Patents by Inventor Stephen TOPPING

Stephen TOPPING has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250125169
    Abstract: Systems and techniques for determining and using multiple types of offsets for providing wafers to a transfer pedestal of a multi-station processing chamber are disclosed. Such techniques may be used to provide pedestal-specific offsets that may be selected based on which pedestal of a multi-station chamber is assigned to a particular wafer. Similar techniques may be used to provide wafer support-specific offsets based on which indexer arm of an indexer is assigned to a given wafer.
    Type: Application
    Filed: December 19, 2024
    Publication date: April 17, 2025
    Inventors: Stephen Topping, Dong Niu
  • Publication number: 20250054734
    Abstract: A showerhead for processing a substrate comprises a backplate and a faceplate attached to the backplate. The faceplate comprises a first surface facing the backplate, a second surface opposite to the first surface, and a plurality of through holes extending between the first and second surfaces. At least one of the first and second surfaces is at least partially contoured.
    Type: Application
    Filed: November 17, 2022
    Publication date: February 13, 2025
    Inventors: Bin LUO, Stephen TOPPING, Keith Joseph MARTIN, Weifeng CHENG, Yogesh BABBAR, Pramod SUBRAMONIUM
  • Patent number: 12217985
    Abstract: Systems and techniques for determining and using multiple types of offsets for providing wafers to a transfer pedestal of a multi-station processing chamber are disclosed. Such techniques may be used to provide pedestal-specific offsets that may be selected based on which pedestal of a multi-station chamber is assigned to a particular wafer. Similar techniques may be used to provide wafer support-specific offsets based on which indexer arm of an indexer is assigned to a given wafer.
    Type: Grant
    Filed: March 27, 2020
    Date of Patent: February 4, 2025
    Assignee: Lam Research Corporation
    Inventors: Stephen Topping, Dong Niu
  • Publication number: 20250038034
    Abstract: Electrostatic chuck (ESC) apparatuses and systems are provided. An ESC may have one or more chucking electrodes and a blocking electrode that surrounds the chucking electrodes. The blocking electrode may reduce non-uniformities in semiconductor processing operations performed with the ESC. In some implementations, the blocking electrode is positioned beneath the chucking electrodes.
    Type: Application
    Filed: January 24, 2023
    Publication date: January 30, 2025
    Inventors: Stephen Topping, Patrick G. Breiling, Sergey Georgiyevich Belostotskiy, Ramesh Chandrasekharan, Timothy Scott Thomas, Mahmoud Vahidi, Yukinori Sakiyama, David French, Meenakshi Mamunuru, Ashish Saurabh, Pramod Subramonium, Noah Elliot Baker
  • Publication number: 20240401202
    Abstract: A system for supplying a gas to a plurality of stations of a substrate processing tool includes a gas source to supply the gas, a mass flow controller connected to the gas source, a plurality of conduits, and a plurality of heaters. The conduits are interconnected to each other and are in fluid communication with each other. The conduits include an inlet connected to the mass flow controller, a plurality of portions including a plurality of outlets, and a plurality of gas flow restrictors. The outlets are connected to respective manifolds to supply the gas to the stations. The gas flow restrictors are arranged in the respective portions of the plurality of conduits proximate to the outlets. The heaters are coupled to the respective portions of the conduits that are proximate to the outlets and that include the gas flow restrictors.
    Type: Application
    Filed: September 15, 2022
    Publication date: December 5, 2024
    Inventors: Brian RATLIFF, Rohit ODE, Stephen TOPPING, Brian Joseph WILLIAMS, Rigel Martin BRUENING
  • Publication number: 20240213070
    Abstract: Rotational indexers are provided that allow for wafer-by-wafer centering to be performed in association with each wafer pedestal-to-pedestal transfer operation within a multi-station chamber. One such rotational indexer has a rotational center axis that is movable along one or more lateral directions in order to provide wafer centering capability; sealing arrangements with lateral movement capability are provided for such implementations. Another such rotational indexer uses additional rotational capability at the wafer supports of the indexer, in combination with deliberate off-center placement of the wafers on the wafer supports of the indexer, to provide wafer centering capability.
    Type: Application
    Filed: April 22, 2022
    Publication date: June 27, 2024
    Inventors: Brian Lewis Ratliff, Richard M. Blank, Stephen Topping, Karl Frederick Leeser
  • Publication number: 20240128062
    Abstract: A substrate support includes a monolithic anisotropic body, which includes first, second and intermediate layers. The first layer is formed of a first material and disposed therein are RF and clamping electrodes. The second layer is formed of the first material or a second material and disposed therein is a heating element. The intermediate layer is formed of a different material than the first and second layers, such that at least one of: a thermal energy conductivity of the intermediate layer is different than a thermal energy conductivity of at least one of the first or second materials; or an electrical energy conductivity of the intermediate layer is different than an electrical conductivity of at least one of the first or second materials. Either the intermediate layer is disposed between the first and second layers or the second layer is disposed between the first and intermediate layers.
    Type: Application
    Filed: October 20, 2020
    Publication date: April 18, 2024
    Inventors: Joel HOLLINGSWORTH, Ramkishan LINGAMPALLI, Karl LEESER, Stephen TOPPING, Noah Elliot BAKER
  • Publication number: 20240045344
    Abstract: An ElectroStatic Chuck (ESC) including a chucking surface having at least a portion covered with a coating of silicon oxide (SiO2), silicon nitride (Si3N4) or a combination of both. The coating can be applied in situ a processing chamber of a substrate processing tool and periodically removed and re-applied in situ to create fresh coating.
    Type: Application
    Filed: October 19, 2023
    Publication date: February 8, 2024
    Inventors: Stephen TOPPING, Vincent E. BURKHART
  • Patent number: 11835868
    Abstract: An ElectroStatic Chuck (ESC) including a chucking surface having at least a portion covered with a coating of silicon oxide (SiO2), silicon nitride (Si3N4) or a combination of both. The coating can be applied in situ a processing chamber of a substrate processing tool and periodically removed and re-applied in situ to create fresh coating.
    Type: Grant
    Filed: July 7, 2021
    Date of Patent: December 5, 2023
    Assignee: Lam Research Corporation
    Inventors: Stephen Topping, Vincent Burkhart
  • Publication number: 20230044064
    Abstract: Showerheads for semiconductor processing equipment are disclosed that include various features designed to reduce nonuniformity and adjust deposited film profiles.
    Type: Application
    Filed: December 10, 2020
    Publication date: February 9, 2023
    Inventors: Bin Luo, Andrew Geier Melton, Stephen Topping, John Michael Wiltse
  • Publication number: 20220375719
    Abstract: A substrate processing system for processing a substrate within a processing chamber includes a matching network, a tuning circuit, and a controller. The matching network receives a first RF signal having a first frequency from a RF generator and impedance matches an input of the matching network to an output of the RF generator. The tuning circuit is distinct from the matching network and includes a circuit component having a first impedance. The tuning circuit receives an output of the matching network and outputs a second RF signal to a first electrode in a substrate support. The controller determines a target impedance for the circuit component, and based on the target impedance, signal the RF generator to adjust the first frequency of the first RF signal received at the matching network to a second frequency to alter the first impedance of the circuit component to match the target impedance.
    Type: Application
    Filed: October 27, 2020
    Publication date: November 24, 2022
    Inventors: Stephen TOPPING, Karl Frederick LEESER, David FRENCH, Jin Jimmy WANG, Brandt HENRI
  • Publication number: 20220172967
    Abstract: Systems and techniques for determining and using multiple types of offsets for providing wafers to a transfer pedestal of a multi-station processing chamber are disclosed. Such techniques may be used to provide pedestal-specific offsets that may be selected based on which pedestal of a multi-station chamber is assigned to a particular wafer. Similar techniques may be used to provide wafer support-specific offsets based on which indexer arm of an indexer is assigned to a given wafer.
    Type: Application
    Filed: March 27, 2020
    Publication date: June 2, 2022
    Applicant: Lam Research Corporation
    Inventors: Stephen Topping, Dong Niu
  • Publication number: 20210333715
    Abstract: An ElectroStatic Chuck (ESC) including a chucking surface having at least a portion covered with a coating of silicon oxide (SiO2), silicon nitride (Si3N4) or a combination of both. The coating can be applied in situ a processing chamber of a substrate processing tool and periodically removed and re-applied in situ to create fresh coating.
    Type: Application
    Filed: July 7, 2021
    Publication date: October 28, 2021
    Inventors: Stephen TOPPING, Vincent BURKHART
  • Patent number: 11086233
    Abstract: An ElectroStatic Chuck (ESC) including a chucking surface having at least a portion covered with a coating of silicon oxide (SiO2), silicon nitride (Si3N4) or a combination of both. The coating can be applied in situ a processing chamber of a substrate processing tool and periodically removed and re-applied in situ to create fresh coating.
    Type: Grant
    Filed: March 20, 2018
    Date of Patent: August 10, 2021
    Assignee: Lam Research Corporation
    Inventors: Stephen Topping, Vincent Burkhart
  • Publication number: 20190294050
    Abstract: An ElectroStatic Chuck (ESC) including a chucking surface having at least a portion covered with a coating of silicon oxide (SiO2), silicon nitride (Si3N4) or a combination of both. The coating can be applied in situ a processing chamber of a substrate processing tool and periodically removed and re-applied in situ to create fresh coating.
    Type: Application
    Filed: March 20, 2018
    Publication date: September 26, 2019
    Inventors: Stephen TOPPING, Vincent BURKHART
  • Patent number: 6076950
    Abstract: An integrated lighting assembly (10) includes an injection molded housing that has a base (12) with first fastening elements (22) molded thereon, a cover (18) with second fastening elements (24) molded thereon, and a substrate (16) intermediate the base and cover. An electrical circuit (30) is formed on the substrate and a lighting element (32) is attached to the electrical circuit. A reflective cone (34, 36) surrounds the lighting element to intensify its light and direct light through a diffuser lens (28) formed on the base. A reflective wall (26) on the base reflects light emanating from the diffuser lens in a predetermined pattern. Metal for the reflective surface and electrical circuit is deposited in a single operation. The base and cover are connected to the substrate by living hinges. When the cover is folded onto the base, the first and second fastening elements snap together to form a three dimensional lighting assembly.
    Type: Grant
    Filed: October 5, 1998
    Date of Patent: June 20, 2000
    Assignee: Ford Global Technologies, Inc.
    Inventors: Mark Stephen Topping, Michael G. Todd, Mark Miller
  • Patent number: 6019271
    Abstract: A method for bonding together at least two conductive members 20, wherein each member includes at least one metallic 22 having a respective bonding area 24. At least one member has a deposition of metallic bonding material 26 attached to each respective conductor proximate each bonding area, and at least one member has a plastic element 28 attached thereto proximate each respective bonding area. The members 20 are positioned in a predetermined orientation, clamped together between an ultrasonic horn and anvil arrangement, with pressure and orthogonal ultrasonic energy being applied thereto so that each plastic element 28 is heated, which in turn melts the bonding material 26. Any plastic element material between the conductors is squeezed away therefrom and the respective conductors 22 are brought into proximity with each other so that a molten joint of bonding material physically contacts each respective conductor.
    Type: Grant
    Filed: July 11, 1997
    Date of Patent: February 1, 2000
    Assignee: Ford Motor Company
    Inventors: Brian John Hayden, Cuong Van Pham, Rosa Lynda Nuno, Mark Stephen Topping
  • Patent number: 5921460
    Abstract: A method of soldering materials by controlling ultrasonic energy to effect melting of only the solder in an assembly to be joined that is carried on a low temperature melting substrate.
    Type: Grant
    Filed: June 5, 1997
    Date of Patent: July 13, 1999
    Assignee: Ford Motor Company
    Inventors: Mark Stephen Topping, Cuong Van Pham, Brian John Hayden