Patents by Inventor Stephen Wai Ching Wong

Stephen Wai Ching Wong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package having an interfacial adhesive layer
    Patent number: 7445963
    Abstract: A semiconductor package has a substrate (8) and a semiconductor die (2). The substrate (8) includes a plurality of contact pads (9) on its upper surface and a second plurality of external contact areas (10) on its bottom surface. The semiconductor die (2) includes an active surface with a plurality of die contact pads (3) electrically connected by conducting means (4) to contact pads (9) on the substrate (8) and a layer of first adhesive means (5) on the upper surface (18) of the die (2). Mold material (15) covers the first adhesive means (5), the die (2) and the upper surface of the substrate (8).
    Type: Grant
    Filed: September 13, 2006
    Date of Patent: November 4, 2008
    Assignee: Infineon Technologies, AG
    Inventors: Wen Seng Ho, Stephen Wai Ching Wong