Patents by Inventor Sterling Chaffins
Sterling Chaffins has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220118694Abstract: In an example method for forming three-dimensional (3D) printed electronic parts, a build material is applied. An electronic agent is selectively applied in a plurality of passes on a portion of the build material. A fusing agent is also selectively applied on the portion of the build material. The build material is exposed to radiation in a plurality of heating events. During at least one of the plurality of heating events, the portion of the build material in contact with the fusing agent fuses to form a region of a layer. The region of the layer exhibits an electronic property. An order of the plurality of passes, the selective application of the fusing agent, and the plurality of heating events is controlled to control a mechanical property of the layer and the electronic property of the region.Type: ApplicationFiled: December 23, 2021Publication date: April 21, 2022Inventors: Yan Zhao, Kristopher J. Erickson, Aja Hartman, Lihua Zhao, Sterling Chaffins, Kevin P. DeKam
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Patent number: 11304313Abstract: According to examples, a method of making a three-dimensional conductive printed part, including forming a layer of polymeric build material; selectively applying a fusing agent on a first selected area of the formed polymeric build material; selectively applying a conductive agent on a second selected area of the formed polymeric build material; and applying a solder receiving material to a portion of the first selected area and a portion of the second selected area; in which the solder receiving material is present on a surface of the conductive three-dimensional printed part is disclosed.Type: GrantFiled: December 15, 2017Date of Patent: April 12, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Sterling Chaffins, Kevin P. Dekam, Thomas A. Saksa, Juan Sebastian Ramirez
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Patent number: 11292189Abstract: In an example of a method for three-dimensional (3D) printing, a polymeric or polymeric composite build material is applied. A dielectric agent is selectively applied on at least a portion of the polymeric or polymeric composite build material. The dielectric agent includes a dielectric material having an effective relative permittivity (?r) value ranging from 1.1 to about 10,000. A fusing agent is selectively applied on the at least the portion of the polymeric or polymeric composite build material, and the polymeric or polymeric composite build material is exposed to radiation to fuse the at least the portion of the polymeric or polymeric composite build material to form a region of a layer of a 3D part. The region exhibits a dielectric property, a piezoelectric property, or a combination thereof.Type: GrantFiled: November 17, 2017Date of Patent: April 5, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Andrew Van Brocklin, Kevin P. DeKam, Vladek Kasperchik, Johnathon Holroyd, Douglas Pederson, Sterling Chaffins
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Publication number: 20220063189Abstract: Methods and systems for making three-dimensional printed articles. In one example, a method of making a three-dimensional article can include printing a conductive element including a composite of a conductive material and a polymeric build material; printing an adjacent portion in contact with the conductive element, where the adjacent portion includes a nonconductive polymeric build material; and heating the conductive element by running an electric current through the conductive element, and thereby heating the adjacent portion to a temperature sufficient to change a physical property of the nonconductive polymeric build material of the adjacent portion.Type: ApplicationFiled: April 29, 2019Publication date: March 3, 2022Applicant: Hewlett-Packard Development Company, L.P.Inventors: Sterling Chaffins, Thomas A. Saksa, Kevin P. DeKam, Juan Sebastian Ramirez, Dale Peterson, Jami Ryan Barone
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Patent number: 11199456Abstract: A temperature sensor can include a resistor, a first electrical contact at a first end of the resistor, a second electrical contact at a second end of the resistor, and a resistance measuring device. The resistor can be formed of a matrix of sintered elemental transition metal particles interlocked with a matrix of fused thermoplastic polymer particles. The resistance measuring device can be connected to the first electrical contact and the second electrical contact to measure a resistance of the resistor.Type: GrantFiled: October 25, 2016Date of Patent: December 14, 2021Assignee: Hewlett-Packard Development Company, L.P.Inventors: Kevin P DeKam, Timothy L Weber, Sterling Chaffins
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Publication number: 20210362408Abstract: The present disclosure is drawn to 3D printing kits, multi-fluid kits for 3D printing, and methods of making 3D printed articles. In one example, a 3D printing kit can include a powder bed material, a fusible fluid, and a magnetic fluid. The powder bed material can include polymer particles. The fusible fluid can include water and a radiation absorber. The fusible fluid can be to selectively apply to the powder bed material. The magnetic fluid can include magnetic particles, and the magnetic fluid can be to selectively apply to the powder bed material.Type: ApplicationFiled: October 16, 2018Publication date: November 25, 2021Applicant: Hewlett-Packard Development Company, L.P.Inventors: Kevin P. DeKam, Sterling Chaffins, Cassady Sparks Roop
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Publication number: 20210362411Abstract: In an example, a method is described that includes building a first layer of a three-dimensional heterogeneous object in a first plurality of passes of an additive manufacturing system. An electronic component is inserted directly into the first layer. The electronic component is then fused to the first layer in a second plurality of passes of the additive manufacturing system.Type: ApplicationFiled: March 13, 2018Publication date: November 25, 2021Inventors: Kristopher J. Erickson, David George, Sterling Chaffins, Lihua Zhao
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Patent number: 11167482Abstract: The present disclosure is drawn to 3D printing kits and methods of making 3D printed articles. In one example, a 3D printing kit can include a powder bed material, a fusible fluid, and an activator fluid. The powder bed material can include polymer particles. The fusible fluid can include a radiation absorber. The fusible fluid can be to selectively apply to the powder bed material. The activator fluid can include a non-conductive electroless metal plating activator. The activator fluid can also be to selectively apply to the powder bed material.Type: GrantFiled: October 19, 2018Date of Patent: November 9, 2021Assignee: Hewlett-Packard Development Company, L.P.Inventors: Sterling Chaffins, David Tucker, Kevin P. DeKam, David C. Woodlock, Lee Dockstader
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Publication number: 20210339466Abstract: A strain sensor can include a resistor, a first electrical contact at a first end of the resistor, and a second electrical contact at a second end of the resistor. The resistor can be formed of a matrix of sintered elemental transition metal particles interlocked with a matrix of fused thermoplastic polymer particles.Type: ApplicationFiled: July 15, 2021Publication date: November 4, 2021Applicant: Hewlett-Packard Development Company, L.P.Inventors: Sterling CHAFFINS, Kevin P. DEKAM, Cassady Sparks ROOP
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Publication number: 20210308941Abstract: A 3D printer to additively manufacture a 3D object includes a coater, a dispenser, and an energy source. The coater is to coat a first material relative to a print bed to form a selectable number of first layers. The dispenser is to dispense a first fluid agent onto first selected locations of the first layers of the first material. The energy source is to cause fusing at the first selected locations. The dispenser is to also dispense a second fluid agent including a second material to form a selectable number of second layers of the second material at second selected locations on top of the selectable number of first layers. Each second selected location comprises at least some of the fused first selected locations.Type: ApplicationFiled: April 17, 2017Publication date: October 7, 2021Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Kristopher J. ERICKSON, Sterling CHAFFINS, Howard S. TOM
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Publication number: 20210283834Abstract: In an example of a method for three-dimensional (3D) printing, a polymeric or polymeric composite build material is applied. A dielectric agent is selectively applied on at least a portion of the polymeric or polymeric composite build material. The dielectric agent includes a dielectric material having an effective relative permittivity (?r) value ranging from 1.1 to about 10,000. A fusing agent is selectively applied on the at least the portion of the polymeric or polymeric composite build material, and the polymeric or polymeric composite build material is exposed to radiation to fuse the at least the portion of the polymeric or polymeric composite build material to form a region of a layer of a 3D part. The region exhibits a dielectric property, a piezoelectric property, or a combination thereof.Type: ApplicationFiled: November 17, 2017Publication date: September 16, 2021Inventors: Andrew Van Brocklin, Kevin P. DeKam, Vladek Kasperchik, Johnathon Holroyd, Douglas Pederson, Sterling Chaffins
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Publication number: 20210282276Abstract: According to examples, a method of making a three-dimensional conductive printed part, including forming a layer of polymeric build material; selectively applying a fusing agent on a first selected area of the formed polymeric build material; selectively applying a conductive agent on a second selected area of the formed polymeric build material; and applying a solder receiving material to a portion of the first selected area and a portion of the second selected area; in which the solder receiving material is present on a surface of the conductive three-dimensional printed part is disclosed.Type: ApplicationFiled: December 15, 2017Publication date: September 9, 2021Inventors: Sterling Chaffins, Kevin P. Dekam, Thomas A. Saksa, Juan Sebastian Ramirez
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Patent number: 11090862Abstract: A strain sensor can include a resistor, a first electrical contact at a first end of the resistor, and a second electrical contact at a second end of the resistor. The resistor can be formed of a matrix of sintered elemental transition metal particles interlocked with a matrix of fused thermoplastic polymer particles.Type: GrantFiled: April 15, 2016Date of Patent: August 17, 2021Assignee: Hewlett-Packard Development Company, L.P.Inventors: Sterling Chaffins, Kevin P. DeKam, Cassady Sparks Roop
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Publication number: 20210229350Abstract: The present disclosure is drawn to 3D printing kits and methods of making 3D printed articles. In one example, a 3D printing kit can include a powder bed material, a fusible fluid, and an activator fluid. The powder bed material can include polymer particles. The fusible fluid can include a radiation absorber. The fusible fluid can be to selectively apply to the powder bed material. The activator fluid can include a non-conductive electroless metal plating activator. The activator fluid can also be to selectively apply to the powder bed material.Type: ApplicationFiled: October 19, 2018Publication date: July 29, 2021Applicant: Hewlett-Packard Development Company, L.P.Inventors: Sterling Chaffins, David Tucker, Kevin P. DeKam, David C. Woodlock, Lee Dockstader
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Publication number: 20210229358Abstract: In a three-dimensional printing method example, a pre-treatment coating is formed on a part precursor by applying and drying, alternatingly: a polycation solution including a chloride ion and a polyanion solution including a sodium ion to form at least two layers. An ink is selectively deposited on the pre-treatment coating.Type: ApplicationFiled: April 16, 2021Publication date: July 29, 2021Inventors: Sterling Chaffins, Kevin P. DeKam
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Patent number: 11064572Abstract: According to an example, a three-dimensional (3D) printed heater may include a part body formed of fused thermoplastic polymer particles and an electrically resistive element formed of a matrix of conductive particles interspersed between a matrix of thermoplastic polymer particles. The conductive particles and the thermoplastic polymer particles may be provided at respective densities to cause the electrically resistive element to have a predetermined resistance level. The 3D printed heater may also include electrical contacts connected to the electrically resistive element, in which a current is to be applied through the electrically resistive element via the electrical contacts to cause the electrically resistive element to generate a predefined level of heat.Type: GrantFiled: June 17, 2016Date of Patent: July 13, 2021Assignee: Hewlett-Packard Development Company, L.P.Inventors: Sterling Chaffins, Cassady Sparks Roop, Kevin P. DeKam
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Publication number: 20210197456Abstract: In an example of a method for reducing oxidation of a build material during three-dimensional printing, a portion of a layer of a polymeric build material is patterned by selectively applying a fusing agent on the portion. A detailing agent selectively applied on a non-patterned portion of the layer. The detailing agent includes a stabilizer to reduce oxidation of the polymeric build material. The layer is exposed to electromagnetic radiation to fuse the portion to form a 3D object layer. The stabilizer at least minimizes discoloration of the non-patterned portion.Type: ApplicationFiled: May 15, 2018Publication date: July 1, 2021Applicant: Hewlett-Packard Development Company, L.P.Inventors: Sterling Chaffins, Anthony P. Holden
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Publication number: 20210189164Abstract: The present disclosure is drawn to fluid sets, material sets, and 3-dimensional printing systems. A fluid set can include a pretreat composition that includes a salt of an alkali metal with bromide or iodide. The fluid set can also include a conductive fusing agent composition including a transition metal for fusing thermoplastic powder when exposed to electromagnetic radiation.Type: ApplicationFiled: October 25, 2016Publication date: June 24, 2021Applicant: Hewlett-Packard Development Company, L.P.Inventors: Sterling CHAFFINS, Kevin P. DEKAM
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Publication number: 20210179878Abstract: The present disclosure is drawn to material sets for 3-dimensional printing, 3-dimensional printing systems, and 3-dimensional printed parts. A material set can include a thermoplastic polymer powder having an average particle size from 20 ?m to 100 ?m, a photoluminescent ink including a photoluminescent agent, and a fusing ink. The fusing ink can include a fusing agent capable of absorbing electromagnetic radiation to produce heat.Type: ApplicationFiled: April 28, 2016Publication date: June 17, 2021Applicant: Hewlett-Packard Development Company, L.P.Inventors: James William Stasiak, Garry Hinch, Sterling Chaffins, Kevin P. DeKam
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Publication number: 20210170678Abstract: In an example, an apparatus includes processing circuitry comprising a model assessment module to identify an indication of a conductive element within object model data representing an object to be printed and a print instruction module to generate print instructions to generate the object. The print instructions may include an instruction to print conductive agent to form the conductive element and an instruction to print a fusing agent comprising an instruction to reduce an amount of fusing agent to be printed in a region of the conductive element compared to at least one other region of the object.Type: ApplicationFiled: April 26, 2017Publication date: June 10, 2021Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Sterling CHAFFINS, Thomas A SAKSA, Kevin P. DEKAM, Terry MCMAHON, Donald W SCHULTE, Jami Ryan BARONE, Douglas PEDERSON