Abstract: Heat dissipating electronic components and circuitry in a communication chassis are cooled by moving air at least through a midplane, between two groups of channels that are perpendicularly oriented relative to one another. In an illustrative embodiment, channels of one group are oriented vertically while channels of another group are oriented horizontally. Each channel, regardless of whether it is vertical or horizontal, is defined by space in the chassis between adjacent circuit boards. Circuit boards on one side of the midplane are electrically connected to circuit boards on the other side of the midplane by orthogonal connectors on the midplane. The midplane additionally has openings that enable movement of air between vertically-oriented channels and horizontally-oriented channels. Circuit boards of the two orientations are cooled by increasing air pressure in vertically-oriented channels or by decreasing air pressure in horizontally-oriented channels or both, depending on the embodiment.

Abstract: Heat dissipating electronic components and circuitry in a communication chassis are cooled by moving air at least through a midplane, between two groups of channels that are laterally oriented relative to one another. In an illustrative embodiment, channels of one group are oriented vertically while channels of another group are oriented horizontally. Each channel, regardless of whether it is vertical or horizontal, is defined by space in the chassis between adjacent circuit boards. Circuit boards on one side of the midplane are electrically connected to circuit boards on the other side of the midplane by orthogonal connectors on the midplane. The midplane additionally has openings that enable movement of air between vertically-oriented channels and horizontally-oriented channels. Circuit boards of the two orientations are cooled by increasing air pressure in vertically-oriented channels or by decreasing air pressure in horizontally-oriented channels or both, depending on the embodiment.

Abstract: Heat dissipating electronic components and circuitry in a communication chassis are cooled by moving air at least through a midplane, between two groups of channels that are laterally oriented relative to one another. In an illustrative embodiment, channels of one group are oriented vertically while channels of another group are oriented horizontally. Each channel, regardless of whether it is vertical or horizontal, is defined by space in the chassis between adjacent circuit boards. Circuit boards on one side of the midplane are electrically connected to circuit boards on the other side of the midplane by orthogonal connectors on the midplane. The midplane additionally has openings that enable movement of air between vertically-oriented channels and horizontally-oriented channels. Circuit boards of the two orientations are cooled by increasing air pressure in vertically-oriented channels or by decreasing air pressure in horizontally-oriented channels or both, depending on the embodiment.

Abstract: An apparatus comprising a first plate having a plurality of v-shaped grooves to hold a set of optical fibers and a second plate having a v-shaped groove to hold a secondary optical fiber is disclosed. In one embodiment, the second plate being movable relative to the first plate, so that the secondary optical fiber can be selectively coupled to one of the optical fibers of the first set of optical fibers.

Abstract: An enclosure which acts as a heat sink for dissipating heat generated by electronic components within the housing. The outer surface of the enclosure includes numerous cooling fins, preferably on all six faces of the enclosure, to help dissipate heat. The fins are diagonally oriented, rather than vertical or horizontal, to permit them to be effective whether the unit is mounted horizontally or vertically. In addition to dissipating heat, the enclosure is rain tight, EMI-tight and ESD-tight. The inside major surfaces of the enclosure include a number of pins extending inwardly to help increase the surface area for heat transfer into the enclosure material. The pins extend deeply into the interior of the enclosure, and are made shorter only where necessary to avoid large components on the printed circuit card. The spaces between the pins allow convection of the heated air whether the enclosure is vertically or horizontally mounted.