Abstract: A showerhead for processing a substrate comprises a backplate and a faceplate attached to the backplate. The faceplate comprises a first surface facing the backplate, a second surface opposite to the first surface, and a plurality of through holes extending between the first and second surfaces. At least one of the first and second surfaces is at least partially contoured.

Abstract: A system for supplying a gas to a plurality of stations of a substrate processing tool includes a gas source to supply the gas, a mass flow controller connected to the gas source, a plurality of conduits, and a plurality of heaters. The conduits are interconnected to each other and are in fluid communication with each other. The conduits include an inlet connected to the mass flow controller, a plurality of portions including a plurality of outlets, and a plurality of gas flow restrictors. The outlets are connected to respective manifolds to supply the gas to the stations. The gas flow restrictors are arranged in the respective portions of the plurality of conduits proximate to the outlets. The heaters are coupled to the respective portions of the conduits that are proximate to the outlets and that include the gas flow restrictors.

Abstract: A substrate support includes a monolithic anisotropic body, which includes first, second and intermediate layers. The first layer is formed of a first material and disposed therein are RF and clamping electrodes. The second layer is formed of the first material or a second material and disposed therein is a heating element. The intermediate layer is formed of a different material than the first and second layers, such that at least one of: a thermal energy conductivity of the intermediate layer is different than a thermal energy conductivity of at least one of the first or second materials; or an electrical energy conductivity of the intermediate layer is different than an electrical conductivity of at least one of the first or second materials. Either the intermediate layer is disposed between the first and second layers or the second layer is disposed between the first and intermediate layers.

Abstract: An ElectroStatic Chuck (ESC) including a chucking surface having at least a portion covered with a coating of silicon oxide (SiO2), silicon nitride (Si3N4) or a combination of both. The coating can be applied in situ a processing chamber of a substrate processing tool and periodically removed and re-applied in situ to create fresh coating.

Abstract: A substrate processing system for processing a substrate within a processing chamber includes a matching network, a tuning circuit, and a controller. The matching network receives a first RF signal having a first frequency from a RF generator and impedance matches an input of the matching network to an output of the RF generator. The tuning circuit is distinct from the matching network and includes a circuit component having a first impedance. The tuning circuit receives an output of the matching network and outputs a second RF signal to a first electrode in a substrate support. The controller determines a target impedance for the circuit component, and based on the target impedance, signal the RF generator to adjust the first frequency of the first RF signal received at the matching network to a second frequency to alter the first impedance of the circuit component to match the target impedance.

Abstract: An ElectroStatic Chuck (ESC) including a chucking surface having at least a portion covered with a coating of silicon oxide (SiO2), silicon nitride (Si3N4) or a combination of both. The coating can be applied in situ a processing chamber of a substrate processing tool and periodically removed and re-applied in situ to create fresh coating.

Abstract: An ElectroStatic Chuck (ESC) including a chucking surface having at least a portion covered with a coating of silicon oxide (SiO2), silicon nitride (Si3N4) or a combination of both. The coating can be applied in situ a processing chamber of a substrate processing tool and periodically removed and re-applied in situ to create fresh coating.