Patents by Inventor Steve Groothuis

Steve Groothuis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Direct Silicon-to-Silicon Bonding for Fiber-First Packaging Process
    Publication number: 20250044534
    Abstract: An electro-optical chip assembly includes a silicon baseplate and an electro-optical chip. The electro-optical chip has a silicon substrate that is fusion bonded to the silicon baseplate. The electro-optical chip is manufactured separate from the silicon baseplate before fusion bonding of the silicon substrate of the electro-optical chip to the silicon baseplate.
    Type: Application
    Filed: October 12, 2023
    Publication date: February 6, 2025
    Inventors: Chong Zhang, Haiwei Lu, Steve Groothuis