Abstract: Disclosed is a fan-out wafer level packaging (FOWLP) apparatus includes a semiconductor die having at least one input/output (I/O) connection, a first plurality of package balls having a first package ball layout, a first conductive layer forming a first redistribution layer (RDL) and configured to electrically couple to the first plurality of package balls, and a second conductive layer forming a second RDL and including at least one conductive pillar configured to electrically couple the at least one I/O connection of the semiconductor die to the first conductive layer, wherein the second conductive layer enables the semiconductor die to be electrically coupled to a second plurality of package balls having a second package ball layout without a change in position of the at least one I/O connection of the semiconductor die.