Abstract: An electronic package that is tested before the leads of the package are cut and bent into a final shape. The electronic package has a plurality of leads that extend from an outer housing of the package. The package is typically rectangular in shape and has a group of leads extending from each side of the housing. Extending along each group of leads is a strip of dielectric material that is spaced an offset distance from the side of the housing. The package is tested by placing a plurality of corresponding test pins into contact with the leads over their final cut and formed length in an area between the housing and the dielectric strip. The area of contact corresponds to the ends of the final assembled leads, so that the actual impedance of the leads over their final cut and formed length are tested. The dielectric strip provides structural support for the leads during the handling and testing of the package.

Abstract: A method for packaging integrated circuits for surface mount which provides advantages over prior art techniques by providing increased strength to integrated circuit package leads for increased lead dimensional stability to accommodate the finer pitches needed for high density integrated circuits, i.e., with leadcounts of 200 or more leads. The method is for producing a plastic integrated circuit package that allows for transfer molding using a non-conductive, permanent dambar. The invention includes the resulting leadframe. The method produces a package having embedded leads (on both sides and in between) in a double sided film/adhesive combination which increases lead dimensional stability and which does not require removal before device mounting. The double sided film/adhesive combination is non-conductive, is able to withstand all the package assembly process steps and is applied before a die is dedicated to a leadframe.