Patents by Inventor Steve S.A. WAN

Steve S.A. WAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit package element and load board thereof
    Patent number: 10790223
    Abstract: An integrated circuit package element provided includes a chip element and a package module coupled to the chip element. The chip element includes two driving units that are electrically connected to each other. The package module includes a grounding area, two individual power distributed networks and a grounded shielding structure which is completely disposed between the individual power distributed networks, electrically connected to the chip element, and configured to block power noise coupling between the first electric power distribution network and the second electric power distribution network. The grounding area is electrically connected to the individual electric power distribution networks and the grounded shielding structure.
    Type: Grant
    Filed: April 29, 2019
    Date of Patent: September 29, 2020
    Assignees: GLOBAL UNICHIP CORPORATION, TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Sheng-Fan Yang, Yuan-Hung Lin, Yu-Cheng Sun, Steve S. A. Wan
  • INTEGRATED CIRCUIT PACKAGE ELEMENT AND LOAD BOARD THEREOF
    Publication number: 20200185313
    Abstract: An integrated circuit package element provided includes a chip element and a package module coupled to the chip element. The chip element includes two driving units that are electrically connected to each other. The package module includes a grounding area, two individual power distributed networks and a grounded shielding structure which is completely disposed between the individual power distributed networks, electrically connected to the chip element, and configured to block power noise coupling between the first electric power distribution network and the second electric power distribution network. The grounding area is electrically connected to the individual electric power distribution networks and the grounded shielding structure.
    Type: Application
    Filed: April 29, 2019
    Publication date: June 11, 2020
    Inventors: Sheng-Fan YANG, Yuan-Hung LIN, Yu-Cheng SUN, Steve S.A. WAN