Patents by Inventor STEVE Q. CAI

STEVE Q. CAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-functional structure for thermal management and prevention of failure propagation
    Patent number: 11569537
    Abstract: A system for thermal management and structural containment includes a first battery cell having first and second terminal ends, and a first capillary void matrix disposed about an outer casing of the first battery cell.
    Type: Grant
    Filed: August 26, 2016
    Date of Patent: January 31, 2023
    Assignee: TELEDYNE SCIENTIFIC & IMAGING, LLC
    Inventors: Avijit Bhunia, Steve Q. Cai, Olivier Sudre, Kyle D. Gould
  • Multi-functional structure for thermal management and prevention of failure propagation
    Patent number: 11482744
    Abstract: A system for thermal management and structural containment includes a first battery cell having first and second terminal ends, and a first capillary void matrix formed in an outer casing of the first battery cell.
    Type: Grant
    Filed: August 26, 2016
    Date of Patent: October 25, 2022
    Assignee: Teledyne Scientific & Imaging, LLC
    Inventors: Avijit Bhunia, Steve Q. Cai, Olivier Sudre, Kyle D. Gould
  • Interface-free thermal management system for high power devices co-fabricated with electronic circuit
    Patent number: 11022383
    Abstract: A thermal-interface-material (TIM)-free thermal management apparatus includes a thermally-conductive unitary structure having an integrated circuit (IC) side and cooling system side, the thermally-conductive unitary structure including a plurality of high aspect ratio micro-pillars or porous structures extending from the IC side and a cooling system extending from the cooling system side. The cooling system may be selected from the group consisting of: a vapor chamber, micro-channel cooler, jet-impingement chamber, and air-cooled heat sink. The cooling system and the plurality of high aspect ratio micro-pillars form part of the same homogenous and thermally-conductive unitary structure.
    Type: Grant
    Filed: June 16, 2016
    Date of Patent: June 1, 2021
    Assignee: TELEDYNE SCIENTIFIC & IMAGING, LLC
    Inventors: Steve Q. Cai, Avijit Bhunia, Tadej Semenic
  • Interface-free thermal management system for high power devices co-fabricated with electronic circuit
    Patent number: 11015879
    Abstract: A thermal-interface-material (TIM)-free thermal management apparatus includes a thermally-conductive unitary structure having an integrated circuit (IC) side and cooling system side, the thermally-conductive unitary structure including a plurality of high aspect ratio micro-pillars or porous structures extending from the IC side and a cooling system extending from the cooling system side. The cooling system may be selected from the group consisting of: a vapor chamber, micro-channel cooler, jet-impingement chamber, and air-cooled heat sink. The cooling system and the plurality of high aspect ratio micro-pillars form part of the same homogenous and thermally-conductive unitary structure.
    Type: Grant
    Filed: November 19, 2018
    Date of Patent: May 25, 2021
    Assignee: TELEDYNE SCIENTIFIC & IMAGING, LLC
    Inventors: Steve Q. Cai, Avijit Bhunia, Tadej Semenic
  • Interface-Free Thermal Management System for High Power Devices Co-Fabricated with Electronic Circuit
    Publication number: 20190086162
    Abstract: A thermal-interface-material (TIM)-free thermal management apparatus includes a thermally-conductive unitary structure having an integrated circuit (IC) side and cooling system side, the thermally-conductive unitary structure including a plurality of high aspect ratio micro-pillars or porous structures extending from the IC side and a cooling system extending from the cooling system side. The cooling system may be selected from the group consisting of: a vapor chamber, micro-channel cooler, jet-impingement chamber, and air-cooled heat sink. The cooling system and the plurality of high aspect ratio micro-pillars form part of the same homogenous and thermally-conductive unitary structure.
    Type: Application
    Filed: November 19, 2018
    Publication date: March 21, 2019
    Inventors: Steve Q. Cai, Avijit Bhunia, Tadej Semenic
  • Interface-Free Thermal Management System for High Power Devices Co-Fabricated with Electronic Circuit
    Publication number: 20170363373
    Abstract: A thermal-interface-material (TIM)-free thermal management apparatus includes a thermally-conductive unitary structure having an integrated circuit (IC) side and cooling system side, the thermally-conductive unitary structure including a plurality of high aspect ratio micro-pillars or porous structures extending from the IC side and a cooling system extending from the cooling system side. The cooling system may be selected from the group consisting of: a vapor chamber, micro-channel cooler, jet-impingement chamber, and air-cooled heat sink. The cooling system and the plurality of high aspect ratio micro-pillars form part of the same homogenous and thermally-conductive unitary structure.
    Type: Application
    Filed: June 16, 2016
    Publication date: December 21, 2017
    Inventors: Steve Q. Cai, Avijit Bhunia, Tadej Semenic
  • Multi-Functional Structure for Thermal Management and Prevention of Failure Propagation
    Publication number: 20170047625
    Abstract: A system for thermal management and structural containment includes a first battery cell having first and second terminal ends, and a first capillary void matrix formed in an outer casing of the first battery cell.
    Type: Application
    Filed: August 26, 2016
    Publication date: February 16, 2017
    Inventors: AVIJIT BHUNIA, STEVE Q. CAI, Olivier SUDRE, KYLE D. GOULD
  • Multi-Functional Structure for Thermal Management and Prevention of Failure Propagation
    Publication number: 20170040654
    Abstract: A system for thermal management and structural containment includes a first battery cell having first and second terminal ends, and a first capillary void matrix disposed about an outer casing of the first battery cell.
    Type: Application
    Filed: August 26, 2016
    Publication date: February 9, 2017
    Inventors: AVIJIT BHUNIA, STEVE Q. CAI, Olivier SUDRE, KYLE D. GOULD