Abstract: Balloon systems for treating bifurcated lumens include desirable burst and folding characteristics. In some cases, the balloon systems can be formed by varying the wall thickness of a balloon parison.

Abstract: A medical device for insertion and expansion within a bifurcated lumen is described. An expansion region of the device has regions thereon which, in some cases, enable the device to fold into a predetermined configuration upon deflation. The regions may be defined by differing modulus of the device material.

Abstract: According to one embodiment, a group III-V semiconductor device comprises a compositionally graded body disposed over a substrate and below a buffer layer supporting an active area of the group III-V semiconductor device. The compositionally graded body includes a first region applying compressive stress to the substrate. The compositionally graded body further includes a stress modulating region over the first region, where the stress modulating region applies tensile stress to the substrate. In one embodiment, a method for fabricating a group III-V semiconductor device comprises providing a substrate for the group III-V semiconductor device and forming a first region of a compositionally graded body over the substrate to apply compressive stress to the substrate. The method further comprises forming a stress modulating region of the compositionally graded body over the first region, where the stress modulating region applies tensile stress to the substrate.

Abstract: A medical device for insertion and expansion within a bifurcated lumen is described. An expansion region of the device has regions thereon which, in some cases, enable the device to fold into a predetermined configuration upon deflation. The regions may be defined by differing modulus of the device material.

Abstract: Balloon systems for treating bifurcated lumens include desirable burst and folding characteristics. In some cases, the balloon systems can be formed by varying the wall thickness of a balloon parison.

Abstract: A conduit assembly for transferring heated fluid from a pump to a heat exchanger and to return cooled fluid from the heat exchanger to the pump is disclosed. The conduit assembly includes a flexible inner conduit disposed within a relatively rigid conduit. The heated fluid travels through the flexible inner conduit from the pump to the heat exchanger and the cooled fluid returns to the pump in the space between the outer diameter of the flexible inner conduit and the inner diameter of the rigid conduit. The conduit assembly includes a fluid splitter nipple and a fluid splitter body to split the incoming and outgoing fluid into the inner and outer conduits. The relatively warmer fluid from the pump is exposed to the temperature of the fluid passing simultaneously through the outer conduit, rather than being exposed to the ambient environmental conditions as in conventional hoses. This Abstract is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.