Patents by Inventor Steve I. Lebo

Steve I. Lebo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7643309
    Abstract: A ruggedized electronics sub-system module is disclosed. The ruggedized electronics sub-system module includes a ruggedized housing and an electronic sub-system environmentally sealed within the ruggedized housing. At least one electrical interface is configured to couple to an external electrical connector.
    Type: Grant
    Filed: July 18, 2002
    Date of Patent: January 5, 2010
    Assignee: Rockwell Collins, Inc.
    Inventor: Steve I. Lebo
  • Patent number: 7200229
    Abstract: A modular radio includes a chassis holding a network infosec unit module; a power amplifier module; and at least one transceiver module. Each of the modules include a separate housing and is removable and replaceable. The modules communicate via a bus and are reconfigurable along the bus. The transceivers support a channel that may be reprogrammable by the network interface.
    Type: Grant
    Filed: August 28, 2002
    Date of Patent: April 3, 2007
    Assignee: Rockwell Collins, Inc.
    Inventors: Richard D. Spring, Timothy E. Snodgrass, Robert R. Jakoubek, Steve I. Lebo
  • Patent number: 6975511
    Abstract: A ruggedized electronics sub-system module is disclosed. The ruggedized electronics sub-system module includes a ruggedized housing and an electronic device supported by the housing. The ruggedized electronics sub-system module also includes an electrical connector coupled to the electronic device and supported by the housing. The ruggedized electronics sub-system module further includes a plurality of ruggedized cooling pins extending from the housing. The plurality of pins are spaced so as to allow for natural convective currents or forced air to be used for cooling the electronic device.
    Type: Grant
    Filed: July 18, 2002
    Date of Patent: December 13, 2005
    Assignee: Rockwell Collins
    Inventors: Steve I. Lebo, Scott J. Sellner
  • Patent number: 6747866
    Abstract: A ruggedized electronics module is disclosed. The ruggedized electronics module includes a housing supporting an electronic subsystem device. The housing is environmentally sealed. The ruggedized electronics module also includes a module restraint extending from the housing the restraint is configured to mate with a complementary shaped restraint on a mounting adapter. The module restraint is configured to restrain the module from movement in six degrees of freedom.
    Type: Grant
    Filed: July 18, 2002
    Date of Patent: June 8, 2004
    Assignee: Rockwell Collins
    Inventors: Steve I. Lebo, Scott J. Sellner
  • Patent number: 6741466
    Abstract: A chassis for a ruggedized modular electronics system is disclosed. The chassis includes an open support structure that is configured to support ruggedized electronics modules. The open support structure allows ambient airflow around the exterior of the ruggedized electronics modules. A first electrical connector is supported by the support structure and a second electrical connector is supported by the support structure. The second electrical connector is electrically coupled to the first electrical connector.
    Type: Grant
    Filed: July 18, 2002
    Date of Patent: May 25, 2004
    Assignee: Rockwell Collins
    Inventor: Steve I. Lebo
  • Publication number: 20040052368
    Abstract: A modular radio includes a chassis holding a network infosec unit module; a power amplifier module; and at least one transceiver module. Each of the modules include a separate housing and is removable and replaceable. The modules communicate via a bus and are reconfigurable along the bus. The transceivers support a channel that may be reprogrammable by the network interface.
    Type: Application
    Filed: August 28, 2002
    Publication date: March 18, 2004
    Applicant: Rockwell Collins, Inc.
    Inventors: Richard D. Spring, Timothy E. Snodgrass, Robert R. Jakoubek, Steve I. Lebo
  • Patent number: 6665189
    Abstract: A ruggedized electronics system is disclosed. The ruggedized electronics system includes at least one ruggedized electronics module. The electronics module has an electrical module coupling. The ruggedized electronics system also includes an open framed chassis provided with more than one electrical chassis coupling. At least one electrical chassis coupling is coupled to at least one electronic module. The electronics modules may be coupled to and decoupled from the chassis, so that the system may be selectively reconfigured.
    Type: Grant
    Filed: July 18, 2002
    Date of Patent: December 16, 2003
    Assignee: Rockwell Collins, Inc.
    Inventor: Steve I. Lebo
  • Patent number: 6574117
    Abstract: A ruggedized electronics module is disclosed. The ruggedized electronics module includes a housing supporting an electronics sub-system device. A module restraint extends from the housing. The module restraint is configured to mate with a complementary shaped restraint on a mounting adapter. The module restraint is configured to restrain the module from movement in six degrees of freedom. The module restraint includes a first surface extending from and sloping away from the housing. The module restraint also includes a second surface extending from and sloping away from the housing. The first surface intersects the second surface and the first and second surfaces slope away from each other.
    Type: Grant
    Filed: July 18, 2002
    Date of Patent: June 3, 2003
    Assignee: Rockwell Collins, Inc.
    Inventor: Steve I. Lebo