Patents by Inventor Steve Thummel

Steve Thummel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods of forming circuit traces and contact pads for interposers utilized in semiconductor packages
    Patent number: 6913952
    Abstract: The invention encompasses methods of preparing interposers for utilization in semiconductor packages. The invention includes a method in which an interposer substrate having a surface and a conductive layer extending over the surface is provided. Pads are formed on the conductive layer by plating a conductive material on the conductive layer while using the conductive layer as an electrical connection to a power source and without utilizing conductive busses, other than the conductive layer. Subsequent to the formation of the pads, the conductive layer is patterned into circuit traces. Methodology of the present invention can be utilized for, for example, forming board-on-chip constructions.
    Type: Grant
    Filed: July 3, 2003
    Date of Patent: July 5, 2005
    Assignee: Micron Technology, Inc.
    Inventors: Stephen F. Moxham, Lee Teck Kheng, Steve Thummel
  • Methods of forming circuit traces and contact pads for interposers utilized in semiconductor packages
    Publication number: 20050003607
    Abstract: The invention encompasses methods of preparing interposers for utilization in semiconductor packages. The invention includes a method in which an interposer substrate having a surface and a conductive layer extending over the surface is provided. Pads are formed on the conductive layer by plating a conductive material on the conductive layer while using the conductive layer as an electrical connection to a power source and without utilizing conductive busses, other than the conductive layer. Subsequent to the formation of the pads, the conductive layer is patterned into circuit traces. Methodology of the present invention can be utilized for, for example, forming board-on-chip constructions.
    Type: Application
    Filed: July 3, 2003
    Publication date: January 6, 2005
    Inventors: Stephen Moxham, Lee Kheng, Steve Thummel