Abstract: The present invention encompasses a surface treatment composition which comprises a polyorganosiloxane fluid-silicone resin mixture and a carrier. The polyorganosiloxane fluid-silicone resin mixture comprises about 2% to about 95%, by weight of the mixture, of one or more polyorganosiloxane fluid compounds; from about 1% to about 10%, by weight of the mixture, of one or more silicone resin, a protonation agent, at least about 5%, by weight of the mixture; of water; and optionally, less than about 5%, by weight of the mixture, of an emulsifier.

Abstract: The present invention encompasses a surface treatment composition which comprises a polyorganosiloxane fluid-silicone resin mixture and a carrier. The polyorganosiloxane fluid-silicone resin mixture comprises about 50% to about 99.99% by weight of one or more polyorganosiloxane fluid compounds, at least 0.01% by weight of one or more silicone resin, and a maximum of 5% by weight of water.

Abstract: The present invention encompasses a surface treatment composition which comprises a polyorganosiloxane fluid-silicone resin mixture and a carrier. The polyorganosiloxane fluid-silicone resin mixture comprises about 50% to about 99.99% by weight of one or more polyorganosiloxane fluid compounds, at least 0.01% by weight of one or more silicone resin, and a maximum of 5% by weight of water.

Abstract: The present invention encompasses a surface treatment composition which comprises a polyorganosiloxane fluid-silicone resin mixture and a carrier. The polyorganosiloxane fluid-silicone resin mixture comprises about 2% to about 95%, by weight of the mixture, of one or more polyorganosiloxane fluid compounds; from about 1% to about 10%, by weight of the mixture, of one or more silicone resin, a protonation agent, at least about 5%, by weight of the mixture; of water; and optionally, less than about 5%, by weight of the mixture, of an emulsifier.

Abstract: The present invention encompasses a surface treatment composition which comprises a polyorganosiloxane fluid-silicone resin mixture and a carrier. The polyorganosiloxane fluid-silicone resin mixture comprises about 2% to about 95%, by weight of the mixture, of one or more polyorganosiloxane fluid compounds; from about 1% to about 10%, by weight of the mixture, of one or more silicone resin, a protonation agent, at least about 5%, by weight of the mixture; of water; and optionally, less than about 5%, by weight of the mixture, of an emulsifier.

Abstract: The present invention encompasses a surface treatment composition which comprises a polyorganosiloxane fluid-silicone resin mixture and a carrier. The polyorganosiloxane fluid-silicone resin mixture comprises about 50% to about 99.99% by weight of one or more polyorganosiloxane fluid compounds, at least 0.01% by weight of one or more silicone resin, and a maximum of 5% by weight of water.

Abstract: A package for semiconductor devices, and methods for making the same are provided. The package includes a low temperature co-fired ceramic body that has a plurality of conductive interconnect layers. The low temperature co-fired ceramic body includes at least one solder ball attach side. A plurality of solder ball attach pads are defined on the solder ball attach side(s) of the low temperature co-fired ceramic body. Each of the solder ball attach pads is in contact with a conductive via that is in electrical communication with at least one of the plurality of conductive interconnect layers, and each solder ball attach pad has metallic content that is limited to silver.