Abstract: An electronic component assembly having thermal pads with thermal vias coupling an image sensor and a camera board fab is provided for heat dissipation. The electronic component assembly can include: a circuit board having at least one thermal pad disposed on a top surface of the circuit board; and an image sensor disposed on the top surface of the circuit board, having at least one conductive pad disposed at at least one corner of the image sensor. The at least one thermal pad is coupled to the at least one conductive pad of the image sensor and the at least one thermal pad is formed with a plurality of first thermal vias penetrating the thermal pad and the circuit board for transfer of heat of the image sensor.

Abstract: Systems, methods, and devices for imaging of stain-free fluorescence on western blot membranes with excitation by epi illumination with UV LEDs are disclosed herein. A method can include collecting and preparing a sample, separating the sample via gel electrophoresis in a gel block, transferring the separated sample from the gel block to an analysis block, generating an image of the sample with an imager, and evaluating the image of the sample. The imager can include a plane to receive and hold a block containing a sample and including a first side and a second side, a camera to image a sample on the plane and positioned above the first side of the plane, and an LED light source positioned above the first side of the plane. The LED light source can illuminate the sample on the plane via epi-illumination, and emits light having a wavelength in a range from approximately 325 nm to approximately 400 nm.

Abstract: The present relates to chromatic focusing via filter thickness tuning. Chromatic focusing can be achieved via an imaging system that includes a sample holding plane, a light source that illuminates the sample on the plane, and an imager that captures an image of the sample on the plane. The imager includes a sensor, a lens, and a filter wheel defining a plurality of filter apertures including a first aperture containing a first filter passing light of a first color and having a first focal point shift, and a second aperture containing a second filter passing light of a second color and having a second focal point shift. The focal point shifts cause both light of the first color passing through the first filter and through the lens and light of the second color passing through the second filter and through the lens to focus on the sensor.

Abstract: Systems and methods for contact imaging of stands with illumination are disclosed herein. A contact imaging system can include a contact imager. The contact imager can include a housing having a base and a lid. The lid can have a closed position against the base and an open position. The contact imager can include a contact area image sensor. The lid can shield the contact area image sensor from ambient light when the lid is in the closed position. The contact imager can include an illuminator that can illuminate at least a portion of a blot on the contact area image sensor when the lid is in the closed position.

Abstract: An electronic component assembly having thermal pads with thermal vias coupling an image sensor and a camera board fab is provided for heat dissipation. The electronic component assembly can include: a circuit board having at least one thermal pad disposed on a top surface of the circuit board; and an image sensor disposed on the top surface of the circuit board, having at least one conductive pad disposed at at least one corner of the image sensor. The at least one thermal pad is coupled to the at least one conductive pad of the image sensor and the at least one thermal pad is formed with a plurality of first thermal vias penetrating the thermal pad and the circuit board for transfer of heat of the image sensor.

Abstract: Systems and methods for contact imaging of stands with illumination are disclosed herein. A contact imaging system can include a contact imager. The contact imager can include a housing having a base and a lid. The lid can have a closed position against the base and an open position. The contact imager can include a contact area image sensor. The lid can shield the contact area image sensor from ambient light when the lid is in the closed position. The contact imager can include an illuminator that can illuminate at least a portion of a blot on the contact area image sensor when the lid is in the closed position.

Abstract: An electronic component assembly having thermal pads with thermal vias coupling an image sensor and a camera board fab is provided for heat dissipation. The electronic component assembly can include: a circuit board having at least one thermal pad disposed on a top surface of the circuit board; and an image sensor disposed on the top surface of the circuit board, having at least one conductive pad disposed at at least one corner of the image sensor. The at least one thermal pad is coupled to the at least one conductive pad of the image sensor and the at least one thermal pad is formed with a plurality of first thermal vias penetrating the thermal pad and the circuit board for transfer of heat of the image sensor.

Abstract: Aspects of the present disclosure relate to systems and methods for generating a composite image. This can include a western blot imager with a real time camera. One aspect of the present disclosure relates to an imaging system. The imaging system includes a sample plane that can receive and hold a sample, a photon resolving camera, and a lens attached to the photon resolving camera, the photon resolving camera and the lens positioned to image the sample plane.

Abstract: An electronic component assembly having thermal pads with thermal vias coupling an image sensor and a camera board fab is provided for heat dissipation. The electronic component assembly can include: a circuit board having at least one thermal pad disposed on a top surface of the circuit board; and an image sensor disposed on the top surface of the circuit board, having at least one conductive pad disposed at at least one corner of the image sensor. The at least one thermal pad is coupled to the at least one conductive pad of the image sensor and the at least one thermal pad is formed with a plurality of first thermal vias penetrating the thermal pad and the circuit board for transfer of heat of the image sensor.

Abstract: A method of image capture helps avoid saturation in digital imaging. In one implementation, the method includes capturing a first digital image of a target using an electronic array light sensor, and identifying one or more saturated pixels in the first digital image. The method further includes identifying a region of interest in the first digital image, the region of interest encompassing the one or more identified saturated pixels. The method also includes capturing a second digital image of the target using the electronic array light sensor. The second digital image encompasses only the region of interest, and the second digital image is captured with a shorter exposure time than the first digital image. The first and second digital images may be combined into a high dynamic range image. Systems for digital imaging may be based on complementary metal oxide semiconductor (CMOS) or charge coupled device (CCD) sensors.

Abstract: An imaging system including an illuminator apparatus or an epi-illumination apparatus that has LEDs for illuminations is provided for stain-free gel activation and fluorescent sample visualization. The illuminator apparatus includes a housing, a light source array disposed on at least one side surface of the housing and including at least one plurality of LEDs having each LED individually operable to output light of a predetermined color within a range of wavelengths, and a controller for controlling ranges of operational parameters of the at least one plurality of LEDs. The light emitted from the light source array incidents upon a sample having a gel that includes a product of UV light induced reaction between tryptophan and a haloalkane and the light emitted from the light source array includes ultraviolet (UV) light to excite a fluorescent response of the sample.

Abstract: An electronic component assembly having thermal pads with thermal vias coupling an image sensor and a camera board fab is provided for heat dissipation. The electronic component assembly can include: a circuit board having at least one thermal pad disposed on a top surface of the circuit board; and an image sensor disposed on the top surface of the circuit board, having at least one conductive pad disposed at at least one corner of the image sensor. The at least one thermal pad is coupled to the at least one conductive pad of the image sensor and the at least one thermal pad is formed with a plurality of first thermal vias penetrating the thermal pad and the circuit board for transfer of heat of the image sensor.

Abstract: A method of image capture helps avoid saturation in digital imaging. In one implementation, the method includes capturing a first digital image of a target using an electronic array light sensor, and identifying one or more saturated pixels in the first digital image. The method further includes identifying a region of interest in the first digital image, the region of interest encompassing the one or more identified saturated pixels. The method also includes capturing a second digital image of the target using the electronic array light sensor. The second digital image encompasses only the region of interest, and the second digital image is captured with a shorter exposure time than the first digital image. The first and second digital images may be combined into a high dynamic range image. Systems for digital imaging may be based on complementary metal oxide semiconductor (CMOS) or charge coupled device (CCD) sensors.