Abstract: An anisotropic electrically conducting interconnect is disclosed in which an adhesive comprising particles having a breakable coating of at least one electrically nonconductive material is compressed between a first contact and a second contact. Compression to two contacts breaks the breakable coating exposing an electrically conducting material which makes contact with the first and second contacts. The electrically conducting material may be a metal conductor or a two-part reactive conductive resin/catalyst system. Also disclosed are processes for making such electrical interconnects and adhesives for use in making electrical interconnect.

Abstract: An anisotropic electrically conducting interconnect is disclosed in which an adhesive comprising particles having a breakable coating of at least one electrically nonconductive material is compressed between a first contact and a second contact. Compression to two contacts breaks the breakable coating exposing an electrically conducting material which makes contact with the first and second contacts. The electrically conducting material may be a metal conductor or a two-part reactive conductive resin/catalyst system. Also disclosed are processes for making such electrical interconnects and adhesives for use in making electrical interconnect.

Abstract: A method and system for fabricating electronic assemblies, such as multi chip modules, which include wire bonded semiconductor dice, are provided. Initially, dice having bond pads, and a substrate having corresponding bond pads, are provided. Using a wire bonding process, bonded connections are made between the bond pads on the dice, and the bond pads on the substrate. During the wire bonding process, electrical continuity in the bonded connections can be evaluated. Following wire bonding, but prior to subsequent processing of the assemblies, quick functionality tests can be performed to evaluate other electrical characteristics of the assemblies (e.g., gross functionality, open/short, pad leakage, cell defects). This permits defective assemblies to be identified prior to further processing. Once the assemblies have been completed, full functionality and parametric tests can be performed.

Abstract: A method and system for fabricating electronic assemblies, such as multi chip modules, which include wire bonded semiconductor dice, are provided. Initially, dice having bond pads, and a substrate having corresponding bond pads, are provided. Using a wire bonding process, bonded connections are made between the bond pads on the dice, and the bond pads on the substrate. During the wire bonding process, electrical continuity in the bonded connections can be evaluated. Following wire bonding, but prior to subsequent processing of the assemblies, quick functionality tests can be performed to evaluate other electrical characteristics of the assemblies (e.g., gross functionality, open/short, pad leakage, cell defects). This permits defective assemblies to be identified prior to further processing. Once the assemblies have been completed, full functionality and parametric tests can be performed.