Patents by Inventor Steve M. Mayer

Steve M. Mayer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for thermally coupling a heat dissipation device to a microelectronic device
    Patent number: 7506795
    Abstract: Apparatus and methods are provided for thermally coupling a heat dissipation device to a microelectronic device. A reflowable thermal interface material is applied between the back side of a microelectronic die and a heat dissipation device. Heat and pressure is conducted through the heat dissipation device to the interface material and producing thereby liquefaction followed by solidification of the interface material, the solidification occurring progressively from the center to the peripheral edge. A thermal compression bonding apparatus is provided comprising a bonding head adapted to apply heat and pressure to the heat dissipation device whereby providing the desired thermal profile to effect solidification of the interface material from the center outward.
    Type: Grant
    Filed: December 13, 2004
    Date of Patent: March 24, 2009
    Assignee: Intel Corporation
    Inventor: Steve M. Mayer
  • Apparatus for thermally coupling a heat dissipation device to a microelectronic device
    Patent number: 7185420
    Abstract: An apparatus is provided for thermally coupling a heat dissipation device to a microelectronic device. A thermal compression bonding apparatus is provided comprising a bonding head adapted to apply heat and pressure to the heat dissipation device to provide the desired thermal profile to effect solidification of the interface material from the center outward.
    Type: Grant
    Filed: June 7, 2002
    Date of Patent: March 6, 2007
    Assignee: Intel Corporation
    Inventor: Steve M. Mayer
  • Method and apparatus for thermally coupling a heat dissipation device to a microelectronic device
    Publication number: 20030226253
    Abstract: Apparatus and methods are provided for thermally coupling a heat dissipation device to a microelectronic device. A reflowable thermal interface material is applied between the back side of a microelectronic die and a heat dissipation device. Heat and pressure is conducted through the heat dissipation device to the interface material and producing thereby liquefaction followed by solidification of the interface material, the solidification occurring progressively from the center to the peripheral edge. A thermal compression bonding apparatus is provided comprising a bonding head adapted to apply heat and pressure to the heat dissipation device whereby providing the desired thermal profile to effect solidification of the interface material from the center outward.
    Type: Application
    Filed: June 7, 2002
    Publication date: December 11, 2003
    Inventor: Steve M. Mayer