Patents by Inventor Steve Chun

Steve Chun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Composition for surface modification of a heat sink and method for surface treatment of the heat sink for printed circuit boards using the same
    Patent number: 7981317
    Abstract: The present invention provides a composition for surface modification of a heat sink, the composition including: 0.01 to 10 parts by weight of an organic titanium compound; 0.01 to 5 parts by weight of an organic silane compound; 0.1 to 10 parts by weight of an organic acid; 0.01 to 5 parts by weight of a sequestering agent; and 0.1 to 10 parts by weight of a buffer with respect to 100 parts by weight of distilled water. The composition of the present invention provides excellent adhesion strength with prepreg, and improve heat releasing performance.
    Type: Grant
    Filed: September 22, 2008
    Date of Patent: July 19, 2011
    Assignees: Samsung Electro-Mechanics Co., Ltd., YMT Co., Ltd.
    Inventors: Young-Ho Lee, Steve Chun, Dek-Gin Yang, Chan-Yeup Chung, Yun-Seok Hwang, Keun-Ho Kim
  • COMPOSITION FOR SURFACE MODIFICATION OF A HEAT SINK AND METHOD FOR SURFACE TREATMENT OF THE HEAT SINK FOR PRINTED CIRCUIT BOARDS USING THE SAME
    Publication number: 20090230085
    Abstract: The present invention provides a composition for surface modification of a heat sink, the composition including: 0.01 to 10 parts by weight of an organic titanium compound; 0.01 to 5 parts by weight of an organic silane compound; 0.1 to 10 parts by weight of an organic acid; 0.01 to 5 parts by weight of a sequestering agent; and 0.1 to 10 parts by weight of a buffer with respect to 100 parts by weight of distilled water. The composition of the present invention provides excellent adhesion strength with prepreg, and improve heat releasing performance.
    Type: Application
    Filed: September 22, 2008
    Publication date: September 17, 2009
    Inventors: Young-Ho LEE, Steve CHUN, Dek-Gin YANG, Chan-Yeup CHUNG, Yun-Seok HWANG, Keun-Ho KIM