Patents by Inventor Steve T. Nicholas

Steve T. Nicholas has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wiring board having an engineered metallization layer
    Patent number: 9173290
    Abstract: The present invention relates to a method of manufacturing a printed wiring board (PWB) of the type depicted in FIG. 1, and to the resulting PWB. Such a PWB comprises a first substrate and alternating layers of a second substrate and a metal layer. The layer 2 metallization of the PWB is a thick layer of a composite engineered metal material having a configurable coefficient of thermal expansion (CTE) to provide CTE matching with respect to radio frequency (RF) components mounted on the PWB, and having substantial heat dissipation properties to dissipate heat generated by the RF components. This composite metal layer also provides a ground plane for the RF components.
    Type: Grant
    Filed: July 18, 2012
    Date of Patent: October 27, 2015
    Assignee: LOCKHEED MARTIN CORPORATION
    Inventors: William S. McKinley, Steve T. Nicholas, Jeffery A. Dean
  • WIRING BOARD HAVING AN ENGINEERED METALLIZATION LAYER
    Publication number: 20130048346
    Abstract: The present invention relates to a method of manufacturing a printed wiring board (PWB) of the type depicted in FIG. 1, and to the resulting PWB. Such a PWB comprises a first substrate and alternating layers of a second substrate and a metal layer. The layer 2 metallization of the PWB is a thick layer of a composite engineered metal material having a configurable coefficient of thermal expansion (CTE) to provide CTE matching with respect to radio frequency (RF) components mounted on the PWB, and having substantial heat dissipation properties to dissipate heat generated by the RF components. This composite metal layer also provides a ground plane for the RF components.
    Type: Application
    Filed: July 18, 2012
    Publication date: February 28, 2013
    Inventors: William S. MCKINLEY, Steve T. Nicholas, Jeffery A. Dean
  • Method of making a wiring board having an engineered metallization layer
    Patent number: 8245390
    Abstract: The present invention relates to a method of manufacturing a printed wiring board (PWB) of the type depicted in FIG. 1. Such a PWB comprises a first substrate and alternating layers of a second substrate and a metal layer. The layer 2 metallization of the PWB is a thick layer of a composite engineered metal material having a configurable coefficient of thermal expansion (CTE) to provide CTE matching with respect to radio frequency (RF) components mounted on the PWB, and having substantial heat dissipation properties to dissipate heat generated by the RF components. This composite metal layer also provides a ground plane for the RF components.
    Type: Grant
    Filed: November 6, 2007
    Date of Patent: August 21, 2012
    Assignee: Lockheed Martin Corporation
    Inventors: William S. McKinley, Steve T. Nicholas, Jeffery A. Dean
  • Electronic curtain for vehicle protection
    Patent number: 8098191
    Abstract: An apparatus and method for protecting against incoming projectiles comprising transmitting two radar waveforms, the first waveform comprising a pulsed continuous wave waveform, and the second waveform comprising a pulsed linear chirp waveform over a bandwidth, and based on returned radar data, causing deployment of a defense mechanism to intercept a detected incoming projectile.
    Type: Grant
    Filed: November 5, 2008
    Date of Patent: January 17, 2012
    Assignee: Lockheed Martin Corporation
    Inventors: Albert N. Pergande, Lloyd Dan Griffin, Jr., Steven G. Gray, Hung Q. Le, Steve T. Nicholas
  • Method of making a Wiring Board having an Engineered Metallization Layer and Resultant Apparatus
    Publication number: 20090113705
    Abstract: The present invention relates to a method of manufacturing a printed wiring board (PWB) of the type depicted in FIG. 1, and to the resulting PWB. Such a PWB comprises a first substrate and alternating layers of a second substrate and a metal layer. The layer 2 metallization of the PWB is a thick layer of a composite engineered metal material having a configurable coefficient of thermal expansion (CTE) to provide CTE matching with respect to radio frequency (RF) components mounted on the PWB, and having substantial heat dissipation properties to dissipate heat generated by the RF components. This composite metal layer also provides a ground plane for the RF components.
    Type: Application
    Filed: November 6, 2007
    Publication date: May 7, 2009
    Inventors: William S. McKinley, Steve T. Nicholas, Jeffery A. Dean