Patents by Inventor Stephen Zee
Stephen Zee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8298847Abstract: Embodiments of MEMS devices include support structures having substantially vertical sidewalls. Certain support structures are formed through deposition of self-planarizing materials or via a plating process. Other support structures are formed via a spacer etch. Other MEMS devices include support structures at least partially underlying a movable layer, where the portions of the support structures underlying the movable layer include a convex sidewall. In further embodiments, a portion of the support structure extends through an aperture in the movable layer and over at least a portion of the movable layer.Type: GrantFiled: April 23, 2010Date of Patent: October 30, 2012Assignee: QUALCOMM MEMS Technologies, Inc.Inventors: Lior Kogut, Chun-Ming Wang, Chengbin Qui, Stephen Zee, Fan Zhong
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Patent number: 8270062Abstract: In certain embodiments, a device is provided including a substrate and a plurality of supports over the substrate. The device may further include a mechanical layer having a movable portion and a stationary portion. The stationary portion may disposed over the supports. In certain embodiments, the device further includes a reflective surface positioned over the substrate and mechanically coupled to the movable portion. The device of certain embodiments further includes at least one movable stop element displaced from and mechanically coupled to the movable portion. In certain embodiments, the at least a portion of the stop element may be positioned over the stationary portion.Type: GrantFiled: September 17, 2009Date of Patent: September 18, 2012Assignee: QUALCOMM MEMS Technologies, Inc.Inventors: Manish Kothari, Sauri Gudlavalleti, Stephen Zee
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Publication number: 20120086998Abstract: Described herein is the use of a diffusion barrier layer between metallic layers in MEMS devices. The diffusion barrier layer prevents mixing of the two metals, which can alter desired physical characteristics and complicate processing. In one example, the diffusion barrier layer may be used as part of a movable reflective structure in interferometric modulators.Type: ApplicationFiled: December 13, 2011Publication date: April 12, 2012Applicant: QUALCOMM MEMS Technologies, Inc.Inventors: Hsin-Fu Wang, Ming-Hau Tung, Stephen Zee
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Patent number: 8097174Abstract: A microelectromechanical systems device having an electrical interconnect connected to at least one of an electrode and a movable layer within the device. At least a portion of the electrical interconnect is formed from the same material as a movable layer of the device. A thin film, particularly formed of molybdenum, is provided underneath the electrical interconnect. The movable layer preferably comprises aluminum.Type: GrantFiled: April 21, 2010Date of Patent: January 17, 2012Assignee: QUALCOMM MEMS Technologies, Inc.Inventors: Wonsuk Chung, SuryaPrakash Ganti, Stephen Zee
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Patent number: 8085458Abstract: Described herein is the use of a diffusion barrier layer between metallic layers in MEMS devices. The diffusion barrier layer prevents mixing of the two metals, which can alter desired physical characteristics and complicate processing. In one example, the diffusion barrier layer may be used as part of a movable reflective structure in interferometric modulators.Type: GrantFiled: November 6, 2009Date of Patent: December 27, 2011Assignee: QUALCOMM MEMS Technologies, Inc.Inventors: Hsin-Fu Wang, Ming-Hau Tung, Stephen Zee
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Publication number: 20110063712Abstract: In certain embodiments, a device is provided including a substrate and a plurality of supports over the substrate. The device may further include a mechanical layer having a movable portion and a stationary portion. The stationary portion may disposed over the supports. In certain embodiments, the device further includes a reflective surface positioned over the substrate and mechanically coupled to the movable portion. The device of certain embodiments further includes at least one movable stop element displaced from and mechanically coupled to the movable portion. In certain embodiments, the at least a portion of the stop element may be positioned over the stationary portion.Type: ApplicationFiled: September 17, 2009Publication date: March 17, 2011Applicant: QUALCOMM MEMS Technologies, Inc.Inventors: Manish Kothari, Sauri Gudlavalleti, Stephen Zee
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Publication number: 20100202039Abstract: Embodiments of MEMS devices include support structures having substantially vertical sidewalls. Certain support structures are formed through deposition of self-planarizing materials or via a plating process. Other support structures are formed via a spacer etch. Other MEMS devices include support structures at least partially underlying a movable layer, where the portions of the support structures underlying the movable layer include a convex sidewall. In further embodiments, a portion of the support structure extends through an aperture in the movable layer and over at least a portion of the movable layer.Type: ApplicationFiled: April 23, 2010Publication date: August 12, 2010Applicant: QUALCOMM MEMS Technologies, Inc.Inventors: Lior Kogut, Chengbin Qiu, Chun-Ming Wang, Stephen Zee, Fan Zhong
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Publication number: 20100202038Abstract: A microelectromechanical systems device having an electrical interconnect connected to at least one of an electrode and a movable layer within the device. At least a portion of the electrical interconnect is formed from the same material as a movable layer of the device. A thin film, particularly formed of molybdenum, is provided underneath the electrical interconnect. The movable layer preferably comprises aluminum.Type: ApplicationFiled: April 21, 2010Publication date: August 12, 2010Applicant: QUALCOMM MEMS Technologies, Inc.Inventors: Wonsuk Chung, SuryaPrakash Ganti, Stephen Zee
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Patent number: 7706042Abstract: A microelectromechanical systems device having an electrical interconnect connected to at least one of an electrode and a movable layer within the device. At least a portion of the electrical interconnect is formed from the same material as a movable layer of the device. A thin film, particularly formed of molybdenum, is provided underneath the electrical interconnect. The movable layer preferably comprises aluminum.Type: GrantFiled: December 20, 2006Date of Patent: April 27, 2010Assignee: QUALCOMM MEMS Technologies, Inc.Inventors: Wonsuk Chung, SuryaPrakash Ganti, Stephen Zee
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Patent number: 7704773Abstract: Embodiments of MEMS devices include support structures having substantially vertical sidewalls. Certain support structures are formed through deposition of self-planarizing materials or via a plating process. Other support structures are formed via a spacer etch. Other MEMS devices include support structures at least partially underlying a movable layer, where the portions of the support structures underlying the movable layer include a convex sidewall. In further embodiments, a portion of the support structure extends through an aperture in the movable layer and over at least a portion of the movable layer.Type: GrantFiled: August 18, 2006Date of Patent: April 27, 2010Assignee: QUALCOMM MEMS Technologies, Inc.Inventors: Lior Kogut, Chengbin Qiu, Chun-Ming Wang, Stephen Zee, Fan Zhong
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Publication number: 20100046058Abstract: Described herein is the use of a diffusion barrier layer between metallic layers in MEMS devices. The diffusion barrier layer prevents mixing of the two metals, which can alter desired physical characteristics and complicate processing. In one example, the diffusion barrier layer may be used as part of a movable reflective structure in interferometric modulators.Type: ApplicationFiled: November 6, 2009Publication date: February 25, 2010Applicant: QUALCOMM MEMS Technologies, Inc.Inventors: Hsin-Fu Wang, Ming-Hau Tung, Stephen Zee
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Patent number: 7660058Abstract: Certain MEMS devices include layers patterned to have tapered edges. One method for forming layers having tapered edges includes the use of an etch leading layer. Another method for forming layers having tapered edges includes the deposition of a layer in which the upper portion is etchable at a faster rate than the lower portion. Another method for forming layers having tapered edges includes the use of multiple iterative etches. Another method for forming layers having tapered edges includes the use of a liftoff mask layer having an aperture including a negative angle, such that a layer can be deposited over the liftoff mask layer and the mask layer removed, leaving a structure having tapered edges.Type: GrantFiled: August 18, 2006Date of Patent: February 9, 2010Assignee: QUALCOMM MEMS Technologies, Inc.Inventors: Chengbin Qiu, Teruo Sasagawa, Ming-Hau Tung, Chun-Ming Wang, Stephen Zee
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Patent number: 7652814Abstract: MEMS devices are fabricated by a method that involves forming an optical element (e.g., etalon) over a substrate and then forming a light modulating element (e.g., interferometric modulator) over the optical element. In an embodiment, a support structure for the light modulating element is aligned with the underlying optical element to thereby alter the appearance of the support structure to a viewer. Such an optical element is separated from the support structure by one or more buffer layers.Type: GrantFiled: January 23, 2007Date of Patent: January 26, 2010Assignee: QUALCOMM MEMS Technologies, Inc.Inventors: Fan Zhong, Chun-Ming Wang, Stephen Zee
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Patent number: 7630114Abstract: Described herein is the use of a diffusion barrier layer between metallic layers in MEMS devices. The diffusion barrier layer prevents mixing of the two metals, which can alter desired physical characteristics and complicate processing. In one example, the diffusion barrier layer may be used as part of a movable reflective structure in interferometric modulators.Type: GrantFiled: October 28, 2005Date of Patent: December 8, 2009Assignee: IDC, LLCInventors: Hsin-Fu Wang, Ming-Hau Tung, Stephen Zee
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Patent number: 7601571Abstract: A modulator has a transparent substrate with a first surface. At least one interferometric modulator element resides on the first surface. At least one thin film circuit component electrically connected to the element resides on the surface. When more than one interferometric element resides on the first surface, there is at least one thin film circuit component corresponding to each element residing on the first surface. A method of manufacturing interferometric modulators with thin film transistors is also disclosed.Type: GrantFiled: August 10, 2007Date of Patent: October 13, 2009Assignee: IDC, LLCInventors: Clarence Chui, Stephen Zee
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Patent number: 7580172Abstract: A microelectromechanical systems device having an electrical interconnect between circuitry outside the device and at least one of an electrode and a movable layer within the device. At least a portion of the electrical interconnect is formed from the same material as a conductive layer between the electrode and a mechanical layer of the device. In an embodiment, this conductive layer is a sacrificial layer that is subsequently removed to form a cavity between the electrode and the movable layer. The sacrificial layer is preferably formed of molybdenum, doped silicon, tungsten, or titanium. According to another embodiment, the conductive layer is a movable reflective layer that preferably comprises aluminum.Type: GrantFiled: September 29, 2006Date of Patent: August 25, 2009Assignee: Qualcomm Mems Technologies, Inc.Inventors: Alan G. Lewis, Manish Kothari, John Batey, Teruo Sasagawa, Ming-Hau Tung, Gregory D. U'Ren, Stephen Zee
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Publication number: 20080218840Abstract: Certain MEMS devices include layers patterned to have tapered edges. One method for forming layers having tapered edges includes the use of an etch leading layer. Another method for forming layers having tapered edges includes the deposition of a layer in which the upper portion is etchable at a faster rate than the lower portion. Another method for forming layers having tapered edges includes the use of multiple iterative etches. Another method for forming layers having tapered edges includes the use of a liftoff mask layer having an aperture including a negative angle, such that a layer can be deposited over the liftoff mask layer and the mask layer removed, leaving a structure having tapered edges.Type: ApplicationFiled: August 18, 2006Publication date: September 11, 2008Inventors: Chengin Qui, Teruo Sasagawa, Ming-Hau Tung, Chun-Ming Wang, Stephen Zee
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Publication number: 20080151352Abstract: A microelectromechanical systems device having an electrical interconnect connected to at least one of an electrode and a movable layer within the device. At least a portion of the electrical interconnect is formed from the same material as a movable layer of the device. A thin film, particularly formed of molybdenum, is provided underneath the electrical interconnect. The movable layer preferably comprises aluminum.Type: ApplicationFiled: December 20, 2006Publication date: June 26, 2008Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.Inventors: Wonsuk Chung, SuryaPrakash Ganti, Stephen Zee
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Publication number: 20070285761Abstract: MEMS devices are fabricated by a method that involves forming an optical element (e.g., etalon) over a substrate and then forming a light modulating element (e.g., interferometric modulator) over the optical element. In an embodiment, a support structure for the light modulating element is aligned with the underlying optical element to thereby alter the appearance of the support structure to a viewer. Such an optical element is separated from the support structure by one or more buffer layers.Type: ApplicationFiled: January 23, 2007Publication date: December 13, 2007Inventors: Fan Zhong, Chun-Ming Wang, Stephen Zee
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Publication number: 20070275491Abstract: A modulator has a transparent substrate with a first surface. At least one interferometric modulator element resides on the first surface. At least one thin film circuit component electrically connected to the element resides on the surface. When more than one interferometric element resides on the first surface, there is at least one thin film circuit component corresponding to each element residing on the first surface. A method of manufacturing interferometric modulators with thin film transistors is also disclosed.Type: ApplicationFiled: August 10, 2007Publication date: November 29, 2007Applicant: IDC LLCInventors: Clarence Chui, Stephen Zee