Patents by Inventor Steve Lien-Chung Hsu

Steve Lien-Chung Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230041833
    Abstract: The present invention provides a polybenzoxazole precursor, which comprises a structure of formula (I): wherein the definitions of Y, Z, R1, i, j, and V are provided herein. By means of the polybenzoxazole precursor, the resin composition of the present invention is able to form a film with high frequency characteristics and high contrast.
    Type: Application
    Filed: July 5, 2022
    Publication date: February 9, 2023
    Applicant: MICROCOSM TECHNOLOGY CO., LTD.
    Inventors: Steve Lien-chung Hsu, Yu-Ching Lin, Yu-Chiao Shih, Hou-Chieh Cheng
  • Patent number: 11426793
    Abstract: A method is provided to fabricate a high-power module. A non-touching needle is used to paste a slurry on a heat-dissipation substrate. The slurry comprises nano-silver particles and micron silver particles. The ratio of the two silver particles is 9:1˜1:1. The slurry is pasted on the substrate to be heated up to a temperature kept holding. An integrated chip (IC) is put above the substrate to form a combined piece. A hot presser processes thermocompression to the combined piece to form a thermal-interface-material (TIM) layer with the IC and the substrate. After heat treatment, the TIM contains more than 99 percent of pure silver with only a small amount of organic matter. No volatile organic compounds would be generated after a long term of use. No intermetallic compounds would be generated while the stability under high temperature is obtained. Consequently, embrittlement owing to procedure temperature is dismissed.
    Type: Grant
    Filed: December 3, 2018
    Date of Patent: August 30, 2022
    Assignee: National Cheng Kung University
    Inventors: In-Gann Chen, Hung-Cheng Chen, Chia-Ming Yang, Steve Lien-Chung Hsu, Chang-Shu Kuo
  • Publication number: 20220204698
    Abstract: The present invention provides a polyimide comprising a structural unit, which comprises a first structural unit represented by formula (1) and a second structural unit represented by formula (2), wherein A, D and E are defined herein. A polyimide film formed by the polyimide has a low linear thermal expansion coefficient.
    Type: Application
    Filed: August 17, 2021
    Publication date: June 30, 2022
    Applicant: MICROCOSM TECHNOLOGY CO., LTD.
    Inventors: Steve Lien-chung Hsu, Chun-Heng Chen, Bo-Hung Lai, Yu-Chiao Shih
  • Patent number: 11331723
    Abstract: A light metal joint filler is provided. The light metal joint filler is formed by uniformly mixing a solvent with a light metal powder and a silver powder, where a powder particle size of the light metal powder is on a micron scale, and a powder particle size of the silver powder is on a nanometer scale or a submicron scale. A metal joining method of the present disclosure includes: coating a joint of two to-be-joined light metal pieces with the light metal joint filler; and hot pressing the two to-be-joined light metal pieces, so that the silver powder is sintered and bonded with the light metal powder and surfaces of the two to-be-joined light metal pieces, and completing joining of the two to-be-joined light metal pieces after the silver powder is condensed.
    Type: Grant
    Filed: April 25, 2018
    Date of Patent: May 17, 2022
    Assignee: METAL INDUSTRIES RESEARCH & DEVELOPMENT CENTRE
    Inventors: Hung-Tao Chen, Chang-Shu Kuo, In-Gann Chen, Steve Lien-Chung Hsu, Chi-Wah Keong
  • Publication number: 20200171578
    Abstract: A method is provided to fabricate a high-power module. A non-touching needle is used to paste a slurry on a heat-dissipation substrate. The slurry comprises nano-silver particles and micron silver particles. The ratio of the two silver particles is 9:1˜1:1. The slurry is pasted on the substrate to be heated up to a temperature kept holding. An integrated chip (IC) is put above the substrate to form a combined piece. A hot presser processes thermocompression to the combined piece to form a thermal-interface-material (TIM) layer with the IC and the substrate. After heat treatment, the TIM contains more than 99 percent of pure silver with only a small amount of organic matter. No volatile organic compounds would be generated after a long term of use. No intermetallic compounds would be generated while the stability under high temperature is obtained. Consequently, embrittlement owing to procedure temperature is dismissed.
    Type: Application
    Filed: December 3, 2018
    Publication date: June 4, 2020
    Inventors: In-Gann Chen, Hung-Cheng Chen, Chia-Ming Yang, Steve Lien-Chung Hsu, Chang-Shu Kuo
  • Publication number: 20190134714
    Abstract: A light metal joint filler is provided. The light metal joint filler is formed by uniformly mixing a solvent with a light metal powder and a silver powder, where a powder particle size of the light metal powder is on a micron scale, and a powder particle size of the silver powder is on a nanometer scale or a submicron scale. A metal joining method of the present disclosure includes: coating a joint of two to-be-joined light metal pieces with the light metal joint filler; and hot pressing the two to-be-joined light metal pieces, so that the silver powder is sintered and bonded with the light metal powder and surfaces of the two to-be-joined light metal pieces, and completing joining of the two to-be-joined light metal pieces after the silver powder is condensed.
    Type: Application
    Filed: April 25, 2018
    Publication date: May 9, 2019
    Inventors: Hung-Tao CHEN, Chang-Shu KUO, In-Gann CHEN, Steve Lien-Chung HSU, Chi-Wah KEONG
  • Patent number: 9902862
    Abstract: A method is provided to make a nano-silver paste. An organic acid is used as a protective agent. Silver nitrate is used as a source of silver ions to reduce silver nanoparticles on a surface protected by the organic acid. The particle size of the silver nanoparticle is 45 nanometers. In the other hand, a silver precursor of organic metal is synthesized. The organic metal is cracked at 200 celsius degrees (° C.) to fill pores left during sintering. After mixing the silver nanoparticle, the silver precursor and the solvent, the nano-silver paste is obtained. After being heated at 250° C. for 30 minutes, the nano-silver paste has a resistance of (3.09±0.61)×10?5 ?·cm. By being heated at 250° C. and applied with a pressure of 10 MPa to be hot-pressed for 30 minutes for joining copper to copper, the nano-silver paste obtains a bonding strength reaching 36 MPa.
    Type: Grant
    Filed: July 6, 2016
    Date of Patent: February 27, 2018
    Assignee: NATIONAL CHENG KUNG UNIVERSITY
    Inventors: Steve Lien-Chung Hsu, Yen-Ting Chen, In-Gann Chen
  • Publication number: 20180009998
    Abstract: A method is provided to make a nano-silver paste. An organic acid is used as a protective agent. Silver nitrate is used as a source of silver ions to reduce silver nanoparticles on a surface protected by the organic acid. The particle size of the silver nanoparticle is 45 nanometers. In the other hand, a silver precursor of organic metal is synthesized. The organic metal is cracked at 200 celsius degrees (° C.) to fill pores left during sintering. After mixing the silver nanoparticle, the silver precursor and the solvent, the nano-silver paste is obtained. After being heated at 250° C. for 30 minutes, the nano-silver paste has a resistance of (3.09±0.61)×10?5 ?·cm. By being heated at 250° C. and applied with a pressure of 10 MPa to be hot-pressed for 30 minutes for joining copper to copper, the nano-silver paste obtains a bonding strength reaching 36 MPa.
    Type: Application
    Filed: July 6, 2016
    Publication date: January 11, 2018
    Inventors: Steve Lien-Chung Hsu, Yen-Ting Chen, In-Gann Chen
  • Patent number: 9705146
    Abstract: A method is provided to fabricate an electrolyte membrane. The membrane has an asymmetric structure and is a polybenzimidazole membrane doped with phosphoric acid. The asymmetric structure comprises a dense layer and a porous layer. The content of phosphoric acid introduced into the polybenzimidazole membrane reaches 20 phosphoric acid molecules per polymer repeating unit. The proton conductivity of the polybenzimidazole membrane reaches 5×10?2 siemens per centimeter (S/cm). An electrode made with the polybenzimidazole membrane can be smoothly operated in a proton exchange membrane fuel cell.
    Type: Grant
    Filed: December 29, 2014
    Date of Patent: July 11, 2017
    Assignee: NATIONAL CHENG KUNG UNIVERSITY
    Inventors: Steve Lien-Chung Hsu, Li-cheng Jheng
  • Publication number: 20160190625
    Abstract: A method is provided to fabricate an electrolyte membrane. The membrane has an asymmetric structure and is a polybenzimidazole membrane doped with phosphoric acid. The asymmetric structure comprises a dense layer and a porous layer. The content of phosphoric acid introduced into the polybenzimidazole membrane reaches 20 phosphoric acid molecules per polymer repeating unit. The proton conductivity of the polybenzimidazole membrane reaches 5×10?2 siemens per centimeter (S/cm). An electrode made with the polybenzimidazole membrane can be smoothly operated in a proton exchange membrane fuel cell.
    Type: Application
    Filed: December 29, 2014
    Publication date: June 30, 2016
    Inventors: Steve Lien-Chung Hsu, Li-cheng Jheng
  • Publication number: 20100009185
    Abstract: An enameled wire containing a nano-filler includes a metallic wire and at least one layer of insulating coating. At least one layer of the at least one layer of insulating coating includes a nano-filler. The nano-filler is a modified silicon dioxide slurry comprising silicon dioxide, organic solvent and organic silane coupling agent. The nano-filler comprises silicon dioxide modified with an organic silane coupling agent to improve dispersion of the nano-filler and maintain properties of the insulating coating. In addition, material and manufacturing costs of the enameled wire can be lowered.
    Type: Application
    Filed: July 14, 2008
    Publication date: January 14, 2010
    Inventors: Tsang-Tse Fang, Steve Lien-Chung Hsu, Hsing-I Hsiang, Han-Yang Chung, Ting-I Lu, Chih-Wei Hsu, Chun-Hung Chen, Jung-Kun Chiu, Shang-Hui Shen
  • Publication number: 20090136441
    Abstract: A nano-scaled antifouling paint for boat is fabricated. A few hydrophobic nano-particles are added into the paint to obtain a nanostructure and a low surface energy. Thus, sea creatures are hard to adhere on the boat or are easily removed. Moreover, owing to a low wettability of the paint, a water drag is reduced when the boat sails, and so fuel is saved.
    Type: Application
    Filed: September 5, 2007
    Publication date: May 28, 2009
    Applicant: Fisheries Agency, Council of Agriculture, Executive Yuan
    Inventors: Steve Lien-Chung Hsu, Tsang-Tse Fang, Hsing-I Hsiang, Ming-Chung Fang
  • Patent number: 7081491
    Abstract: A method for fabricating a polybenzoxazole/clay nanocomposite material includes performing an ion exchange reaction between an organic amine and Na+-montmorillonite to form a swelled organoclay. A polycondensation reaction is conducted between two types of monomers, isophthaloyl chloride and 2,2-bis (3-amino-4-hydroxyphenyl) hexafluoropropane to form a polybenzoxaxole precursor polyhydroxyamide to form a PBO/clay composite material.
    Type: Grant
    Filed: December 9, 2002
    Date of Patent: July 25, 2006
    Assignee: National Cheng-Kung University
    Inventors: Steve Lien-Chung Hsu, Keng-Chuan Chang
  • Patent number: 7056641
    Abstract: A positive photosensitive resin composition of at least one uncapped polybenzoxazole precursor polymer, at least one capped polybenzoxazole precursor polymer, at least one photosensitive agent and at least one solvent, use of such compositions to pattern an image on a substrate and the resulting relied patterned substrates and electronic parts therefrom.
    Type: Grant
    Filed: July 8, 2005
    Date of Patent: June 6, 2006
    Assignee: Arch Specialty Chemicals, Inc.
    Inventors: Ahmad A. Naiini, William D. Weber, Pamela D. Waterson, Steve Lien-Chung Hsu
  • Patent number: 6939659
    Abstract: A positive photosensitive resin composition of at least one uncapped polybenzoxazole precursor polymer, at least one capped polybenzoxazole precursor polymer, at least one photosensitive agent and at least one solvent, use of such compositions to pattern an image on a substrate and the resulting relied patterned substrates and electronic parts therefrom.
    Type: Grant
    Filed: March 4, 2004
    Date of Patent: September 6, 2005
    Assignee: Arch Specialty Chemicals, Inc.
    Inventors: Ahmad A. Naiini, William D. Weber, Pamela D. Waterson, Steve Lien-Chung Hsu
  • Publication number: 20040229167
    Abstract: A positive photosensitive resin composition of at least one uncapped polybenzoxazole precursor polymer, at least one capped polybenzoxazole precursor polymer, at least one photosensitive agent and at least one solvent, use of such compositions to pattern an image on a substrate and the resulting relied patterned substrates and electronic parts therefrom.
    Type: Application
    Filed: March 4, 2004
    Publication date: November 18, 2004
    Applicant: ARCH SPECIALTY CHEMICALS, INC.
    Inventors: Ahmad A. Naiini, William D. Weber, Pamela D. Waterson, Steve Lien-Chung Hsu
  • Publication number: 20040126693
    Abstract: A positive photosensitive composition and method of pattern formation using the same. The composition comprises a precursor of poly(imide-benzoxazole) (PIBO) copolymer prepared by the reaction of trimellitic anhydride halide monomer with bis(o-diaminophenol) monomer; a photosensitizer; and a solvent.
    Type: Application
    Filed: July 23, 2003
    Publication date: July 1, 2004
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE.
    Inventors: Shih-Fan Wang, Shing-Tza Liou, Shih-Jung Tsai, Steve Lien-Chung Hsu, Po-I Lee
  • Patent number: 6670090
    Abstract: The present invention relates to a positive-working photosensitive composition comprising a partially diazonaphthoquinone (DNQ) capped polyamic ester with a capping level of about 5-80 molar %; a photosensitive agent and a solvent. The composition shows a high photosensitivity and leaves a relief pattern with high resolution and low dark film loss.
    Type: Grant
    Filed: September 3, 2002
    Date of Patent: December 30, 2003
    Assignee: Industrial Technology Research Institute
    Inventors: Steve Lien-Chung Hsu, Jinn-Shing King, Po-I Lee, Jhy-Long Jeng
  • Publication number: 20030139513
    Abstract: A method for fabricating a polybenzoxazole/clay nanocomposite material includes performing an ion exchange reaction between an organic amine and Na+-montmorillonite to form a swelled organoclay. A polycondensation reaction is conducted between two types of monomers, isophthaloyl chloride and 2,2-bis (3-amino-4-hydroxyphenyl) hexafluoropropane to form a polybenzoxaxole precursor polyhydroxyamide to form a PBO/clay composite material.
    Type: Application
    Filed: December 9, 2002
    Publication date: July 24, 2003
    Inventors: Steve Lien-Chung Hsu, Keng-Chuan Chang
  • Patent number: 6548621
    Abstract: The invention provides a poly(imide-benzoxazole) (PIBO) copolymer prepared from a trimellitic anhydride halide monomer and a bis(o-diaminophenol) monomer. The PIBO copolymer is characterized by the following recurring unit: wherein X is —O—, —S—, —C(CF3)2—, —C(CH3)2—, —CO—, —CH2—, —SO2—, —SO—, or deleted; and n is an integer. The PIBO copolymers of this invention are particularly useful as dielectric layers in semiconductor devices because they possess hydroxyl groups which create better adhesion to semiconductor substrates.
    Type: Grant
    Filed: November 8, 2001
    Date of Patent: April 15, 2003
    Assignee: Industrial Technology Research Institute
    Inventors: Shih-Jung Tsai, Steve Lien-Chung Hsu, Yuan-Pin Huang