration by cooling the object slowly past the freezing point of the build material such that a temperature differential no greater than about 5° C. is present within the object. With the preferred build material having a freezing point of about 49.5° C., this is achieved by lowering the temperature between about 62° C. to about 52° C.Type: ApplicationFiled: October 3, 2001Publication date: May 8, 2003Inventors: Kenneth J. Newell, Stephen A. Ruatta, John S. Stockwell