Patents by Inventor Steve Baughman

Steve Baughman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microelectronic component assemblies having lead frames adapted to reduce package bow
    Patent number: 7601562
    Abstract: The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, the invention provides a microelectronic component assembly that includes spaced-apart first and second lead frame members. A packaged element is disposed between the lead frame members and attached thereto only by a plurality of elongate, flexible links that permit the packaged element to accommodate thermally induced stresses by floating with respect to the first and second lead frame members.
    Type: Grant
    Filed: February 7, 2007
    Date of Patent: October 13, 2009
    Assignee: Micron Technology, Inc.
    Inventors: Steven K. Groothuis, Steven R. Smith, Steve Baughman, Bernard Ball, T. Michael O'Connor
  • MICROELECTRONIC COMPONENT ASSEMBLIES HAVING LEAD FRAMES ADAPTED TO REDUCE PACKAGE BOW
    Publication number: 20070128770
    Abstract: The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, the invention provides a microelectronic component assembly that includes spaced-apart first and second lead frame members. A packaged element is disposed between the lead frame members and attached thereto only by a plurality of elongate, flexible links that permit the packaged element to accommodate thermally induced stresses by floating with respect to the first and second lead frame members.
    Type: Application
    Filed: February 7, 2007
    Publication date: June 7, 2007
    Applicant: Micron Technology, Inc.
    Inventors: Steven Groothuis, Steven Smith, Steve Baughman, Bernard Ball, T. O'Connor
  • Microelectronic component assemblies having lead frames adapted to reduce package bow
    Patent number: 7183485
    Abstract: The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, the invention provides a microelectronic component assembly that includes spaced-apart first and second lead frame members. A packaged element is disposed between the lead frame members and attached thereto only by a plurality of elongate, flexible links that permit the packaged element to accommodate thermally induced stresses by floating with respect to the first and second lead frame members.
    Type: Grant
    Filed: March 11, 2003
    Date of Patent: February 27, 2007
    Assignee: Micron Technology, Inc.
    Inventors: Steven K. Groothuis, Steven R. Smith, Steve Baughman, Bernard Ball, T. Michael O'Connor
  • Microelectronic component assemblies having lead frames adapted to reduce package bow
    Publication number: 20040177984
    Abstract: The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, the invention provides a microelectronic component assembly that includes spaced-apart first and second lead frame members. A packaged element is disposed between the lead frame members and attached thereto only by a plurality of elongate, flexible links that permit the packaged element to accommodate thermally induced stresses by floating with respect to the first and second lead frame members.
    Type: Application
    Filed: March 11, 2003
    Publication date: September 16, 2004
    Inventors: Steven K. Groothuis, Steven R. Smith, Steve Baughman, Bernard Ball, T. Michael O'Connor