Patents by Inventor Stephen W. Tang

Stephen W. Tang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210353408
    Abstract: A hybrid heart valve prosthesis that can be quickly and easily implanted during a surgical procedure is provided. The hybrid heart valve includes a substantially non-expandable, non-compressible prosthetic valve member having a peripheral sealing ring and an expandable stent frame projecting from an inflow end, thereby enabling attachment to the annulus without sutures. The stent frame may be plastically-expandable and may have a thin fabric layer covering its entirety as well as secondary sealing structures around its periphery to prevent paravalvular leaking. Other sealing solutions include interactive steps at the time of valve implant to establish seals around the stent and especially between the stent and the sealing ring of the valve member.
    Type: Application
    Filed: July 30, 2021
    Publication date: November 18, 2021
    Inventors: Harvey H. Chen, Son V. Nguyen, Devin D. Nguyen, Diana Marie George, August R. Yambao, Jyoti B. Rao, Alyssa E. Kornswiet, Lisong Ai, Stephen W. Tang, Edward Romero, Kevin K. Dang, Meena Francis, Louis A. Campbell, Grace Myong Kim
  • Publication number: 20210098531
    Abstract: Methods and apparatuses for a cross-point memory array and related fabrication techniques are described. The fabrication techniques described herein may facilitate concurrently building two or more decks of memory cells disposed in a cross-point architecture. Each deck of memory cells may include a plurality of first access lines (e.g., word lines), a plurality of second access lines (e.g., bit lines), and a memory component at each topological intersection of a first access line and a second access line. The fabrication technique may use a pattern of vias formed at a top layer of a composite stack, which may facilitate building a 3D memory array within the composite stack while using a reduced number of processing steps. The fabrication techniques may also be suitable for forming a socket region where the 3D memory array may be coupled with other components of a memory device.
    Type: Application
    Filed: October 6, 2020
    Publication date: April 1, 2021
    Inventors: Hernan A. Castro, Stephen H. Tang, Stephen W. Tang, Stephen W. Russell