Abstract: A carbon nanotube sensor device includes one or more carbon nanotubes and a functionalization layer. An outer surface of the one or more carbon nanotubes is coated with the functionalization layer and the functionalization layer includes a chemical compound that binds to one or more specific analytes. Binding of the one or more specific analytes to the functionalization layer alters an electrical property of the carbon nanotube sensor device and contributes to their detection. The functionalization layer includes a first layer stacked onto an outer surface of the carbon nanotubes, a second layer stacked onto the first layer and a third layer stacked onto the second layer. The first layer enables stacking of a polymer onto the carbon nanotubes. The second layer includes the polymer and the third layer includes the chemical compound that binds to the one or more a specific analytes.

Abstract: A carbon nanotube sensor device includes one or more carbon nanotubes and a functionalization layer. An outer surface of the one or more carbon nanotubes is coated with the functionalization layer and the functionalization layer includes a chemical compound that binds to one or more specific analytes. Binding of the one or more specific analytes to the functionalization layer alters an electrical property of the carbon nanotube sensor device and contributes to their detection. The functionalization layer includes a first layer stacked onto an outer surface of the carbon nanotubes, a second layer stacked onto the first layer and a third layer stacked onto the second layer. The first layer enables stacking of a polymer onto the carbon nanotubes. The second layer includes the polymer and the third layer includes the chemical compound that binds to the one or more a specific analytes.

Abstract: A solar cell is provided herein. The solar cell includes a substantially transparent substrate, a substantially thin and transparent nickel-based conformal layer deposited on the substrate surface, and at least one interconnect formed on the conformal layer to facilitate energy conversion of the solar cell. The conformal layer can be made from a nickel-based material and is designed to enhance ohmic contact to the interconnect. The conformal layer can also act to facilitate the conversion of light energy into electrical current by the interconnect, while minimizing energy loss, such that the overall conversion efficiency of the solar cell can be improved. The conformal layer can further facilitate transmission of electrical current along the solar cell. A method for manufacturing a solar cell is also provided.

Abstract: A photovoltaic cell is provided herein. The photovoltaic cell includes a substrate whereby at least one interconnects may be formed over the substrate to facilitate energy conversion of the photovoltaic cell. In this embodiment, a conformal layer may be deposited over the interconnects, the conformal layer having a thickness of up to about 100 nm, and whereby the conformal layer is designed to permit external radiation to pass through to the interconnects so as to enhance the efficiency of energy conversion by at least about 25% as measured at standard test condition. In another embodiment, the interconnects of the photovoltaic cell may have tapered profile as to facilitate collection of diffused external radiation. In some instances, the tapered profile may facilitate in diverting the diffused external radiation to the interconnects for enhancing energy conversion of the photovoltaic cell. A method for method of manufacturing a photovoltaic cell is also provided.

Abstract: The invention provides an optoelectronic assembly for coupling an optical conductor to a light emitting surface of an optoelectronic semiconductor device on a substrate. The optoelectronic assembly includes a multilayer having a cavity adapted to receive and electrically connect the optoelectronic semiconductor device to the multilayer substrate and a groove leading to the cavity and being adapted to receive and optically connect the optical conductor to the light emitting surface of said optoelectronic semiconductor device. The optoelectronic semiconductor device and the optical conductor are precisely positioned within the cavity and the groove, respectively, so that light emitted from the light emitting surface of the optoelectronic semiconductor device couples to an optical surface of the optical conductor.

Abstract: A system for handling video content in a network, such as the Internet. Aspects of the system provide for accessing, distributing and maintaining digital video or other image content. Video content is acquired from content providers. Searching, and identification of desired video content is provided to users of the system by annotating video content with searchable text. The searchable text is accessed via a database where relational queries are used to identify desired content. Portions, or chapters, of the video can be linked to unique descriptions. This allows for indexing of video so that a viewer, or user, does not have to watch unwanted segments to get desired information. Access of the video by end users is facilitated by maintenance of multiple video servers that provide access to the content. Distribution of video broadcasts can be on-demand or in real-time. A preferred embodiment uses both satellite and on-location video distribution.

Abstract: The invention provides an optoelectronic assembly for coupling an optical conductor to a light emitting surface of an optoelectronic semiconductor device on a substrate. The optoelectronic assembly includes a multilayer having a cavity adapted to receive and electrically connect the optoelectronic semiconductor device to the multilayer substrate and a groove leading to the cavity and being adapted to receive and optically connect the optical conductor to the light emitting surface of said optoelectronic semiconductor device. The optoelectronic semiconductor device and the optical conductor are precisely positioned within the cavity and the groove, respectively, so that light emitted from the light emitting surface of the optoelectronic semiconductor device couples to an optical surface of the optical conductor.

Abstract: The present invention is related to an image sensor packaging technique based on a Ball Grid Array (BGA) IC packaging technique, further referred to as image sensor ball grid array (ISBGA). A transparent cover is attached to a semiconductor substrate. Depending on the method of attaching the cover to the substrate a hermetic or non-hermitic sealing is obtained. The obtained structure can be connected trough wire-bonding or flip chip connection.

Abstract: A process for forming an electronic component carrier, the electronic carrier having routing layers parallel to an aluminum substrate and vias perpendicular to the aluminum substrate, the process comprising defining routing layers by forming a blocking mask on the aluminum substrate, the blocking mask leaving exposed areas corresponding to the routing layers, carrying out a barrier anodization process on the aluminum substrate to form a surface barrier oxide over the routing layers, removing the blocking mask, providing an upper aluminum layer over the aluminum substrate, defining vias by forming a blocking mask on the upper aluminum layer, the blocking mask covering areas corresponding to the vias, and subjecting both the aluminum substrate and the upper aluminum layer to porous anodization. The barrier oxide defining the routing layer provides reliable masking of the routing layer during porous anodization.