Patents by Inventor Steve Swaringen
Steve Swaringen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8526473Abstract: Processing workpieces such as semiconductor wafers or other materials with a laser includes selecting a target to process that corresponds to a target class associated with a predefined temporal pulse profile. The temporal pulse profile includes a first portion that defines a first time duration, and a second portion that defines a second time duration. A method includes generating a laser pulse based on laser system input parameters configured to shape the laser pulse according to the temporal pulse profile, detecting the generated laser pulse, comparing the generated laser pulse to the temporal pulse profile, and adjusting the laser system input parameters based on the comparison.Type: GrantFiled: March 31, 2008Date of Patent: September 3, 2013Assignee: Electro Scientific IndustriesInventors: Brian W. Baird, Clint R. Vandergiessen, Steve Swaringen, Robert Hainsey, Yunlong Sun, Kelly J. Bruland, Andrew Hooper
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Patent number: 8358671Abstract: Processing a workpiece with a laser includes generating laser pulses at a first pulse repetition frequency. The first pulse repetition frequency provides reference timing for coordination of a beam positioning system and one or more cooperating beam position compensation elements to align beam delivery coordinates relative to the workpiece. The method also includes, at a second pulse repetition frequency that is lower than the first pulse repetition frequency, selectively amplifying a subset of the laser pulses. The selection of the laser pulses included in the subset is based on the first pulse repetition frequency and position data received from the beam positioning system. The method further includes adjusting the beam delivery coordinates using the one or more cooperating beam position compensation elements so as to direct the amplified laser pulses to selected targets on the workpiece.Type: GrantFiled: July 19, 2011Date of Patent: January 22, 2013Assignee: Electro Scientific Industries, Inc.Inventors: Brian W. Baird, Kelly J. Bruland, Clint R. Vandergiessen, Mark A. Unrath, Brady Nilsen, Steve Swaringen
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Publication number: 20110272388Abstract: Processing a workpiece with a laser includes generating laser pulses at a first pulse repetition frequency. The first pulse repetition frequency provides reference timing for coordination of a beam positioning system and one or more cooperating beam position compensation elements to align beam delivery coordinates relative to the workpiece. The method also includes, at a second pulse repetition frequency that is lower than the first pulse repetition frequency, selectively amplifying a subset of the laser pulses. The selection of the laser pulses included in the subset is based on the first pulse repetition frequency and position data received from the beam positioning system. The method further includes adjusting the beam delivery coordinates using the one or more cooperating beam position compensation elements so as to direct the amplified laser pulses to selected targets on the workpiece.Type: ApplicationFiled: July 19, 2011Publication date: November 10, 2011Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.Inventors: Brian W. Baird, Kelly J. Bruland, Clint R. Vandergiessen, Mark A. Unrath, Brady Nilsen, Steve Swaringen
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Patent number: 7982160Abstract: Processing a workpiece with a laser includes generating laser pulses at a first pulse repetition frequency. The first pulse repetition frequency provides reference timing for coordination of a beam positioning system and one or more cooperating beam position compensation elements to align beam delivery coordinates relative to the workpiece. The method also includes, at a second pulse repetition frequency that is lower than the first pulse repetition frequency, selectively amplifying a subset of the laser pulses. The selection of the laser pulses included in the subset is based on the first pulse repetition frequency and position data received from the beam positioning system. The method further includes adjusting the beam delivery coordinates using the one or more cooperating beam position compensation elements so as to direct the amplified laser pulses to selected targets on the workpiece.Type: GrantFiled: March 31, 2008Date of Patent: July 19, 2011Assignee: Electro Scientific Industries, Inc.Inventors: Brian W. Baird, Kelly J. Bruland, Clint Vandergiessen, Mark A. Unrath, Brady Nilsen, Steve Swaringen
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Patent number: 7608800Abstract: A method selectively processes structures on a workpiece with laser pulses. The structures are arranged in a linear pattern having approximately equal pitch. The pulses propagate along a laser beam propagation path terminating at a laser beam spot on the workpiece. The method fires a first processing pulse when the spot coincides with a first structure location, selectively blocks or clears the propagation path during the first pulse, moves the workpiece and the spot relative to one another such that the spot moves toward a second structure location at a speed less than the product of the laser's PRF and the pitch, fires a dummy pulse before the spot reaches the second structure location, blocks the propagation path during the dummy laser pulse, fires another processing pulse when the beam spot coincides with the second structure location, and selectively blocks or clears the propagation path during the second processing pulse.Type: GrantFiled: June 5, 2007Date of Patent: October 27, 2009Assignee: Electro Scientific Industries, Inc.Inventors: Kelly Bruland, Steve Swaringen, Steve Stone, Keith Grant
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Publication number: 20090245302Abstract: Processing workpieces such as semiconductor wafers or other materials with a laser includes selecting a target to process that corresponds to a target class associated with a predefined temporal pulse profile. The temporal pulse profile includes a first portion that defines a first time duration, and a second portion that defines a second time duration. A method includes generating a laser pulse based on laser system input parameters configured to shape the laser pulse according to the temporal pulse profile, detecting the generated laser pulse, comparing the generated laser pulse to the temporal pulse profile, and adjusting the laser system input parameters based on the comparison.Type: ApplicationFiled: March 31, 2008Publication date: October 1, 2009Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.Inventors: Brian W. Baird, Clint R. Vandergiessen, Steve Swaringen, Robert Hainsey, Yunlong Sun, Kelly J. Bruland, Andrew Hooper
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Publication number: 20090242531Abstract: Processing a workpiece with a laser includes generating laser pulses at a first pulse repetition frequency. The first pulse repetition frequency provides reference timing for coordination of a beam positioning system and one or more cooperating beam position compensation elements to align beam delivery coordinates relative to the workpiece. The method also includes, at a second pulse repetition frequency that is lower than the first pulse repetition frequency, selectively amplifying a subset of the laser pulses. The selection of the laser pulses included in the subset is based on the first pulse repetition frequency and position data received from the beam positioning system. The method further includes adjusting the beam delivery coordinates using the one or more cooperating beam position compensation elements so as to direct the amplified laser pulses to selected targets on the workpiece.Type: ApplicationFiled: March 31, 2008Publication date: October 1, 2009Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.Inventors: Brian W. Baird, Kelly J. Bruland, Clint R. Vandergiessen, Mark A. Unrath, Brady Nilsen, Steve Swaringen
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Publication number: 20070228024Abstract: A method selectively processes structures on a workpiece with laser pulses. The structures are arranged in a linear pattern having approximately equal pitch. The pulses propagate along a laser beam propagation path terminating at a laser beam spot on the workpiece. The method fires a first processing pulse when the spot coincides with a first structure location, selectively blocks or clears the propagation path during the first pulse, moves the workpiece and the spot relative to one another such that the spot moves toward a second structure location at a speed less than the product of the laser's PRF and the pitch, fires a dummy pulse before the spot reaches the second structure location, blocks the propagation path during the dummy laser pulse, fires another processing pulse when the beam spot coincides with the second structure location, and selectively blocks or clears the propagation path during the second processing pulse.Type: ApplicationFiled: June 5, 2007Publication date: October 4, 2007Inventors: Kelly Bruland, Steve Swaringen, Steve Stone, Keith Grant
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Patent number: 7227098Abstract: Methods and systems operate a machine having a laser characterized by a PRF (pulse repetition frequency) parameter that specifies a PRF at which pulses produced by the laser have desirable pulse properties for irradiating structures on or within a workpiece. The structures are arranged on the workpiece in a linear pattern having an approximately equal pitch between adjacent structures. The laser emits a laser pulse that propagates along a laser beam propagation path terminating at a laser beam spot on the workpiece. The method is effective to move the laser beam spot across the structures along the linear pattern at a speed greater than the product of the PRF and the pitch to selectively irradiate selected ones of the structures with the laser without substantially degrading the desirable pulse properties.Type: GrantFiled: August 31, 2004Date of Patent: June 5, 2007Assignee: Electro Scientific Industries, Inc.Inventors: Kelly Bruland, Steve Swaringen, Steve Stone, Keith Grant
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Publication number: 20060027540Abstract: A laser is characterized by a PRF (pulse repetition frequency) parameter that specifies a PRF at which pulses produced by the laser have desirable pulse properties for irradiating a target on or within a workpiece. The laser emits a laser pulse that propagates along a laser beam propagation path terminating at a laser beam spot on the workpiece. A method is effective to operate the laser at an effective PRF lower than the PRF parameter without substantially degrading the desirable pulse properties. The method receives data indicating the location on the workpiece of the target to be selectively irradiated with the laser pulse.Type: ApplicationFiled: August 31, 2004Publication date: February 9, 2006Inventors: Kelly Bruland, Steve Swaringen, Steve Stone, Keith Grant