Abstract: Techniques to buffer and present chunks are disclosed. In some embodiments, a first interface may receive chunks of a first cache line, and a second interface may receive chunks of a second cache line. A buffer may store chunks of the first cache line in a first chunk order and may store chunks of the second cache line in a second chunk order. A control unit may present a requester via the second interface with one or more chunks of the first cache line from the buffer.

Abstract: A method and apparatus for a driver layout is described. The layout includes an first number of gate lines arranged along a first axis and a second equal number of gates arranged along a second axis, such that the first set of gates lines is orthogonal to the second set of gates lines. The layout includes a total of N discrete transistors.

Abstract: A method and apparatus for a driver layout is described. The layout includes an first number of gate lines arranged along a first axis and a second equal number of gates arranged along a second axis, such that the first set of gates lines is orthogonal to the second set of gates lines. The layout includes a total of N discrete transistors.

Abstract: A device and method for servicing data requests from a processor or other input/output interface in a multi-processor environment by accessing a full or partial cache line of data. A system data chip is used to access the cache line of data using a bit pattern supplied by a system address chip. This access and transmission of data to the processor or the input/output interface is controlled by a control/status unit in the system data chip based on the value of control valid signals which include a first valid (DxV) signal and a second valid (CxV) signal. Also, data may be stored and retrieved in a first data format (linear chunk order) or a second data format (critical chunk order). When control by the control/status unit is based on the DxV signal value, a read of a data chunk may occur immediately after a write to temporary storage if the data is in the same chunk order and a merge or combination operation is not taking place.

Abstract: A device and method for servicing data requests from a processor or other input/output interface in a multi-processor environment by accessing a full or partial cache line of data. A system data chip is used to access the cache line of data using a bit pattern supplied by a system address chip. This access and transmission of data to the processor or the input/output interface is controlled by a control/status unit in the system data chip based on the value of control valid signals which include a first valid (DxV) signal and a second valid (CxV) signal. Also, data may be stored and retrieved in a first data format (linear chunk order) or a second data format (critical chunk order). When control by the control/status unit is based on the DxV signal value, a read of a data chunk may occur immediately after a write to temporary storage if the data is in the same chunk order and a merge or combination operation is not taking place.

Abstract: A method and apparatus for a driver layout is described. The layout includes an first number of gate lines arranged along a first axis and a second equal number of gates arranged along a second axis, such that the first set of gates lines is orthogonal to the second set of gates lines. The layout includes a total of N discrete transistors.

Abstract: An electronic circuit die is presented including a plurality of first and second input/output (I/O) pad buffer cells. The first I/O pad buffer cells include at least a latch for latching data signals received at a pad in the cell. Adjacent ones of these first I/O pad buffer cells are conductively coupled together using conductive trace pins. The second I/O pad buffer cells include a pad that receives clocking signal which are supplied to the latches of the first I/O pad buffer cells. Accordingly, data signals received at the pads of the die are latched in the pad as opposed to the core logic of the die. One benefit of providing the latching of data signals in the pad is that conductive traces between the latches and the core logic need not be precisely matched, thus reducing cost. Also, the first I/O pad buffer cells can be similarly constructed, thus reducing the complexity and cost of manufacture for the die.