Patents by Inventor Steve Shi Lin

Steve Shi Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of encapsulating an environmentally sensitive device
    Patent number: 10950821
    Abstract: Methods of encapsulating an environmentally sensitive device. The methods involve temporarily laminating a flexible substrate to a rigid support using a reversible adhesive for processing, reversing the reversible adhesive, and removing the device from the rigid support.
    Type: Grant
    Filed: December 17, 2019
    Date of Patent: March 16, 2021
    Assignee: Samsung Display Co., Ltd.
    Inventors: Xi Chu, Steve Shi Lin, Gordon L. Graff
  • METHOD OF ENCAPSULATING AN ENVIRONMENTALLY SENSITIVE DEVICE
    Publication number: 20200119309
    Abstract: Methods of encapsulating an environmentally sensitive device. The methods involve temporarily laminating a flexible substrate to a rigid support using a reversible adhesive for processing, reversing the reversible adhesive, and removing the device from the rigid support.
    Type: Application
    Filed: December 17, 2019
    Publication date: April 16, 2020
    Inventors: Xi Chu, Steve Shi Lin, Gordon L. Graff
  • METHOD OF ENCAPSULATING AN ENVIRONMENTALLY SENSITIVE DEVICE
    Publication number: 20150191000
    Abstract: Methods of encapsulating an environmentally sensitive device. The methods involve temporarily laminating a flexible substrate to a rigid support using a reversible adhesive for processing, reversing the reversible adhesive, and removing the device from the rigid support.
    Type: Application
    Filed: March 26, 2015
    Publication date: July 9, 2015
    Inventors: Xi Chu, Steve Shi Lin, Gordon L. Graff
  • METHOD OF ENCAPSULATING AN ENVIRONMENTALLY SENSITIVE DEVICE
    Publication number: 20100330748
    Abstract: Methods of encapsulating an environmentally sensitive device. The methods involve temporarily laminating a flexible substrate to a rigid support using a reversible adhesive for processing, reversing the reversible adhesive, and removing the device from the rigid support.
    Type: Application
    Filed: January 26, 2007
    Publication date: December 30, 2010
    Inventors: Xi Chu, Steve Shi Lin, Gordon L. Graff