Abstract: A modular capillary pump loop (CPL) cooling system and associated components. The modular CPL cooling system transfers heat from high-power circuit components, such as microprocessors disposed within computer chassis, to other locations within or external to the chassis, where the heat can be more easily removed. In various embodiments, the CPL cooling system includes one or more evaporators connected to one or more condensers via flexible liquid transport and vapor transport lines. A wicking structure, such as a volume of sintered copper, is disposed within each condenser. The wicking structure draws working fluid (e.g., water) in a liquid state into the evaporator based on a capillary mechanism and a pressure differential across a meniscus/vapor interface on an upper surface of the wicking structure. As the liquid meniscus is evaporated, additional fluid is drawn into the evaporator. The working fluid is then condensed back into a liquid in the condenser.

Abstract: The invention relates to a method and apparatus for producing aligned carbon nanotube thermal interface structures using batch and continuous manufacturing processes. In a batch process a capacitor is immersed in a bath containing a slurry of thermoplastic polymer containing randomly oriented carbon nanotubes and energized to create an electrical field to orient the carbon nanotubes prior to curing. In a continuous process, slurry carried by a conveyor receives the nanotube aligning electric field from capacitors positioned on both sides of the conveyor bearing the slurry.

Abstract: A cooling apparatus is provided with an electrostatic flow modifier to be complementarily positioned relative to a cooling fluid flow to modify at least one characteristic of the cooling fluid flow to enhance an amount of heat the cooling fluid flow removes from an electronic component.

Abstract: An electronic system includes a device and a controller to the device. The controller is adapted to calculate a temperature estimate of the device and to control access to the device in accordance with the calculated temperature estimate.

Abstract: A modular capillary pump loop (CPL) cooling system and associated components. The modular CPL cooling system transfers heat from high-power circuit components, such as microprocessors disposed within computer chassis, to other locations within or external to the chassis, where the heat can be more easily removed. In various embodiments, the CPL cooling system includes one or more evaporators connected to one or more condensers via flexible liquid transport and vapor transport lines. A wicking structure, such as a volume of sintered copper, is disposed within each condenser. The wicking structure draws working fluid (e.g., water) in a liquid state into the evaporator based on a capillary mechanism and a pressure differential across a meniscus/vapor interface on an upper surface of the wicking structure. As the liquid meniscus is evaporated, additional fluid is drawn into the evaporator. The working fluid is then condensed back into a liquid in the condenser.

Abstract: The invention relates to a process of forming a thermal interface that employs carbon nanotubes to reduce thermal resistance between an electronic device and a cooling solution. Bundles of aligned nanotubes receive injected polymeric material to produce a polymeric/carbon composite which is then placed between the electronic device and a heat sink or other cooling solution.

Abstract: The invention relates to a method and apparatus for producing aligned carbon nanotube thermal interface structures using batch and continuous manufacturing processes. In a batch process a capacitor is immersed in a bath containing a slurry of thermoplastic polymer containing randomly oriented carbon nanotubes and energized to create an electrical field to orient the carbon nanotubes prior to curing. In a continuous process, slurry carried by a conveyor receives the nanotube aligning electric field from capacitors positioned on both sides of the conveyor bearing the slurry.

Abstract: The invention relates to a structure of and a process of forming an integrated circuit package that utilizes a thermal interface material layer having an aligned array of carbon nanotubes affixed to a surface of the layer. The thermal interface material is diamond deposited by chemical vapor deposition. The carbon nanotubes are formed by a plasma discharge process on the surface of the CVDD and also may be formed on the surface of the die.

Abstract: An electronic system includes a device and a controller to the device. The controller is adapted to calculate a temperature estimate of the device and to control access to the device in accordance with the calculated temperature estimate.

Abstract: A method and apparatus for manufacturing a coupon of material having aligned carbon nanotubes. The coupon having aligned carbon nanotubes may be used as a thermal interface device in a packaged integrated circuit device.

Abstract: A computer system is described of the kind having a frame and a plurality of server unit subassemblies that are insertable into the frame. Each server unit subassembly has a chassis component which engages with a frame component on the frame. Heat can transfer from the chassis component to the frame component, but the server unit subassembly can still be moved out of the frame. In one embodiment, an air duct is located over a plurality of the frame components. Heat transfers from the frame components to air flowing through the duct. A modified capillary pumped loop is used to transfer heat from a processor of the server unit subassembly to thermal components on the frame.

Abstract: The invention relates to a structure of and a process of forming an integrated circuit package that utilizes a thermal interface material layer having an aligned array of carbon nanotubes affixed to a surface of the layer. The thermal interface material is diamond deposited by chemical vapor deposition. The carbon nanotubes are formed by a plasma discharge process on the surface of the CVDD and also may be formed on the surface of the die.

Abstract: A computer system is described of the kind having a frame and a plurality of server unit subassemblies that are insertable into the frame. Each server unit subassembly has a chassis component which engages with a frame component on the frame. Heat can transfer from the chassis component to the frame component, but the server unit subassembly can still be moved out of the frame. In one embodiment, an air duct is located over a plurality of the frame components. Heat transfers from the frame components to air flowing through the duct. A modified capillary pumped loop is used to transfer heat from a processor of the server unit subassembly to thermal components on the frame.

Abstract: A modular capillary pump loop (CPL) cooling system and associated components. The modular CPL cooling system transfers heat from high-power circuit components, such as microprocessors disposed within computer chassis, to other locations within or external to the chassis, where the heat can be more easily removed. In various embodiments, the CPL cooling system includes one or more evaporators connected to one or more condensers via flexible liquid transport and vapor transport lines. A wicking structure, such as a volume of sintered copper, is disposed within each condenser. The wicking structure draws working fluid (e.g., water) in a liquid state into the evaporator based on a capillary mechanism and a pressure differential across a meniscus/vapor interface on an upper surface of the wicking structure. As the liquid meniscus is evaporated, additional fluid is drawn into the evaporator. The working fluid is then condensed back into a liquid in the condenser.

Abstract: A modular capillary pump loop (CPL) cooling system and associated components. The modular CPL cooling system transfers heat from high-power circuit components, such as microprocessors disposed within computer chassis, to other locations within or external to the chassis, where the heat can be more easily removed. In various embodiments, the CPL cooling system includes one or more evaporators connected to one or more condensers via flexible liquid transport and vapor transport lines. A wicking structure, such as a volume of sintered copper, is disposed within each condenser. The wicking structure draws working fluid (e.g., water) in a liquid state into the evaporator based on a capillary mechanism and a pressure differential across a meniscus/vapor interface on an upper surface of the wicking structure. As the liquid meniscus is evaporated, additional fluid is drawn into the evaporator. The working fluid is then condensed back into a liquid in the condenser.

Abstract: A computer system is described of the kind having a frame and a plurality of server unit subassemblies that are insertable into the frame. Each server unit subassembly has a chassis component which engages with a frame component on the frame. Heat can transfer from the chassis component to the frame component, but the server unit subassembly can still be moved out of the frame. In one embodiment, an air duct is located over a plurality of the frame components. Heat transfers from the frame components to air flowing through the duct. A modified capillary pumped loop is used to transfer heat from a processor of the server unit subassembly to thermal components on the frame.

Abstract: A computer system is described of the kind having a frame and a plurality of server unit subassemblies that are insertable into the frame. Each server unit subassembly has a chassis component which engages with a frame component on the frame. Heat can transfer from the chassis component to the frame component, but the server unit subassembly can still be moved out of the frame. In one embodiment, an air duct is located over a plurality of the frame components. Heat transfers from the frame components to air flowing through the duct. A modified capillary pumped loop is used to transfer heat from a processor of the server unit subassembly to thermal components on the frame.

Abstract: The invention relates to a structure of and a process of forming an integrated circuit package that utilizes a thermal interface material layer having an aligned array of carbon nanotubes affixed to a surface of the layer. The thermal interface material is diamond deposited by chemical vapor deposition. The carbon nanotubes are formed by a plasma discharge process on the surface of the CVDD and also may be formed on the surface of the die.

Abstract: A computer system is described of the kind having a frame and a plurality of server unit subassemblies that are insertable into the frame. Each server unit subassembly has a chassis component which engages with a frame component on the frame. Heat can transfer from the chassis component to the frame component, but the server unit subassembly can still be moved out of the frame. In one embodiment, an air duct is located over a plurality of the frame components. Heat transfers from the frame components to air flowing through the duct. A modified capillary pumped loop is used to transfer heat from a processor of the server unit subassembly to thermal components on the frame.

Abstract: A computer system is described of the kind having a frame and a plurality of server unit subassemblies that are insertable into the frame. Each server unit subassembly has a chassis component which engages with a frame component on the frame. Heat can transfer from the chassis component to the frame component, but the server unit subassembly can still be moved out of the frame. In one embodiment, an air duct is located over a plurality of the frame components. Heat transfers from the frame components to air flowing through the duct. A modified capillary pumped loop is used to transfer heat from a processor of the server unit subassembly to thermal components on the frame.