Abstract: In one embodiment, a method for making an optical micro device package includes: providing a substrate wafer having a plurality of solid state light sensors integrate therein; providing a transparent cover wafer coated with a material that alters the transparency characteristics of the cover wafer; forming a layer of light sensitive, photo definable adhesive material on the substrate wafer; selectively removing part of the layer of adhesive material in a pattern for a plurality of adhesive spacers between the substrate wafer and the cover wafer with each spacer surrounding a corresponding one of the light sensors; bonding the substrate wafer and the cover wafer together at the spacers to form a wafer assembly in which each spacer surrounds and seals a corresponding one of the light sensors within a cavity bounded by a spacer and the two wafers; and singulating individual device packages from the wafer assembly.

Abstract: One embodiment of a display system includes a first array that defines multiple reflective devices each movable between an inactive position to reflect light to a light dump and an active position to reflect light to an imaging region, a second array that defines multiple reflective devices each movable between an inactive position to reflect light to the light dump and an active position to reflect light to the imaging region, and an activation device that projects an activation beam to the devices to move individual ones of the devices between the active position and the inactive position, wherein the first array, the second array and the activation device are housed within a single vacuum enclosure.

Abstract: A light modulator array includes a plurality of light modulator devices, each the light modulator device including a resistor, a conductor coupled to a first end of the resistor, a post coupled to a second end of the resistor, and a reflective plate supported by the post, an insulator separating a first of the modulator devices from an adjacent light modulator device, and an energy penetration reducer configured to prevent the insulator from becoming conductive in a region between a resistor of the first light modulator device and a conductor of the adjacent device.

Abstract: An electron beam actuated light modulator, including an actuatable mirror element carried by a pedestal and hinge portion, having an electrostatically more neutral first position and an electrostatically more charged second position, the mirror being actuatable in a first direction from the first position to the second position by charge accumulation, and is actuatable in a second direction from the second position to the first position by dissipation of the charge accumulation and a stop element positioned adjacent the mirror element in the first position, configured to limit movement of the mirror element in the second direction after the mirror reaches the first position traveling in the second direction.

Abstract: A light modulator device includes a charge plate; a reflective plate and post, the post supporting the reflective plate parallel relative to the charge plate such that a gap is formed between the charge plate and the reflective plate, the gap being relatively smaller on a first side than on a second side when the reflective plate is parallel to the charge plate.

Abstract: An apparatus of one embodiment of the invention is disclosed that includes a number of micro-electromechanical (MEM) devices, a charge source, and at least one discharge path. Each MEM device has a plurality of different states based on a charge induced thereon. The charge source is to induce the charge thereon such that the MEM devices each enter one of the states. The at least one discharge path is for the plurality of MEM devices, and along which the charge induced thereon is dischargeable.