Abstract: A fixture is used to secure a substrate and to allow movement of a pin relative ot the fixture. The substrate fixture includes a holding table adapted to receive the substrate and a probe pin assembly underneath the table. The substrate is mounted on a table which can move in one-dimension, while the probe pin is moveable relative to the table in another dimension perpendicular to movement of the table. Moving the substrate retaining table and the pin retainer allows for alignment of the probe pin with a backside terminal of a trace conductor of the substrate. The assembly also has vertical height translational mechanism for contacting the probe pin with the backside terminal. Furthermore, the frontside terminal of the trace conductor is accessible to an external probe. A testing device can be connected to the external probe and the probe pin to measure the electrical continuity of the trace conductor.

Abstract: A charged particle imaging system may be used to perform package-level failure analysis by providing a Capacitive Coupling Voltage Contrast image of a portion of the semiconductor package. Preliminary failure analysis using Time Domain Reflectometry may determine whether a defect lies either outside or within the semiconductor package substrate. The semiconductor package may be prepared such that sequential layers of the package may be removed until electrical testing determines the location of a defect on a layer of the package. An alternating signal may be supplied to an exposed trace conductor on the layer of the package substrate on which the defect is located. A portion of the trace conductor may be imaged with a charged particle imaging system to produce a voltage-induced contrast image of the trace conductors.