Patents by Inventor Steve M. Allen

Steve M. Allen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150014397
    Abstract: Methods for bonding a porous tantalum structure to a substrate are provided. The method includes placing a compressible or porous interlayer between a porous tantalum structure and a cobalt or cobalt-chromium substrate to form an assembly. The interlayer comprising a metal or metal alloy that has solid state solubility with both the substrate and the porous tantalum structure. Heat and pressure are applied to the assembly to achieve solid state diffusion between the substrate and the interlayer and the between the porous tantalum structure and the interlayer.
    Type: Application
    Filed: September 29, 2014
    Publication date: January 15, 2015
    Inventors: Gregory M. Hippensteel, Lawrence F. Peek, Jeffrey P. Anderson, Devendra Gorhe, Steve M. Allen, Clarence M. Panchison, David M. Miller, Joel G. Scrafton, Casey Harmon
  • Publication number: 20140069990
    Abstract: A method for bonding a porous tantalum structure to a substrate is provided. The method comprises providing a substrate comprising cobalt or a cobalt-chromium alloy; an interlayer consisting essentially of at least one of hafnium, manganese, niobium, palladium, zirconium, titanium, or alloys or combinations thereof; and a porous tantalum structure. Heat and pressure are applied to the substrate, the interlayer, and the porous tantalum structure to achieve solid-state diffusion between the substrate and the interlayer and between the interlayer and the porous tantalum structure.
    Type: Application
    Filed: November 13, 2013
    Publication date: March 13, 2014
    Applicant: Zimmer, Inc.
    Inventors: Gregory M. Hippensteel, Lawrence F. Peek, Jeffrey P. Anderson, Devendra Gorhe, Steve M. Allen
  • Patent number: 8608049
    Abstract: A method for bonding a porous tantalum structure to a substrate is provided. The method comprises providing a substrate comprising cobalt or a cobalt-chromium alloy; an interlayer consisting essentially of at least one of hafnium, manganese, niobium, palladium, zirconium, titanium, or alloys or combinations thereof; and a porous tantalum structure. Heat and pressure are applied to the substrate, the interlayer, and the porous tantalum structure to achieve solid-state diffusion between the substrate and the interlayer and between the interlayer and the porous tantalum structure.
    Type: Grant
    Filed: October 10, 2007
    Date of Patent: December 17, 2013
    Assignee: Zimmer, Inc.
    Inventors: Gregory M. Hippensteel, Lawrence F. Peek, Jeffrey P. Anderson, Devendra Gorhe, Steve M. Allen
  • Patent number: 8602290
    Abstract: A method for bonding a porous tantalum structure to a substrate is provided. The method comprises providing a substrate comprising cobalt or a cobalt-chromium alloy; an interlayer consisting essentially of at least one of hafnium, manganese, niobium, palladium, zirconium, titanium, or alloys or combinations thereof; and a porous tantalum structure. Heat and pressure are applied to the substrate, the interlayer, and the porous tantalum structure to achieve solid-state diffusion between the substrate and the interlayer and between the interlayer and the porous tantalum structure.
    Type: Grant
    Filed: April 22, 2011
    Date of Patent: December 10, 2013
    Assignee: Zimmer, Inc.
    Inventors: Gregory M. Hippensteel, Lawrence F. Peek, Jeffrey P. Anderson, Devendra Gorhe, Steve M. Allen, Joel G. Scrafton, Casey Harmon
  • Publication number: 20110233263
    Abstract: A method for bonding a porous tantalum structure to a substrate is provided. The method comprises providing a substrate comprising cobalt or a cobalt-chromium alloy; an interlayer consisting essentially of at least one of hafnium, manganese, niobium, palladium, zirconium, titanium, or alloys or combinations thereof; and a porous tantalum structure. Heat and pressure are applied to the substrate, the interlayer, and the porous tantalum structure to achieve solid-state diffusion between the substrate and the interlayer and between the interlayer and the porous tantalum structure.
    Type: Application
    Filed: April 22, 2011
    Publication date: September 29, 2011
    Applicant: ZIMMER, INC.
    Inventors: Gregory M. Hippensteel, Lawrence F. Peek, Jeffrey P. Anderson, Devendra Gorhe, Steve M. Allen, Joel G. Scrafton, Casey Harmon
  • Publication number: 20110230973
    Abstract: Methods for bonding a porous tantalum structure to a substrate are provided. The method includes placing a compressible or porous interlayer between a porous tantalum structure and a cobalt or cobalt-chromium substrate to form an assembly. The interlayer comprising a metal or metal alloy that has solid state solubility with both the substrate and the porous tantalum structure. Heat and pressure are applied to the assembly to achieve solid state diffusion between the substrate and the interlayer and the between the porous tantalum structure and the interlayer.
    Type: Application
    Filed: April 22, 2011
    Publication date: September 22, 2011
    Applicant: ZIMMER, INC.
    Inventors: Gregory M. Hippensteel, Lawrence F. Peek, Jeffrey P. Anderson, Devendra Gorhe, Steve M. Allen, Clarence M. Panchison, David M. Miller, Joel G. Scrafton, Casey Harmon
  • Publication number: 20090098310
    Abstract: A method for bonding a porous tantalum structure to a substrate is provided. The method comprises providing a substrate comprising cobalt or a cobalt-chromium alloy; an interlayer consisting essentially of at least one of hafnium, manganese, niobium, palladium, zirconium, titanium, or alloys or combinations thereof; and a porous tantalum structure. Heat and pressure are applied to the substrate, the interlayer, and the porous tantalum structure to achieve solid-state diffusion between the substrate and the interlayer and between the interlayer and the porous tantalum structure.
    Type: Application
    Filed: October 10, 2007
    Publication date: April 16, 2009
    Applicant: ZIMMER, INC.
    Inventors: Gregory M. Hippensteel, Lawrence F. Peek, Jeffrey P. Anderson, Devendra Gorhe, Steve M. Allen