Abstract: A bracket includes a support strut configured to carry the fluid ejection module and an alignment strut coupled to the support strut. The alignment strut is configured to affix to the frame so as to orient the support strut with respect to the frame in each of three orthogonal linear directions and three orthogonal angular directions. The alignment strut includes three alignment mechanisms. Each of the first and second alignment features is held mechanically fixed on the alignment strut in a respective aligned position, and the third alignment mechanism is movable on the alignment strut.

Abstract: A bracket includes a support strut configured to carry the fluid ejection module and an alignment strut coupled to the support strut. The alignment strut is configured to affix to the frame so as to orient the support strut with respect to the frame in each of three orthogonal linear directions and three orthogonal angular directions. The alignment strut includes three alignment mechanisms. Each of the first and second alignment features is held mechanically fixed on the alignment strut in a respective aligned position, and the third alignment mechanism is movable on the alignment strut.

Abstract: A fluid ejector includes a fluid ejection assembly, a housing, and an insert. The fluid ejection assembly includes one or more silicon bodies and a plurality of actuators. The one or more silicon bodies includes a silicon body having a plurality of fluid passages for fluid flow and a plurality of nozzles fluidically connected to the plurality of fluid passages. The plurality of actuators cause fluid in the plurality of fluid passages to be ejected from the plurality of nozzles. The housing assembly includes one or more plastic bodies, at least one plastic body attached to at least one silicon body to form a sealed volume on a side of the fluid ejection assembly opposite the nozzles. The insert is embedded in the at least one plastic body in proximity to the at least one silicon body, the insert having a coefficient of thermal expansion of less than 9 ppm/° C.

Abstract: A method of forming a fluid ejector includes positioning a fluid ejection module such that it is adjacent to a mounting frame, applying heat to a thermohardening glue that is between the fluid ejection module and the mounting frame, and curing the glue to secure the fluid ejection module to the mounting frame. The heat is applied with a heating element at least partially embedded in the glue.

Abstract: A physical vapor deposition apparatus includes a vacuum chamber having side walls, a cathode inside the vacuum chamber, wherein the cathode is configured to include a sputtering target, a radio frequency power supply configured to apply power to the cathode, an anode inside and electrically connected to the side walls of the vacuum chamber, a chuck inside and electrically isolated from the side walls of the vacuum chamber, the chuck configured to support a substrate, a clamp configured to hold the substrate to the chuck, wherein the clamp is electrically conductive, and a plurality of conductive electrodes attached to the clamp, each electrode configured to compress when contacted by the substrate.

Abstract: A physical vapor deposition apparatus includes a vacuum chamber having side walls, a cathode inside the vacuum chamber, wherein the cathode is configured to include a sputtering target, a radio frequency power supply configured to apply power to the cathode, an anode inside and electrically connected to the side walls of the vacuum chamber, a chuck inside and electrically isolated from the side walls of the vacuum chamber, the chuck configured to support a substrate, a clamp configured to hold the substrate to the chuck, wherein the clamp is electrically conductive, and a plurality of conductive electrodes attached to the clamp, each electrode configured to compress when contacted by the substrate.

Abstract: A method of bonding two substrates includes placing a separating member between a first substrate and a second substrate, applying pressure to the first substrate to initiate a bond wave between the first substrate and the second substrates with the separating member between the first substrate and the second substrate, and controlling movement of the bond wave by translating the separating member away from a center of the first substrate or the second substrate.

Abstract: A method of forming a fluid ejector includes positioning a fluid ejection module such that it is adjacent to a mounting frame, applying heat to a thermohardening glue that is between the fluid ejection module and the mounting frame, and curing the glue to secure the fluid ejection module to the mounting frame. The heat is applied with a heating element at least partially embedded in the glue.

Abstract: A fluid ejector includes a fluid ejection assembly, a housing, and an insert. The fluid ejection assembly includes one or more silicon bodies and a plurality of actuators. The one or more silicon bodies includes a silicon body having a plurality of fluid passages for fluid flow and a plurality of nozzles fluidically connected to the plurality of fluid passages. The plurality of actuators cause fluid in the plurality of fluid passages to be ejected from the plurality of nozzles. The housing assembly includes one or more plastic bodies, at least one plastic body attached to at least one silicon body to form a sealed volume on a side of the fluid ejection assembly opposite the nozzles. The insert is embedded in the at least one plastic body in proximity to the at least one silicon body, the insert having a coefficient of thermal expansion of less than 9 ppm/° C.

Abstract: An apparatus for filling a receptacle comprises a reservoir adapted to contain a supply of powder pharmaceutical formulation, a holder adapted to hold a receptacle in a position where it may receive powder from the reservoir, an extension extending above the receptacle, and a plunger moveable within the extension, whereby powder from the supply may fill the receptacle and at least a portion of the extension and the plunger may force the powder in the extension into the receptacle. In one version, the plunger may be a portion of the receptacle or may be adapted to install a portion of the receptacle. Alternatively, vibrational or other energy may be used to cause powder in the extension to be filled in the receptacle.

Abstract: An apparatus for filling a receptacle comprises a reservoir adapted to contain a supply of powder pharmaceutical formulation, a holder adapted to hold a receptacle in a position where it may receive powder from the reservoir, an extension extending above the receptacle, and a plunger moveable within the extension, whereby powder from the supply may fill the receptacle and at least a portion of the extension and the plunger may force the powder in the extension into the receptacle. In one version, the plunger may be a portion of the receptacle or may be adapted to install a portion of the receptacle. Alternatively, vibrational or other energy may be used to cause powder in the extension to be filled in the receptacle.