Abstract: Display systems for a vehicle are contemplated that comprise a seat display unit coupled with a display screen, where the display screen is affixed to a seat back and the seat display unit is disposed within the seat back. The display screen is fixed to the seat back such that its relative position with the seat back remains constant when the seat back is reclined. The seat display unit is coupled to the seat back, such that the seat display unit automatically tilts or pivots when the seat back is reclined, and while the display screen does not move relative to the seat back.

Abstract: Display systems for a vehicle are contemplated that comprise a seat display unit coupled with a display screen, where the display screen is affixed to a seat back and the seat display unit is disposed within the seat back. The display screen is fixed to the seat back such that its relative position with the seat back remains constant when the seat back is reclined. The seat display unit is coupled to the seat back, such that the seat display unit automatically tilts or pivots when the seat back is reclined, and while the display screen does not move relative to the seat back.

Abstract: The contact assembly having a contact member with a contact tip positioned within holes in a test socket or probe plate wherein the contact tip or the hole in the probe plate or test socket has a cam surface to provide lateral movement of the contact tip across a surface of a test location during compression of the contact member to induce scrubbing on the surface of the test site.

Abstract: A spring probe utilizing a flat plunger and a round barrel having a compression spring positioned within the barrel and a wiper for internal contact between the plunger and the inside of the barrel.

Abstract: A spring contact assembly having a first plunger with a tail portion having a flat contact surface and a swagable surface and a second plunger having a tail portion with a flat contact surface and a swagable surface wherein the flat contact surfaces are overlapping and are surrounded by an external compression spring such that the swagable surfaces are swaged by the coils of the spring during the initial compression of the spring.

Abstract: The contact assembly having a contact member with a contact tip positioned within holes in a test socket or probe plate wherein the contact tip or the hole in the probe plate or test socket has a cam surface to provide lateral movement of the contact tip across a surface of a test location during compression of the contact member to induce scrubbing on the surface of the test site.

Abstract: A spring probe utilizing a flat plunger and a round barrel having a compression spring positioned within the barrel and a wiper for internal contact between the plunger and the inside of the barrel.

Abstract: A test socket for an integrated circuit package having an upper housing and a lower housing secured to the top and bottom surfaces, respectively, of a load board. The upper housing having a cavity for receipt of the integrated circuit package and including a hole in the base of the upper housing to allow a plurality of solid socket plungers to contact test sites on the integrated circuit package. The socket plungers are positioned within a plurality of channels formed in the lower housing and extend through a plurality of holes in the load board to contact the test sites. A plurality of springs are positioned in the channels of the lower housing below the socket plungers to provide a spring force to bias the socket plungers upwardly toward the integrated circuit package. A nonconductive pushrod is positioned between the spring and a beveled edge of the plunger and a nonconductive cap is positioned above the load board for high frequency test signals.

Abstract: A test socket for an integrated circuit package having an upper housing and a lower housing secured to the top and bottom surfaces, respectively, of a load board. The upper housing having a cavity for receipt of the integrated circuit package and including a hole in the base of the upper housing to allow a plurality of solid socket plungers to contact test sites on the integrated circuit package. The socket plungers are positioned within a plurality of channels formed in the lower housing and extend through a plurality of holes in the load board to contact the test sites. A plurality of springs are positioned in the channels of the lower housing below the socket plungers to provide a spring force to bias the socket plungers upwardly toward the integrated circuit package. A nonconductive pushrod is positioned between the spring and a beveled edge of the plunger and a nonconductive cap is positioned above the load board for high frequency test signals.

Abstract: A test socket for an integrated circuit package having an upper housing and a lower housing secured to the top and bottom surfaces, respectively, of a load board. The upper housing having a cavity for receipt of the integrated circuit package and including a hole in the base of the upper housing to allow a plurality of solid socket plungers to contact test sites on the integrated circuit package. The socket plungers are positioned within a plurality of channels formed in the lower housing and extend through a plurality of holes in the load board to contact the test sites. A plurality of springs are positioned in the channels of the lower housing below the socket plungers to provide a spring force to bias the socket plungers upwardly toward the integrated circuit package. A ball is positioned between the spring and a beveled edge of the plunger to aid in biasing the plunger.