Abstract: A thermal gas flow sensor and method of forming such a sensor. The sensor has a substrate and a heater disposed on the substrate. At least one pair of thermal sensing elements is disposed on the substrate either side of the heater. A protective layer is disposed on at least the heater and/or the thermal sensing elements. The protective layer comprises a high temperature resistant polymer based layer which is preferably a fluoropolymer based layer. The protective layer can also cover interconnects and electrical connections also formed on the substrate so as to completely seal the sensor. A passivation layer, such as silicon nitride, can be disposed on the sensing and/or heating elements and optionally the interconnects and is arranged to interpose the protective layer and the substrate.

Abstract: A disposable pressure sensor system includes a disposable sensor assembly having at least one sensing element, carried on a housing or frame, and at least one electrical connector and/or mechanical connector for connecting the sensing element(s) to an external apparatus or device. The mechanical and/or electrical connectors are integrated in the housing or frame so that both the connector(s) and sensing element(s) are packaged in a single part. The assembly can be integrated in or attachable to a fluid carrying module, such as a dialysis cartridge, such that the sensing element(s) can sense the fluid in the module.

Abstract: A sensor package apparatus and method are disclosed in which a sensor die is provided and based on a substrate. An integrated circuit is generally associated with the sensor die. A leadframe is also provided, which is connected by at least one weld to the integrated circuit and the substrate. The integrated circuit, the leadframe, and the sensor die are configured in a flip-chip arrangement to protect the sensor die and form a sensor package apparatus that provides compact and robust electrical and physical connections thereof. The integrated circuit can be formed from, for example, silicon carbide. A metallization layer can also be formed on the integrated circuit, wherein the integrated circuit is configured upon the substrate of the sensor die. The metallization layer thus adheres to the integrated circuit via the weld(s).

Abstract: A plastic lead frame, electrical component system, and method using plastic-injection, plating, and known photolithography techniques are disclosed. The plastic lead frame and electrical component system operates with an integrated circuit, which functions as a sensor, such as an automotive gear tooth sensor. The plastic lead frame includes electrical contacts that serve as a linkage between the sensor and at least one electrical power source. In addition, the plastic lead frame may be constructed from granular or pelletized raw plastic or recycled components.

Abstract: A pressure sensor is constructed of a plastic package. The plastic package incorporates in the same material a sensing diaphragm including tensile and compression regions. Deposited on the diaphragm are metal electrodes and a polymer film having piezoresistive properties. The electrodes and/or the polymer film are directly printed onto the plastic package without the use of a mask.

Abstract: A torque sensor system and method. An automotive engine is located opposite a torque converter, such that a shaft extends from the engine and interacts with the torque converter. A target is located between the engine and torque converter. One or more torque sensors can be integrated with one or more position sensors for detecting a position associated with the shaft, wherein the torque sensor(s) and the position sensor(s) are integrated into a single torque sensor package to thereby provide enhanced sensing of the target in association with a rotation of shaft during an actuation of the engine.

Abstract: A sensor system for dialysis applications includes a plurality of pressure sensors, wherein each pressure sensor can be provided as an LC type sensor, and/or an RLC type sensor. Each sensor among the plurality of pressure sensors can be inductively coupled with a respective antenna among a plurality of antennas for the wireless transmission of pressure data. A dialysis machine is generally connected to the plurality of antennas, wherein the plurality of pressure sensors monitors pressure during operation of the dialysis machine to generate pressure data that is wirelessly transmitted to at least one antenna among the plurality of antennas.

Abstract: A torque sensor packaging system and method includes a torque member that includes one or more holes formed therein for receiving one or more respective fasteners associated with a sensing element. The sensing element can be connected to the torque member to the sensing element in order to transfer torque associated with the torque member to the sensing element for torque sensing operations thereof.

Abstract: A plastic lead frame with snap-together electrical connectors, electrical component system, and method using plastic-injection, plating, and known photolithography techniques is disclosed. The plastic lead frame and electrical component system operates with an integrated circuit, which functions as a sensor, such as a Hall-Effect sensor. The snap-together connectors allow interference joints to become electrical connections. Using a plastic lead frame, simple sensors may be electrically connected to the integrated circuit without a metal lead frame.

Abstract: A one piece needle and diaphragm system and method configured to measure in-cylinder pressure attributes is disclosed. The pressure monitoring diaphragm can also be configured to slide over the one piece needle and a housing assembly, thus eliminating an additional housing component and a welding operation from the current state of the art. Additionally, the one piece needle and diaphragm system can be used to measure both static and dynamic pressures in various combustion engine applications.

Abstract: A torque sensing system generally includes a torque sensor comprising a torque sensing element configured upon a substrate in association with an antenna for sending and receiving wireless signals. A plurality of electronic controlling components for controlling the torque sensor, wherein the electronic controlling components are configured upon another substrate in association with an antenna for sending and receiving the wireless signals to and from the torque sensor, such that the torque sensor is located on a rotating member in order to generate signals indicative of a torque associated with the rotating member, and wherein the signals are wirelessly transmittable from the torque the via the antenna configured upon the substrate in association with the torque sensor.

Abstract: A control system coupled to a pressure sensor calibrates the pressure sensor. The control system may measure a plurality of capacitance values at a plurality of corresponding applied voltages to compare the values with a first calibration mechanism generated by sample pressure sensors in a comparison. A final calibration mechanism may be generated by adjusting the first calibration mechanism in response to the comparison. The unknown differential pressure may be applied to a diaphragm of the pressure sensor. A capacitance value at the unknown differential pressure may then be measured. Using the final calibration mechanism, the differential pressure at the measured capacitance value may be retrieved.

Abstract: Packaging assembly method and systems include the use of a plastic substrate and one or more compliant fasteners, which can be connected to the plastic substrate, such that the compliant fastener provides an electrical connection to one or more electrical components. A plastic leadframe can therefore be formed, which is based upon the plastic substrate and the compliant fastener for attachment to other electrical components. The plastic substrate itself can function as a plastic trace or plastic substrate trace, and can be formed from plastic material such as thermoplastic or a thermoset material. The compliant fastener itself can be pushed into the plastic substrate at a connection point thereof for attachment of the compliant fastener to the plastic substrate. The connection point can be formed in the plastic substrate as one or more round holes, slots, rectangular holes or complex shapes. An interface is therefore for med between the plastic trace and the compliant fastener.

Abstract: A plastic substrate can be provided and thereafter a plurality of metal-to-metal connections can be ultrasonically bonded to the plastic substrate. One or more dies and a plurality of conductive components thereof can then be respectively connected to the metal-to-metal connections in order to provide a plastic leadframe package structure that includes electronic circuitry thereon. The plurality of conductive components can be configured as discrete components, while the die itself can be configured as a Flip Chip On Plastic Leadframe component. By utilizing plastic as the basis for a substrate and, ultrasonic bonding of the metal-to-metal connections, a complex substrate formed from plastic can provide a structure, particularly a plastic leadframe structure, that allows for the use of parts and components that are much less expensive than presently utilized parts and components.

Abstract: Packaging assembly methods and systems are disclosed. In general, a substrate can be provided upon which one or more sensing components can be configured and located. The substrate and the sensing components can then be sealed with a metalized plastic cover and a metalized plastic base in order to provide a barrier, which prevents moisture from migrating through the metalized plastic cover and the metalized plastic base and damaging the substrate and sensing components. Sealing may be implemented by soldering the metalized plastic cover to the metalized plastic base to provide a hermitically sealed barrier and EMC protection to said sensing components.

Abstract: High temperature sensor sleeve includes a sensor housing formed of low coefficient thermal expansion material for holding a sensing device, and a metal housing surrounding the sensor housing. The sensor housing provided in a sleeve-like configuration having inner/outer surfaces providing thermal insulation to sensors held within its center. A metal housing also formed in a sleeve-like configuration has inner and outer surfaces. The inner surface of the metal housing is fused with the outer surface of the sensor housing. The metal housing includes a mechanical interface for securing metal housing to a sensed system. The mechanical interface can include a threaded outer surface and an integrated metal flange formed in a hex nut-like configuration, the flange. The integrated metal flange enables mechanical insertion of the sensor sleeve into a system wherein a hole formed in the system includes complimentary threading for receiving the threaded outer surface of the metal housing.

Abstract: An apparatus and method for providing three-dimensional carrier mounting of one or more electronic components. In accordance with one embodiment, the device mounting apparatus of the present invention includes an elastically resilient plastic substrate having component mounting surfaces in at least two dimensions. At least one press-fit component insertion cavity is disposed within the component mounting surfaces to provide compressive retention of the electronic component when press-fit into the cavity. Preferably, the cavity has a depth such that when the component is press-fit, it does not extend above the surface plane of the cavity. The insertion cavity is further characterized as including at least one conductive trace disposed on an inner surface of said insertion cavity and positioned on the insertion cavity surface such that the conductive trace contacts at least one lead of the electronic device retained within the insertion cavity.

Abstract: A micro plasma sensor system having a glow discharge gap formed by electrodes. A fluid to be sensed may be brought into the vicinity of a discharge at the gap. Light from the discharge may be coupled to a spectrum analyzer and/or processor for determining properties of the fluid. A coupling may include a waveguide proximate to the discharge gap. Window cleanliness and electrode electrical isolation may be maintained by the discharge. The optical analyzer may have filters for one or more optical channels to detectors. The detectors may output electrical signals to be processed. The electrodes may be parallel to each other with a light waveguide between them. Or the electrodes may be concentric forming an annular discharge gap. The light waveguide may likewise be concentric to one or more electrodes. The waveguide may be one or more optical fibers, or tubular.

Abstract: Reel-to-reel manufacturing methods and systems are disclosed herein. In general, one or more plastic parts (e.g., plastic substrate) can be transported on a carrier for manufacturing of a final product based initially on the part or substrate. A reel-to-reel mechanism is provided comprising one or more reels associated with the carrier, such that the part can be spooled and unspoiled upon the one or more of the reels prior and subsequent to a performance of a manufacturing operation upon the part for the purpose of creating an electronic circuit. A plurality of manufacturing operations can then be subsequently upon the part utilizing the reel-to-reel mechanism to create a final electronic system based upon the part initially subject to the manufacturing operations.