Abstract: This application is dedicated to the public. A method and apparatus for reducing the emissions of a fluorinated gas from a wafer processing facility begins by providing a fluorinated exhaust gas from wafer processing tools (10) through (16) via an input line (17). The fluorinated exhaust gas is then optionally gettered via an gettering system (18) to remove oxygen from the exhaust gas. After gettering, the fluorinated exhaust gas is directed to a molten aluminum bath (44). The fluorine in the exhaust gas reacts with the aluminum to form AlF.sub.3. A measurement device (56) is used to monitor the amount of fluorine being exhausted from the molten aluminum bath (44). When the amount of fluorine in the exhaust is too high, the molten aluminum bath (44) is saturated with fluorine. The bath is then cooled to form an inert solid brick of AlF.sub.3. Therefore, fluorinated gases which are detrimental to the environment are cost-effectively removed from the output of a wafer fabrication facility.