Patents by Inventor Stephen T Morley
Stephen T Morley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10490874Abstract: A board to board contactless interconnect system includes a first circuit board for launching at st one microwave signal into a cavity of a first waveguide secured thereto. A second waveguide, secured to a second circuit board, is coupleable to the first waveguide to receive the at least one microwave signal in a cavity of the second waveguide and conduct the at least one microwave signal onto a microwave receiver aligned with the cavity on the second circuit board. The waveguides may be separable and may include additional waveguides. Conductive gaskets with apertures for microwave signals to pass through are positioned between the waveguides and between each circuit board and a waveguide to prevent leakage of microwave energy therebetween. Some embodiments may pass signals through a sealed boundary and maintain integrity of the seal. Such embodiments may have a third waveguide interposed between the first and second waveguides.Type: GrantFiled: March 15, 2017Date of Patent: November 26, 2019Assignee: TE CONNECTIVITY CORPORATIONInventors: Graham Harry Smith, Jr., Stephen T. Morley, Hung Thai Nguyen, Michael Frank Cina
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Publication number: 20170271738Abstract: A board to board contactless interconnect system includes a first circuit board for launching at st one microwave signal into a cavity of a first waveguide secured thereto. A second waveguide, secured to a second circuit board, is coupleable to the first waveguide to receive the at least one microwave signal in a cavity of the second waveguide and conduct the at least one microwave signal onto a microwave receiver aligned with the cavity on the second circuit board. The waveguides may be separable and may include additional waveguides. Conductive gaskets with apertures for microwave signals to pass through are positioned between the waveguides and between each circuit board and a waveguide to prevent leakage of microwave energy therebetween. Some embodiments may pass signals through a sealed boundary and maintain integrity of the seal. Such embodiments may have a third waveguide interposed between the first and second waveguides.Type: ApplicationFiled: March 15, 2017Publication date: September 21, 2017Inventors: Graham Harry SMITH, JR., Stephen T. MORLEY, Hung Thai NGUYEN, Michael Frank CINA
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Patent number: 9160096Abstract: A connector assembly includes a shell, an insulator held by the shell and a center contact held by the insulator. The center contact has a terminating segment. The connector assembly also includes a compound dielectric surrounding the terminating segment. The compound dielectric is positioned between the terminating segment and the shell. The compound dielectric includes a first dielectric layer that at least partially surrounds the center contact. The compound dielectric also includes a second dielectric layer at least partially surrounding the first dielectric layer. The second dielectric layer has a different dielectric constant than the dielectric constant of the first layer.Type: GrantFiled: December 6, 2013Date of Patent: October 13, 2015Assignee: TYCO ELECTRONICS CORPORATIONInventor: Stephen T. Morley
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Publication number: 20150162696Abstract: A connector assembly includes a shell, an insulator held by the shell and a center contact held by the insulator. The center contact has a terminating segment. The connector assembly also includes a compound dielectric surrounding the terminating segment. The compound dielectric is positioned between the terminating segment and the shell. The compound dielectric includes a first dielectric layer that at least partially surrounds the center contact. The compound dielectric also includes a second dielectric layer at least partially surrounding the first dielectric layer. The second dielectric layer has a different dielectric constant than the dielectric constant of the first layer.Type: ApplicationFiled: December 6, 2013Publication date: June 11, 2015Applicant: Tyco Electronics CorporationInventor: Stephen T. Morley
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Publication number: 20140206221Abstract: An electrical connector system includes a backplane connector and a daughtercard connector coupled to the backplane connector. The backplane connector includes a housing holding a plurality of backplane contact assemblies that are movable relative to the housing and each have a center contact and an outer shell surrounding the center contact configured to be terminated to coaxial cables. The daughtercard connector includes a housing holding a plurality of daughtercard contact assemblies coupled to corresponding backplane contact assemblies. The daughtercard contact assemblies are configured to be directly terminated to a daughtercard circuit board.Type: ApplicationFiled: January 21, 2013Publication date: July 24, 2014Applicant: TYCO ELECTRONICS CORPORATIONInventor: Stephen T. Morley
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Patent number: 8360806Abstract: An RF module configured to be coupled to a backplane module includes a front housing that has walls that define connector cavities. The walls include a rear wall that has a plurality of openings therethrough. The connector cavities are open opposite the rear wall to receive electrical connectors. The RF module also includes RF cable assemblies having front end connectors and rear end connectors that are connected by corresponding cables. The front and rear end connectors are coaxial connectors. The front end connectors are received in corresponding connector cavities through corresponding openings. The RF module includes a connector holder extending from the front housing rearward of the rear wall. The connector holder holds the rear end connectors such that the rear end connectors are simultaneously pluggable into corresponding board connectors of the backplane module.Type: GrantFiled: December 22, 2010Date of Patent: January 29, 2013Assignee: Tyco Electronics CorporationInventors: Chong Hun Yi, Matthew R. McAlonis, Stephen T. Morley
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Publication number: 20120164878Abstract: An RF module configured to be coupled to a backplane module includes a front housing that has walls that define connector cavities. The walls include a rear wall that has a plurality of openings therethrough. The connector cavities are open opposite the rear wall to receive electrical connectors. The RF module also includes RF cable assemblies having front end connectors and rear end connectors that are connected by corresponding cables. The front and rear end connectors are coaxial connectors. The front end connectors are received in corresponding connector cavities through corresponding openings. The RF module includes a connector holder extending from the front housing rearward of the rear wall. The connector holder holds the rear end connectors such that the rear end connectors are simultaneously pluggable into corresponding board connectors of the backplane module.Type: ApplicationFiled: December 22, 2010Publication date: June 28, 2012Applicant: TYCO ELECTRONICS CORPORATIONInventors: CHONG HUN YI, MATTHEW R. MCALONIS, STEPHEN T. MORLEY
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Patent number: 7887335Abstract: An electronic system is disclosed for RF signals, and comprises coaxial interconnection systems for interconnection with a printed circuit board and which provides an interface with the printed circuit boards.Type: GrantFiled: April 13, 2009Date of Patent: February 15, 2011Assignee: Tyco Electronics CorporationInventor: Stephen T Morley
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Publication number: 20100261356Abstract: An electronic system is disclosed for RF signals, and comprises coaxial interconnection systems for interconnection with a printed circuit board and which provides an interface with the printed circuit boards.Type: ApplicationFiled: April 13, 2009Publication date: October 14, 2010Applicant: Tyco Electronics CorporationInventor: Stephen T. Morley
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Patent number: 7704077Abstract: A board to board connection system is disclosed for RF signals, and comprises coaxial interconnection systems which interconnect a daughter card to a backplane.Type: GrantFiled: April 13, 2009Date of Patent: April 27, 2010Assignee: Tyco Electronics CorporationInventor: Stephen T Morley