Patents by Inventor Steve Liang

Steve Liang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for fabricating a wafer level package with device wafer and passive component integration
    Publication number: 20080003761
    Abstract: According to an exemplary embodiment, a wafer level package includes a device wafer including at least one device wafer contact pad and a device, and where the at least one device wafer contact pad is electrically connected to the device. The wafer level package includes a first polymer layer situated over the device wafer. The wafer level package includes at least one passive component situated over the first polymer layer and having a first terminal and a second terminal. The first terminal of the at least one passive component is electrically connected to the at least one device wafer contact pad. The wafer level package includes a second polymer layer situated over the at least one passive component. The wafer level package includes at least one polymer layer contact pad situated over the second polymer layer and electrically connected to the second terminal of the at least one passive component.
    Type: Application
    Filed: September 7, 2007
    Publication date: January 3, 2008
    Inventors: Qing Gan, Robert Warren, Anthony Lobianco, Steve Liang
  • Packaged electronic devices and process of manufacturing same
    Publication number: 20070070608
    Abstract: An electronic module and a process for forming an electronic module are provided. Uniform and sealed air gaps are formed in a vertical direction between two or more electronic devices. The uniform and sealed air gaps are formed by arranging spacers between the electronic devices, where the height of the spacers is selected depending upon the operating characteristics of the particular type of electronic devices.
    Type: Application
    Filed: September 29, 2005
    Publication date: March 29, 2007
    Applicant: SKYWORKS SOLUTIONS, INC.
    Inventors: Robert Warren, Steve Liang, Tony LoBianco, Gene Gan
  • Wafer level package including a device wafer integrated with a passive component
    Publication number: 20060220173
    Abstract: According to an exemplary embodiment, a wafer level package includes a device wafer including at least one device wafer contact pad and a device, and where the at least one device wafer contact pad is electrically connected to the device. The wafer level package includes a first polymer layer situated over the device wafer. The wafer level package includes at least one passive component situated over the first polymer layer and having a first terminal and a second terminal. The first terminal of the at least one passive component is electrically connected to the at least one device wafer contact pad. The wafer level package includes a second polymer layer situated over the at least one passive component. The wafer level package includes at least one polymer layer contact pad situated over the second polymer layer and electrically connected to the second terminal of the at least one passive component.
    Type: Application
    Filed: April 1, 2005
    Publication date: October 5, 2006
    Inventors: Qing Gan, Robert Warren, Anthony Lobianco, Steve Liang