Patents by Inventor Steve Lai

Steve Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Detection of Nucleic Acids
    Publication number: 20140274756
    Abstract: This invention provides compositions, methods, and systems for characterizing, resolving, and quantitating single stranded and double stranded DNA and RNA in-situ. Paired sense and anti-sense probes can signal the presence of double stranded nucleic acids. DNA and RNA can be distinguished in cell and tissue samples by hybridizing with probe sets adapted to highlight differences in these targets in-situ.
    Type: Application
    Filed: March 14, 2013
    Publication date: September 18, 2014
    Applicant: Affymetrix, Inc.
    Inventors: Quan Nguyen, Yunqing Ma, Audrey Lin, Shauna Levinson, Steve Lai
  • Reflow chamber and process
    Patent number: 6299689
    Abstract: A method and apparatus for reflowing a material layer is provided. The inventive method introduces into a reflow chamber a material which is at least as reactive or more reactive than a material to be reflowed (i.e., a gettering material). Preferably the gettering material is sputter deposited within the reflow chamber while a shield prevents the gettering material from reaching the material layer to be reflowed. The shield may be coupled to, or integral with a clamp for clamping a wafer (containing the material layer to be reflowed) to a wafer support provided sufficient venting exists so that contaminants degassed from the wafer may flow to the region between the sputtering target and the shield where the contaminants can react with gettering material.
    Type: Grant
    Filed: March 13, 2000
    Date of Patent: October 9, 2001
    Assignee: Applied Materials, Inc.
    Inventors: Hougong Wang, Steve Lai, Gongda Yao, Peijun Ding
  • Reflow chamber and process
    Patent number: 6077404
    Abstract: A method and apparatus for reflowing a material layer is provided. The inventive method introduces into a reflow chamber a material which is at least as reactive or more reactive than a material to be reflowed (i.e., a gettering material). Preferably the gettering material is sputter deposited within the reflow chamber while a shield prevents the gettering material from reaching the material layer to be reflowed. The shield may be coupled to, or integral with a clamp for clamping a wafer (containing the material layer to be reflowed) to a wafer support provided sufficient venting exists so that contaminants degassed from the wafer may flow to the region between the sputtering target and the shield where the contaminants can react with gettering material.
    Type: Grant
    Filed: February 17, 1998
    Date of Patent: June 20, 2000
    Assignee: Applied Material, Inc.
    Inventors: Hougong Wang, Steve Lai, Gongda Yao, Peijun Ding