Abstract: A high speed software modem is described which uses a selectable, desirable portion of the total available bandwidth of a transmission channel. In a preferred embodiment, the invention is implemented in a personal computer connected to an upstream transceiver through a channel supporting an Asymmetric Digital Subscriber Loop (ADSL) standard. The achievable target data rate of the modem is based on the capabilities of an analog front end (AFE) used in the modem, and a host processor within such personal computer. In particular, the modem AFE contains subband filtering which causes an upstream transceiver to use only a selected number of available sub-channels for downstream data transmission. The data rate of the modem is increased by upgrading the AFE or the host processor in order to increase the number of processable transmitted downstream sub-channels.

Abstract: A high speed modem is provided which uses a selectable, desirable portion of the total available bandwidth of a transmission channel. In a preferred embodiment, the invention is incorporated in a dedicated hardware circuit which is connected on one end to a data processor and on the other end to an upstream transceiver through a channel supporting an Asymmetric Digital Subscriber Loop (ADSL) standard. The achievable target data rate of the modem is based on the capabilities of an analog front end (AFE) used in the modem, and a signal processor within the dedicated hardware. In particular, the modem AFE contains subband filtering which causes an upstream transceiver to use only a selected number of available sub-channels for downstream data transmission. The data rate of the modem is increased by upgrading the AFE or the signal processor in order to increase the number of processable transmitted downstream sub-channels.

Abstract: A method of mounting a power semiconductor die on a substrate, a package for the die and a power supply including the package. The die has a first power terminal on a first surface thereof and a second power terminal on an opposing second surface thereof. The method including the steps of: (1) forming an electrically-conductive, mechanical bond between the first surface and a first location on the substrate, the mechanical bond electrically coupling the first power terminal to the substrate and (2) soldering an elongated electrically conductive strap to the second surface and a second location on the substrate, the conductive strap composed of a material having an electrical resistivity at most about 5.0.times.10.sup.-8 ohm-meters (.OMEGA.-m) and forming a low impedance path between the second power terminal and the second location.

Abstract: A digital subscriber loop access and multiplexing (DSLAM) circuit for use at a central office site is disclosed. The DSLAM circuit couples to a digital subscriber loop (DSL) and permits a downstream user to set up and configure an end-to-end connection with destination customer promise equipment (CPE) at a target data rate using any one or more of a regular switching telephone network, various kinds of wide area networks, or virtual permanent circuit links via digital cross-connects.

Abstract: An applications program is provided for permitting a user of a host processing system to dynamically control a modem having forward compatible and expandable functionality. In a preferred embodiment, the applications program is designed to run on a personal computer running the Windows.RTM. shell, and the modem is compatible with ADSL promulgated standards. As part of such program, initialization and detection routines determine the capabilities of an ADSL modem, including whether the same has been upgraded to have enhanced data throughput. A calibration routine measures the computing power available to the host processor, and based on this information and other relevant parameters determines nominal setup parameters for the modem. These parameters are stored in a Device Parameter Table so that they can be accessed by various application programs that may make use of such modem.

Abstract: A high speed modem is provided which targets the use of a selectable, desirable portion of the total available bandwidth of a channel for achieving a data rate which nevertheless far exceeds that of conventional voice-band modems. In a preferred embodiment, the invention is implemented in an Asymmetric Digital Subscriber Loop (ADSL), and the nominal data rate is achieved using an analog front end (AFE) with subband filtering which causes an upstream transceiver to use only a selected number of available sub-channels for downstream data transmission and allows slower sampling rate for the AFE. The data rate of the modem is increased in a multiplicative fashion through modular expansion of a bank of AFEs to increase the number of transmitted downstream sub-channels.

Abstract: A power supply and a method of manufacturing the same. In one embodiment, the power supply includes: (1) a substrate, (2) a main power supply mounted on the substrate and having an input and a main output, (3) an auxiliary power supply mounted on the substrate, coupled to the input and having an auxiliary output and (4) a cooling device mount, coupled to the power supply, configured to receive and support a cooling device, the auxiliary output configured to provide electric power to the cooling device.

Abstract: The present invention relates to semiconductor devices packaged using overcasting. The overcast devices of the present invention incorporate encapsulative materials, such as ultraviolet-curing material, which are cast in open stencils at approximately ambient pressure (and potentially at approximately ambient temperature) over electronic components mechanically and electrically connected to the substrate. The overcast semiconductor devices of the present invention may incorporate new encapsulative materials, including UV-cured materials and longer shelf life materials, poorly suited for the pressures and temperatures of injection molding. The overcast devices also allow the incorporation of substrate materials which are not feasible for use with a higher pressure, higher temperature forming process.

Abstract: A method and apparatus for removing particles and residue that build up inside a substrate processing system during a substrate processing operation, without overetching system components, is described. One method includes the steps of: flowing an etchant gas comprising chlorine trifluoride (ClF.sub.3), diluted with an inert carrier gas, into a processing chamber after completion of the substrate processing operation. The parts of the system within the chamber with the greatest amount of build-up are preferentially heated to facilitate more extensive cleaning of those parts. Parts of the system within the chamber with less build up are protected from overetching by keeping them about 200.degree. C. cooler than the heavily-deposited parts. Heating the heavily-deposited chamber parts to a temperature of at least about 400.degree. C. allows using a lower concentration of etchant gas for the cleaning process than a lower temperature process would allow.

Abstract: A package for a power magnetic device containing an isolation transformer having a primary and secondary winding, and a method of manufacture therefor.

Abstract: A shoe heel is provided with a light-emitting device and composed of a main body, and a transparent heel portion forming the shoe heel along with the main body. The main body has a waist portion, a top portion, a junction located between the waist portion and the top portion, and a receiving slot located in the waist portion for accommodating the light-emitting device. The light-emitting device comprises a battery, a vibration switch, and at least one light-emitting body.

Abstract: A power magnetic device, a method of manufacture therefor and a power converter. The power magnetic device includes: (1) an isolation transformer having a primary winding and a secondary winding, (2) a switch coupled to the primary winding, (3) a rectifier coupled to the secondary winding and (4) an encapsulant substantially surrounding the isolation transformer, the switch and the rectifier to join the isolation transformer, the switch and the rectifier into an integrated package, the integrated package having: (a) a first power input coupled to a first end of the primary winding, (b) a second power input coupled to the switch, (c) first and second power outputs coupled to the rectifier circuit and (d) a control input coupled to the switch, the control input allowing the switch to be controlled to couple the primary winding to a source of electrical power, the power magnetic device thereby capable of employing the isolation transformer and the rectifier to convert electrical power into DC electrical power.

Abstract: Epoxy compositions having improved toughness and flexibility comprising a polyepoxide of the formula ##STR1## wherein each X is H, allyl or glycidyl, Y is allyl or glycidyl and R is an alkyl of 1 to 4 carbons with there being at least two epoxy groups on the ring modified with a carboxy terminated polymer.