Abstract: An airflow duct can be arranged at least in part in a zone alongside an electronics board mounted to a motherboard. The airflow duct can include an inlet end arranged to receive airflow into the airflow duct. A closed end wall can be arranged opposite the inlet end. A set of walls may extend from the inlet end to the closed end wall and include a top wall, a bottom wall, a first lateral side wall, and a second lateral side wall. Orifices can be included in the set of walls and can be arranged to direct airflow from within the airflow duct toward heat-producing components borne by the electronics board.

Abstract: A computer system includes a mist cooling system. The mist cooling system suspended droplets of dielectric fluid in air to form a mist and conveys the mist to heat producing components of the computer system. The liquid droplets of the mist wet the heat producing components and remove waste heat as part of a phase change from a liquid phase to a vapor phase. Vaporized dielectric fluid is condensed via a heat exchanger in a chassis of the computer system and is returned to a reservoir for use in generating mist.

Abstract: An electronic system includes a chassis, a liquid coolant supply line assembly, a first electronic subassembly, a second electronic subassembly, and a liquid coolant return line assembly. The liquid coolant supply line assembly includes a coolant supply line configured to receive and convey liquid coolant. The first electronic subassembly includes a first electronic component and a first cooling loop to transfer heat from the first electronic component into the liquid coolant. The second electronic subassembly includes a second electronic component and a second cooling loop to transfer heat from the second electronic component into the liquid coolant The liquid coolant return line assembly includes a coolant return line to receive liquid coolant from the first and second cooling loops.

Abstract: A system and method is disclosed for fabricating a heat spreader system, including providing a plurality of bottom microporous wicks recessed in a bottom substrate, bonding a center substrate to the bottom substrate, and bonding a top substrate having a top chamber portion to the center substrate to establish a first vapor chamber with said plurality of bottom microporous wicks.

Abstract: An osmotic transport apparatus includes a heat conducting chamber having an inner wall, a heat absorption end and a heat dissipation end, an osmotic membrane extending substantially longitudinally along an inner wall of the heat conducting chamber from the heat absorption end to the heat dissipation end, a liquid salt solution disposed in the osmotic membrane, and an inner vapor cavity so that when heat is applied to the heat absorption end, vapor is expelled from the osmotic membrane at the heat absorption end, is condensed on the osmotic membrane at the heat dissipation end, and is drawn into the osmotic membrane at the heat dissipation end for passive pumping transport back to the heat absorption end as more condensate is drawn through the osmotic membrane.

Abstract: An osmotic transport apparatus includes a heat conducting chamber having an inner wall, a heat absorption end and a heat dissipation end, an osmotic membrane extending substantially longitudinally along an inner wall of the heat conducting chamber from the heat absorption end to the heat dissipation end, a liquid salt solution disposed in the osmotic membrane, and an inner vapor cavity so that when heat is applied to the heat absorption end, vapor is expelled from the osmotic membrane at the heat absorption end, is condensed on the osmotic membrane at the heat dissipation end, and is drawn into the osmotic membrane at the heat dissipation end for passive pumping transport back to the heat absorption end as more condensate is drawn through the osmotic membrane.

Abstract: A system and method is disclosed for fabricating a heat spreader system, including providing a plurality of bottom microporous wicks recessed in a bottom substrate, bonding a center substrate to the bottom substrate, and bonding a top substrate having a top chamber portion to the center substrate to establish a first vapor chamber with said plurality of bottom microporous wicks.

Abstract: A system and method is disclosed for fabricating a heat spreader system, including providing a plurality of bottom microporous wicks recessed in a bottom substrate, bonding a center substrate to the bottom substrate, and bonding a top substrate having a top chamber portion to the center substrate to establish a first vapor chamber with said plurality of bottom microporous wicks.