Patents by Inventor Steve K. McCandless

Steve K. McCandless has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SYSTEM FOR PREDICTING PROPERTIES OF STRUCTURES, IMAGER SYSTEM, AND RELATED METHODS
    Publication number: 20240153062
    Abstract: A method of predicting virtual metrology data for a wafer lot that includes receiving first image data from an imager system, the first image data relating to at least one first wafer lot, receiving measured metrology data from metrology equipment relating to the at least one first wafer lot, applying one or more machine learning techniques to the first image data and the measured metrology data to generate at least one predictive model for predicting at least one of virtual metrology data or virtual cell metrics data of wafer lots, and utilizing the at least one generated predictive model to generate at least one of first virtual metrology data or first virtual cell metrics data for the first wafer lot.
    Type: Application
    Filed: January 8, 2024
    Publication date: May 9, 2024
    Inventors: Amitava Majumdar, Qianlan Liu, Pradeep Ramachandran, Shawn D. Lyonsmith, Steve K. McCandless, Ted L. Taylor, Ahmed N. Noemaun, Gordon A. Haller
  • System for predicting properties of structures, imager system, and related methods
    Patent number: 11869178
    Abstract: A method of predicting virtual metrology data for a wafer lot that includes receiving first image data from an imager system, the first image data relating to at least one first wafer lot, receiving measured metrology data from metrology equipment relating to the at least one first wafer lot, applying one or more machine learning techniques to the first image data and the measured metrology data to generate at least one predictive model for predicting at least one of virtual metrology data or virtual cell metrics data of wafer lots, and utilizing the at least one generated predictive model to generate at least one of first virtual metrology data or first virtual cell metrics data for the first wafer lot.
    Type: Grant
    Filed: December 10, 2020
    Date of Patent: January 9, 2024
    Assignee: Micron Technology, Inc.
    Inventors: Amitava Majumdar, Qianlan Liu, Pradeep Ramachandran, Shawn D. Lyonsmith, Steve K. McCandless, Ted L. Taylor, Ahmed N. Noemaun, Gordon A. Haller
  • SYSTEM FOR PREDICTING PROPERTIES OF STRUCTURES, IMAGER SYSTEM, AND RELATED METHODS
    Publication number: 20210090246
    Abstract: A method of predicting virtual metrology data for a wafer lot that includes receiving first image data from an imager system, the first image data relating to at least one first wafer lot, receiving measured metrology data from metrology equipment relating to the at least one first wafer lot, applying one or more machine learning techniques to the first image data and the measured metrology data to generate at least one predictive model for predicting at least one of virtual metrology data or virtual cell metrics data of wafer lots, and utilizing the at least one generated predictive model to generate at least one of first virtual metrology data or first virtual cell metrics data for the first wafer lot.
    Type: Application
    Filed: December 10, 2020
    Publication date: March 25, 2021
    Inventors: Amitava Majumdar, Qianlan Liu, Pradeep Ramachandran, Shawn D. Lyonsmith, Steve K. McCandless, Ted L. Taylor, Ahmed N. Noemaun, Gordon A. Haller
  • System for predicting properties of structures, imager system, and related methods
    Patent number: 10872403
    Abstract: A method of predicting virtual metrology data for a wafer lot that includes receiving first image data from an imager system, the first image data relating to at least one first wafer lot, receiving measured metrology data from metrology equipment relating to the at least one first wafer lot, applying one or more machine learning techniques to the first image data and the measured metrology data to generate at least one predictive model for predicting at least one of virtual metrology data or virtual cell metrics data of wafer lots, and utilizing the at least one generated predictive model to generate at least one of first virtual metrology data or first virtual cell metrics data for the first wafer lot.
    Type: Grant
    Filed: August 10, 2018
    Date of Patent: December 22, 2020
    Assignee: Micron Technology, Inc.
    Inventors: Amitava Majumdar, Qianlan Liu, Pradeep Ramachandran, Shawn D. Lyonsmith, Steve K. McCandless, Ted L. Taylor, Ahmed N. Noemaun, Gordon A. Haller
  • SYSTEM FOR PREDICTING PROPERTIES OF STRUCTURES, IMAGER SYSTEM, AND RELATED METHODS
    Publication number: 20200051235
    Abstract: A method of predicting virtual metrology data for a wafer lot that includes receiving first image data from an imager system, the first image data relating to at least one first wafer lot, receiving measured metrology data from metrology equipment relating to the at least one first wafer lot, applying one or more machine learning techniques to the first image data and the measured metrology data to generate at least one predictive model for predicting at least one of virtual metrology data or virtual cell metrics data of wafer lots, and utilizing the at least one generated predictive model to generate at least one of first virtual metrology data or first virtual cell metrics data for the first wafer lot.
    Type: Application
    Filed: August 10, 2018
    Publication date: February 13, 2020
    Inventors: Amitava Majumdar, Qianlan Liu, Pradeep Ramachandran, Shawn D. Lyonsmith, Steve K. McCandless, Ted L. Taylor, Ahmed N. Noemaun, Gordon A. Haller