Abstract: The present invention is a covered microchannel comprising: a) a substrate; b) an etched material adhered to the substrate; and c) a silicon-carbon material adhered to the etched material in such a manner to form a covered microchannel; wherein the silicon-carbon material comprises SiO.sub.1.8-2.4 C.sub.0.3-1.0 and H.sub.0.7-4.0 containing at least one of the following functional groups:--Si--O--Si--, --Si--CH.sub.2 --, --Si--H, or --Si--OH.The covered microchannel can be prepared by the steps of: a) coating a filler material onto a substrate having a groove, wherein the filler material covering the substrate fills the groove; b) removing filler material from the substrate but not from the groove; c) coating the substrate and the filler with an adhering, formable, capping material; and d) removing the filler from the groove. An etched laminate can also be used to prepare the covered microchannel.