Abstract: A semiconductor substrate is configured for dicing into separate die or individual semiconductor devices. The semiconductor substrate can comprise silicon, silicon carbide, or gallium nitride. A dicing grid bounds each semiconductor device on the semiconductor substrate. A die singulation process is configured to occur in the dicing grid. Material is coupled to the dicing grid. In one embodiment, the material can comprise carbon. A laser is configured to couple energy to the material coupled to the dicing grid. The energy from the laser heats the material. The heat from the material or the temperature differential between the material and the dicing creates a thermal shock that generates a vertical fracture in the semiconductor substrate that separates the semiconductor device from the remaining semiconductor substrate.

Abstract: A handheld device for use by a user or a consumer, that includes a custom application and is capable of interacting with its physical environment is disclosed. The device utilizes a positioning subsystem located in the device, and a priori or dynamic knowledge locations of stores, items and other geographic position markers. The devices assists the user in identifying and purchasing items of interest, in real time with relevant and timely location based information.

Abstract: A handheld device for use by a user or a consumer, that includes a custom application and is capable of interacting with its physical environment is disclosed. The device utilizes a positioning subsystem located in the device, and a priori or dynamic knowledge locations of stores, items and other geographic position markers. The devices assists the user in identifying and purchasing items of interest, in real time with relevant and timely location based information.