Abstract: Stacked integrated circuit devices, chip packages and methods for operating a chip package are described herein that provide an increased level of backside protection from physical attacks that could compromise confidentiality or authentication of the integrated circuit device. In one example, a chip stack includes a sacrificial integrated circuit (IC) die stacked with a primary IC die. The sacrificial IC die includes a first split key information source. The primary IC die has security circuitry configured to generate an encryption key based at least in part on first split key information transmitted from the sacrificial IC die across a die-to-die interface to the primary IC die. Separation of the dies to probe or modify of the primary IC die would cause the destruction of split key information required to operate the functional circuitry of the primary IC die.

Abstract: Cleanout conduit valve installations may include at least one cleanout housing having a cleanout housing interior and configured for placement in the cleanout conduit hole with the at least one cleanout conduit extending into the cleanout housing interior. A cleanout housing opening may overlie the cleanout housing interior. An openable cleanout housing door may be disposed in the cleanout housing opening. At least one cleanout conduit valve assembly may be configured to be disposed in fluid communication with the at least one cleanout conduit in the cleanout housing interior of the at least one cleanout housing. The at least one cleanout conduit valve assembly may include a valve housing configured for mounting on the at least one cleanout conduit. A valve mount may be carried by the valve housing. A valve may include a valve arm pivotally carried by the valve mount. A valve stop may extend from the valve arm. A valve body may be carried by the valve arm. The valve body may have a sealing surface.

Abstract: Cleanout conduit valve installations may include at least one cleanout housing having a cleanout housing interior and configured for placement in the cleanout conduit hole with the at least one cleanout conduit extending into the cleanout housing interior. A cleanout housing opening may overlie the cleanout housing interior. An openable cleanout housing door may be disposed in the cleanout housing opening. At least one cleanout conduit valve assembly may be configured to be disposed in fluid communication with the at least one cleanout conduit in the cleanout housing interior of the at least one cleanout housing. The at least one cleanout conduit valve assembly may include a valve housing configured for mounting on the at least one cleanout conduit. A valve mount may be carried by the valve housing. A valve may include a valve arm pivotally carried by the valve mount. A valve stop may extend from the valve arm. A valve body may be carried by the valve arm. The valve body may have a sealing surface.

Abstract: Cleanout conduit valve assemblies for a cleanout conduit may include a vertically oriented valve housing. The valve housing may include a valve inlet end configured to be disposed in fluid communication with the cleanout conduit and a valve discharge end opposite to and generally above the valve inlet end. The valve discharge end may be oriented within a valve discharge plane disposed at a discharge angle of greater than 0 degrees with respect to a horizontal plane. The valve discharge end may have an upper discharge opening side and a lower discharge opening side sloped downwardly from the upper discharge opening side. A valve body may be pivotally carried by the valve housing at the upper discharge opening side of the valve discharge end. Methods of preventing precipitation and runoff on a ground surface from entering a cleanout conduit connected to a sewer service line are also disclosed.