Abstract: A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat.

Abstract: To prevent debris from entering the volume between a dome and contacts of a dome switch, a dome can include a channel providing a remote path through which air can be vented. In particular, the channel can extend from the dome to a location within an electronic device that is known to be or expected to be contaminant free (e.g., a region of the device that does not include any interfaces communicating with the device environment). The channel can be defined from components of the dome switch including, for example, as a channel bound by spacer walls between a flex circuit and a film layer. The channel can include an opening for venting the dome switch. In some embodiments, the dome switch can include a protective film applied over the opening in the channel. The protective film can be selected to allow air to flow through, but to prevent contaminants or particles from reaching the channel opening.

Abstract: A cast metal part has a veneer made of cosmetic metal applied thereto so that the cast metal part has a cosmetic surface. A method for producing a cast metal part with a cosmetic surface comprises applying a veneer of cosmetic metal to a surface of the cast metal part. The cast metal part can be a die cast part, such as die cast aluminum or zinc. The veneer can be thin gauge highly cosmetic aluminum. The veneer of cosmetic metal can be applied to the surface of the cast metal part by placing the veneer into a casting mold used for forming the cast metal part, and casting molten metal onto the veneer in the casting mold. The veneer of cosmetic metal can also be applied to the surface of the cast metal part by solid-state welding, e.g., diffusion bonding, the veneer and the cast metal part together.

Abstract: A laminated window assembly for a device, such as a handheld electronic device (e.g., a media player or mobile telephone), includes a window layer that preferably is glass, and a larger, substantially transparent lip-forming layer to which it is laminated, preferably by a substantially clear adhesive. Additional adhesive preferably is placed at at least portions of the edge of the window layer adjacent the lip-forming layer, especially at the corners, to resist delamination. Holes preferably are formed in the lip—e.g., at the corners—to resist the lip-forming layer peeling apart from the window layer forming layer. The holes preferably make up at most about 33% of the periphery of the window layer.

Abstract: Thinned-portion substrates and processing of thinned-portion substrates is provided. A portion of a substrate, such as a mother glass used in touch screen manufacturing, can be thinned by forming a cavity in a surface of the substrate. Surface structures, such as touch sensing circuitry and/or display circuitry, can then be formed on the thinned portion of the substrate. For example, touch screen components can be formed as surface structures including touch sensing circuitry and display circuitry on one or more thinned substrate portions through processes including depositing, masking, etching, doping, etc. The thinned substrate portion, including the surface structures formed thereon, can then be detached from the surrounding thicker part of the substrate. In this way, for example, the surrounding thicker part of the substrate can provide structural integrity during various other manufacturing processes, while allowing surface structures to be formed directly on a thinner substrate.

Abstract: A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat.

Abstract: A Universal Serial Bus socket-equipped arrangement (USB-SEA) configured for mating with a Universal Serial Bus (USB) plug having a plug metal housing and an aperture disposed in the plug metal housing. The arrangement includes a plug-receiving cavity configured to receive the USB plug. The arrangement further includes a spring-loaded mechanism disposed within the plug-receiving cavity. The spring-loaded mechanism is biased toward an interior region of the plug-receiving cavity. The spring-loaded mechanism is also configured to slide along the connector metal housing of the USB plug when the USB plug is inserted into the plug-receiving cavity and to movably mate with the aperture disposed in the plug metal housing when the USB plug is in a terminal mating position with the USB socket assembly. The spring-loaded mechanism represents one of a spring-loaded ball and a spring-loaded pin.

Abstract: A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat.

Abstract: A Universal Serial Bus socket-equipped arrangement (USB-SEA) configured for mating with a Universal Serial Bus (USB) plug having a plug metal housing and an aperture disposed in the plug metal housing. The arrangement includes a plug-receiving cavity configured to receive the USB plug. The arrangement further includes a spring-loaded mechanism disposed within the plug-receiving cavity. The spring-loaded mechanism is biased toward an interior region of the plug-receiving cavity. The spring-loaded mechanism is also configured to slide along the connector metal housing of the USB plug when the USB plug is inserted into the plug-receiving cavity and to movably mate with the aperture disposed in the plug metal housing when the USB plug is in a terminal mating position with the USB socket assembly. The spring-loaded mechanism represents one of a spring-loaded ball and a spring-loaded pin.

Abstract: A Universal Serial Bus socket-equipped arrangement (USB-SEA) configured for mating with a Universal Serial Bus (USB) plug having a plug metal housing and an aperture disposed in the plug metal housing. The arrangement includes a plug-receiving cavity configured to receive the USB plug. The arrangement further includes a spring-loaded mechanism disposed within the plug-receiving cavity. The spring-loaded mechanism is biased toward an interior region of the plug-receiving cavity. The spring-loaded mechanism is also configured to slide along the connector metal housing of the USB plug when the USB plug is inserted into the plug-receiving cavity and to movably mate with the aperture disposed in the plug metal housing when the USB plug is in a terminal mating position with the USB socket assembly. The spring-loaded mechanism represents one of a spring-loaded ball and a spring-loaded pin.

Abstract: A computing device having an improved enclosure arrangement is disclosed. One aspect of the enclosure pertains to enclosure parts that are structurally bonded together to form a singular composite structure. In one embodiment, structural glue is used to bond at least two unique parts together. Another aspect of the enclosure pertains to enclosure parts that are electrically bonded together to form a singular integrated conductive member. In one embodiment, conductive paste is used to bond at least two unique parts together. The improved enclosure is particularly useful in portable computing devices such as laptop computers.

Abstract: A Universal Serial Bus socket-equipped arrangement (USB-SEA) configured for mating with a Universal Serial Bus (USB) plug having a plug metal housing and an aperture disposed in the plug metal housing. The arrangement includes a plug-receiving cavity configured to receive the USB plug. The arrangement further includes a spring-loaded mechanism disposed within the plug-receiving cavity. The spring-loaded mechanism is biased toward an interior region of the plug-receiving cavity. The spring-loaded mechanism is also configured to slide along the connector metal housing of the USB plug when the USB plug is inserted into the plug-receiving cavity and to movably mate with the aperture disposed in the plug metal housing when the USB plug is in a terminal mating position with the USB socket assembly. The spring-loaded mechanism represents one of a spring-loaded ball and a spring-loaded pin.

Abstract: This invention is directed to mechanical and electromagnetic shielding features of an electronic device case. An electronic device case is formed of two housings, each housing having integrated snaps, channels, or other retaining features used to secure the housings together. The housings additionally include integrated retaining features used to secure electronic components within the device case. The housings and retaining features are formed of amorphous metals or other materials with high elasticities. Because the retaining features necessary to assemble the case and secure the electronic components to the case form integral parts of the housings, no external retaining features are required to assemble the electronic device in the case.

Abstract: An electronic device for providing tactile feedback is provided. The electronic device may provide tactile feedback using any suitable approach, including for example vibration, heat, electrical, visual, or any other type of feedback. The electronic device may provide tactile feedback in response to detecting any particular status of the electronic device, receiving any particular input, or detecting any suitable communication received by the electronic device. For example, the electronic device may provide tactile feedback in response to identifying the current network of the device, the status of a particular electronic device component, or any other electronic device status. As another example, the electronic device may provide tactile feedback in response to receiving a particular type of communication, or in response to receiving a communication from a particular contact.

Abstract: An electronic device for providing tactile feedback is provided. The electronic device may provide tactile feedback using any suitable approach, including for example vibration, heat, electrical, visual, or any other type of feedback. The electronic device may provide tactile feedback in response to detecting any particular status of the electronic device, receiving any particular input, or detecting any suitable communication received by the electronic device. For example, the electronic device may provide tactile feedback in response to identifying the current network of the device, the status of a particular electronic device component, or any other electronic device status. As another example, the electronic device may provide tactile feedback in response to receiving a particular type of communication, or in response to receiving a communication from a particular contact.

Abstract: Parallel stacking mid-frame structural supports for use with a portable electronic device are presented including: a first side member; a second side member disposed substantially parallel to the first side member, the first member and the second member each configured with; a support feature for providing structural support when an applied load exceeding a predetermined threshold is exerted on the portable electronic device, and an attachment feature; a third side member mechanically contiguous with and disposed substantially perpendicular to the first side member; and a fourth side member mechanically contiguous with and disposed substantially perpendicular to the first side member. In some embodiments, the mid-frame structural support also includes: a first number of rib supports for supporting a printed circuit board (PCB), and a second number of rib supports for supporting the PCB. In some embodiments, the predetermined threshold is approximately 800 grams.

Abstract: A Universal Serial Bus socket-equipped arrangement (USB-SEA) configured for mating with a Universal Serial Bus (USB) plug having a plug metal housing and an aperture disposed in the plug metal housing. The arrangement includes a plug-receiving cavil configured to receive the USB plug. The arrangement further includes a spring-loaded mechanism disposed within the plug-receiving cavity. The spring-loaded mechanism is biased toward an interior region of the plug-receiving cavity. The spring-loaded mechanism is also configured to slide along the connector metal housing of the USB plug when the USB plug is inserted into the plug-receiving cavity and to movably mate with the aperture disposed in the plug metal housing when the USB plug is in a terminal mating position with the USB socket assembly. The spring-loaded mechanism represents one of a spring-loaded ball and a spring-loaded pin.

Abstract: The systems and methods described herein are directed to a switch for use in an electronic device. The switching assembly may include an elastically deformable actuator having a conductive inner surface and a cosmetic outer surface. The actuator may be disposed on an exterior surface of an enclosure that houses an electric circuit board of the electronic device. The enclosure may have one or more openings for providing an electrical connection between the actuator and the enclosed circuit of the electronic device. When the actuator is pressed, an electrical circuit may be closed and electric current may flow through the conductive inner surface of the actuator. The actuator may be combined with a perimeter element for snapping on and off the enclosure.

Abstract: This invention is directed to an electronic device with an embedded authentication system for restricting access to device resources. The authentication system may include one or more sensors operative to detect biometric information of a user. The sensors may be positioned in the device such that the sensors may detect appropriate biometric information as the user operates the device, without requiring the user to perform a step for providing the biometric information (e.g., embedding a fingerprint sensor in an input mechanism instead of providing a fingerprint sensor in a separate part of the device housing). In some embodiments, the authentication system may be operative to detect a visual or temporal pattern of inputs to authenticate a user. In response to authenticating, a user may access restricted files, applications (e.g., applications purchased by the user), or settings (e.g., application settings such as contacts or saved game profile).