Abstract: Systems and methods of testing integrated circuits independent of chip package configuration include or utilize a socket configured to receive a device under test (DUT), wherein the socket includes a plurality of input pins and a plurality of output pins, and wherein the DUT includes a plurality of device pins; a wireless communication device configured to wirelessly transmit information on the DUT to a server device operating a machine learning (ML) model, and wirelessly receive response data generated by the ML model from the server device, the response data including at least one of a pin configuration information of the DUT or a timing configuration information of the DUT; and a switch array configured to route respective ones of the plurality of device pins to corresponding ones of the plurality of output pins based on the response data.

Abstract: Systems and methods of testing integrated circuits independent of chip package configuration include or utilize a socket configured to receive a device under test (DUT), wherein the socket includes a plurality of input pins and a plurality of output pins, and wherein the DUT includes a plurality of device pins; a wireless communication device configured to wirelessly transmit information on the DUT to a server device operating a machine learning (ML) model, and wirelessly receive response data generated by the ML model from the server device, the response data including at least one of a pin configuration information of the DUT or a timing configuration information of the DUT; and a switch array configured to route respective ones of the plurality of device pins to corresponding ones of the plurality of output pins based on the response data.

Abstract: Systems and methods of testing integrated circuits independent of chip package configuration include or utilize a socket configured to receive a device under test (DUT), wherein the socket includes a plurality of input pins and a plurality of output pins, and wherein the DUT includes a plurality of device pins; a wireless communication device configured to wirelessly transmit information on the DUT to a server device operating a machine learning (ML) model, and wirelessly receive response data generated by the ML model from the server device, the response data including at least one of a pin configuration information of the DUT or a timing configuration information of the DUT; and a switch array configured to route respective ones of the plurality of device pins to corresponding ones of the plurality of output pins based on the response data.

Abstract: A method is disclosed for fabricating monocrystal material with the bandgap width exceeding 1.8 eV. The method comprises the steps of processing a monocrystal semiconductor wafer to develop a porous layer through electrolytic treatment of the wafer at direct current under UV-illumination, and epitaxially growing a monocrystal layer on said porous layer. Growth on porous layer produces semiconductor material with reduced stress and better characteristics than with the same material grown on non-porous layers and substrates. Also, semiconductor device structure comprising at least one layer of porous group III material is included.