Abstract: A medical lead interconnect system. The medical lead interconnect system configured to selectively electrically couple a linear array of contact rings of an implantable medical lead to an electrical outlet coupling, the medical lead interconnect system including a housing having an electrical outlet, a pair of plates position within the housing and having a plurality of connector pins and a locking mechanism, a biasing member configured bias the pair of plates toward one another, and a cam configured to rotate between an open position in which the pair of plates are biased towards one another, and a closed position in which the pair plates are forced apart.

Abstract: A belt tensioner includes an arm, a spring case, and a helical spring having inwardly projecting first and second end portions. Another belt tensioner includes a spring, an arm, a spring case, and a pivot bushing surrounding the spring. An additional belt tensioner includes an idler pulley having a bearing with a mounting hole and includes an arm having a post. The post is positioned in the mounting hole, and an annular rim of the post is deformed radially outward and over the bearing. A method for manufacturing an arm and a spring case of a belt-tensioner includes obtaining a belt-tensioner-arm casting mold including a first section and a second section and obtaining a belt-tensioner-spring-case casting mold including a first segment and a second segment.

Abstract: A first belt tensioner includes an arm, spring case, coil spring, and arm plate. The arm is adapted to support an idler pulley and has a hook portion. The spring case is disposed in the arm and has a first spring seat. The spring is disposed in the spring case. The arm plate has a second spring seat. The spring is longitudinally compressed between the arm plate and the spring case. The spring is in torsion with the end portions of the spring seated against a corresponding spring seat and with the arm plate rotationally positioned under the hook portion. A method for assembling the first belt tensioner includes using the arm plate to longitudinally compress the spring and rotating the arm plate. A second belt tensioner includes an arm, spring case, coil spring, arm plate, and pivot bushing.

Abstract: A belt tensioner includes an arm, a spring case, and a helical spring having inwardly projecting first and second end portions. Another belt tensioner includes a spring, an arm, a spring case, and a pivot bushing surrounding the spring. An additional belt tensioner includes an idler pulley having a bearing with a mounting hole and includes an arm having a post. The post is positioned in the mounting hole, and an annular rim of the post is deformed radially outward and over the bearing. A method for manufacturing an arm and a spring case of a belt-tensioner includes obtaining a belt-tensioner-arm casting mold including a first section and a second section and obtaining a belt-tensioner-spring-case casting mold including a first segment and a second segment.

Abstract: A belt tensioner includes an arm, a spring case, and a helical spring having inwardly projecting first and second end portions. Another belt tensioner includes a spring, an arm, a spring case, and a pivot bushing surrounding the spring. An additional belt tensioner includes an idler pulley having a bearing with a mounting hole and includes an arm having a post. The post is positioned in the mounting hole, and an annular rim of the post is deformed radially outward and over the bearing. A method for manufacturing an arm and a spring case of a belt-tensioner includes obtaining a belt-tensioner-arm casting mold including a first section and a second section and obtaining a belt-tensioner-spring-case casting mold including a first segment and a second segment.

Abstract: The present invention advantageously provides a method for obtaining access to an integrated circuit chip encapsulated within a device package. The present method involves positioning a masking material, i.e., gasket, adjacent to the heat spreader of the device package. The gasket includes a cavity which is aligned adjacent a portion of the heat spreader directly above the chip. An etchant injection system is then placed against the gasket. A heat spreader etchant is then injected directly into the cavity such that the etchant contacts the exposed surface of the heat spreader. The etchant is supplied to the cavity until a opening is etched vertically through the thickness of the heat spreader. If the heat spreader is composed of copper plated with nickel, it is preferred that the etchant be a solution of 70% nitric acid heated to about 80.degree. C. Formation of the opening through the heat spreader may expose an adhesive layer.